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Ieee Cpmt International Electronics Manufacturing Technology Symposium Iemt 2
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Book Synopsis Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium, October 2-4, 1995, Austin, TX, USA by : Walt Trybula
Download or read book Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium, October 2-4, 1995, Austin, TX, USA written by Walt Trybula and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1995 with total page 536 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis IEEE/CPMT International Electronic Manufacturing Technology Symposium : [proceedings]. by :
Download or read book IEEE/CPMT International Electronic Manufacturing Technology Symposium : [proceedings]. written by and published by . This book was released on 2003 with total page 470 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis IEEE/CPMT International Electronics Manufacturing Technology Symposium by :
Download or read book IEEE/CPMT International Electronics Manufacturing Technology Symposium written by and published by . This book was released on 2004 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Brazing and Soldering by : John J. Stephens
Download or read book Brazing and Soldering written by John J. Stephens and published by ASM International. This book was released on 2006-01-01 with total page 430 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Labs on Chip written by Eugenio Iannone and published by CRC Press. This book was released on 2018-09-03 with total page 1351 pages. Available in PDF, EPUB and Kindle. Book excerpt: Labs on Chip: Principles, Design and Technology provides a complete reference for the complex field of labs on chip in biotechnology. Merging three main areas— fluid dynamics, monolithic micro- and nanotechnology, and out-of-equilibrium biochemistry—this text integrates coverage of technology issues with strong theoretical explanations of design techniques. Analyzing each subject from basic principles to relevant applications, this book: Describes the biochemical elements required to work on labs on chip Discusses fabrication, microfluidic, and electronic and optical detection techniques Addresses planar technologies, polymer microfabrication, and process scalability to huge volumes Presents a global view of current lab-on-chip research and development Devotes an entire chapter to labs on chip for genetics Summarizing in one source the different technical competencies required, Labs on Chip: Principles, Design and Technology offers valuable guidance for the lab-on-chip design decision-making process, while exploring essential elements of labs on chip useful both to the professional who wants to approach a new field and to the specialist who wants to gain a broader perspective.
Book Synopsis 60th Conference on Glass Problems by : John Kieffer
Download or read book 60th Conference on Glass Problems written by John Kieffer and published by John Wiley & Sons. This book was released on 2009-09-28 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume is part of the Ceramic Engineering and Science Proceeding (CESP) series. This series contains a collection of papers dealing with issues in both traditional ceramics (i.e., glass, whitewares, refractories, and porcelain enamel) and advanced ceramics. Topics covered in the area of advanced ceramic include bioceramics, nanomaterials, composites, solid oxide fuel cells, mechanical properties and structural design, advanced ceramic coatings, ceramic armor, porous ceramics, and more.
Book Synopsis Die-Attach Materials for High Temperature Applications in Microelectronics Packaging by : Kim S. Siow
Download or read book Die-Attach Materials for High Temperature Applications in Microelectronics Packaging written by Kim S. Siow and published by Springer. This book was released on 2019-01-29 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
Book Synopsis Multi-Agent-Based Production Planning and Control by : Jie Zhang
Download or read book Multi-Agent-Based Production Planning and Control written by Jie Zhang and published by John Wiley & Sons. This book was released on 2017-05-09 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt: At the crossroads of artificial intelligence, manufacturing engineering, operational research and industrial engineering and management, multi-agent based production planning and control is an intelligent and industrially crucial technology with increasing importance. This book provides a complete overview of multi-agent based methods for today’s competitive manufacturing environment, including the Job Shop Manufacturing and Re-entrant Manufacturing processes. In addition to the basic control and scheduling systems, the author also highlights advance research in numerical optimization methods and wireless sensor networks and their impact on intelligent production planning and control system operation. Enables students, researchers and engineers to understand the fundamentals and theories of multi-agent based production planning and control Written by an author with more than 20 years’ experience in studying and formulating a complete theoretical system in production planning technologies Fully illustrated throughout, the methods for production planning, scheduling and controlling are presented using experiments, numerical simulations and theoretical analysis Comprehensive and concise, Multi-Agent Based Production Planning and Control is aimed at the practicing engineer and graduate student in industrial engineering, operational research, and mechanical engineering. It is also a handy guide for advanced students in artificial intelligence and computer engineering.
Book Synopsis CTI SYMPOSIUM 2018 by : EUROFORUM Deutschland GmbH
Download or read book CTI SYMPOSIUM 2018 written by EUROFORUM Deutschland GmbH and published by Springer Nature. This book was released on 2019-11-13 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt: Every year, the international transmission and drive community meets up at the International CTI SYMPOSIA – automotive drivetrains, intelligent, electrified – in Germany, China and USA to discuss the best strategies and technologies for tomorrow’s cars, busses and trucks. From efficiency, comfort or costs to electrification, energy storage and connectivity, these premier industry meetings cover all the key issues in depth.
Book Synopsis Interconnect Reliability in Advanced Memory Device Packaging by : Chong Leong, Gan
Download or read book Interconnect Reliability in Advanced Memory Device Packaging written by Chong Leong, Gan and published by Springer Nature. This book was released on 2023-05-30 with total page 223 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.
Book Synopsis Rapid Cure Composites by : Nishar Hameed
Download or read book Rapid Cure Composites written by Nishar Hameed and published by Elsevier. This book was released on 2023-05-17 with total page 301 pages. Available in PDF, EPUB and Kindle. Book excerpt: Rapid Cure Composites: Materials, Processing and Manufacturing presents up-to-date information on the design criteria to formulate matrix systems for rapid curing. Emphasis is placed on the role different materials [resin compound and fiber reinforcement] play in developing fast curing composites, assessment of current and novel manufacturing techniques for adapting fast curing processes, the comparison between conventional curing and rapid curing, and different applications in various industrial sectors [e.g., aerospace, automotive, renewables and marine]. The book will be an essential reference resource for academic and industrial researchers working in the field of composite materials, processing and manufacturing organizations, materials scientists, and more. Polymer composites are widely used in several industries, including aerospace, automobile, spray and coatings, and electronics due to their lightweight and superior mechanical properties. However, one of the dominant hurdles towards their growth in commercial industries is the long curing cycle and slow production. - Comprehensively addresses the scientific and technological development of rapid cured epoxy composites - Covers, in detail, the chemistry, processing, structure and performance of rapid cured epoxy composites - Provides detailed comparisons of how/why rapid cure composites are different to conventional composites - Discusses the challenges of the existing technology and future trends
Book Synopsis Handbook of Research on Embedded Systems Design by : Bagnato, Alessandra
Download or read book Handbook of Research on Embedded Systems Design written by Bagnato, Alessandra and published by IGI Global. This book was released on 2014-06-30 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt: As real-time and integrated systems become increasingly sophisticated, issues related to development life cycles, non-recurring engineering costs, and poor synergy between development teams will arise. The Handbook of Research on Embedded Systems Design provides insights from the computer science community on integrated systems research projects taking place in the European region. This premier references work takes a look at the diverse range of design principles covered by these projects, from specification at high abstraction levels using standards such as UML and related profiles to intermediate design phases. This work will be invaluable to designers of embedded software, academicians, students, practitioners, professionals, and researchers working in the computer science industry.
Book Synopsis MEMS-based Transdermal Drug Delivery by : Richa Mishra
Download or read book MEMS-based Transdermal Drug Delivery written by Richa Mishra and published by CRC Press. This book was released on 2023-12-11 with total page 243 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book introduces transdermal drug delivery and the developments that have taken place in various transdermal drug delivery techniques including the system-level design approach of a novel miniaturized medical device to offer precise and painless drug delivery via a skin-based transdermal route. It discusses the microelectromechanical systems (MEMS)-based fabrication technique and the design, fabrication and characterization of different MEMS-based components like microneedles and micropumps. It further includes a MEMS-based component micropump with design, analysis, fabrication and characterization of the transdermal drug delivery device and challenges encountered in the design improvements. Features: Summarizes transdermal drug delivery systems especially with a focus on MEMS and microneedles, including theoretical concepts Emphasizes system integration by describing simulation and design techniques as well as experimental fabrication Discusses system-level integration for miniaturized therapeutic devices Includes working simulation models covering microneedles and micropump analysis Explores future direction in development of pertinent devices. The book is aimed at researchers, professionals, and graduate students in biomedical engineering, microelectronics, micro-electro-mechanical-systems, and drug delivery.
Book Synopsis Design of 3D Integrated Circuits and Systems by : Rohit Sharma
Download or read book Design of 3D Integrated Circuits and Systems written by Rohit Sharma and published by CRC Press. This book was released on 2018-09-03 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.
Book Synopsis Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium by :
Download or read book Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium written by and published by . This book was released on 2000 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices by : Ephraim Suhir
Download or read book Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices written by Ephraim Suhir and published by CRC Press. This book was released on 2021-01-28 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt: Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devices Shows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical data Covers how to design the most effective test vehicles for testing solder joints Details how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnections Outlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such cases Illustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated tests This book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design.
Book Synopsis Advanced Flip Chip Packaging by : Ho-Ming Tong
Download or read book Advanced Flip Chip Packaging written by Ho-Ming Tong and published by Springer Science & Business Media. This book was released on 2013-03-20 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
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