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Author :
Publisher :
ISBN 13 :
Total Pages : 370 pages
Book Rating : 4.0/5 ( download)
Download or read book IEEE/CPMT International Electronics Manufacturing Technology Symposium written by and published by . This book was released on 2004 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 :
Total Pages : 520 pages
Book Rating : 4.:/5 (318 download)
Download or read book Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1996 with total page 520 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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Author :
Publisher :
ISBN 13 :
Total Pages : 194 pages
Book Rating : 4.3/5 (91 download)
Download or read book IEEE/CPMT International Electronic Manufacturing Technology Symposium : [proceedings]. written by and published by . This book was released on 1998 with total page 194 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Don Millard
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 :
Total Pages : 504 pages
Book Rating : 4.:/5 (318 download)
Download or read book Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium, October 13-15, 1997, Austin, TX, USA written by Don Millard and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1997 with total page 504 pages. Available in PDF, EPUB and Kindle. Book excerpt: The IEMT symposium provides a forum for sharing experiences and knowledge based on microelectronic research and development. This volume is the result of the 1997 symposium and topics include: flip chip and TAB, substrate, soldering process, manufacturing, and packaging technology.
Author : Walt Trybula
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 :
Total Pages : 536 pages
Book Rating : 4.:/5 (318 download)
Download or read book Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium, October 2-4, 1995, Austin, TX, USA written by Walt Trybula and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1995 with total page 536 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Peter Ramm
Publisher : John Wiley & Sons
ISBN 13 : 3527326464
Total Pages : 435 pages
Book Rating : 4.5/5 (273 download)
Download or read book Handbook of Wafer Bonding written by Peter Ramm and published by John Wiley & Sons. This book was released on 2012-02-13 with total page 435 pages. Available in PDF, EPUB and Kindle. Book excerpt: The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Author : Navid Asadizanjani
Publisher : Springer Nature
ISBN 13 : 3030626091
Total Pages : 193 pages
Book Rating : 4.0/5 (36 download)
Download or read book Physical Assurance written by Navid Asadizanjani and published by Springer Nature. This book was released on 2021-02-15 with total page 193 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with a comprehensive introduction to physical inspection-based approaches for electronics security. The authors explain the principles of physical inspection techniques including invasive, non-invasive and semi-invasive approaches and how they can be used for hardware assurance, from IC to PCB level. Coverage includes a wide variety of topics, from failure analysis and imaging, to testing, machine learning and automation, reverse engineering and attacks, and countermeasures.
Author : John J. Stephens
Publisher : ASM International
ISBN 13 : 1615031170
Total Pages : 430 pages
Book Rating : 4.6/5 (15 download)
Download or read book Brazing and Soldering written by John J. Stephens and published by ASM International. This book was released on 2006-01-01 with total page 430 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Albert Blodgett
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 : 9780780314245
Total Pages : 504 pages
Book Rating : 4.3/5 (142 download)
Download or read book Fifteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium written by Albert Blodgett and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1993 with total page 504 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Juan De Vicente
Publisher : BoD – Books on Demand
ISBN 13 : 9535101870
Total Pages : 354 pages
Book Rating : 4.5/5 (351 download)
Download or read book Rheology written by Juan De Vicente and published by BoD – Books on Demand. This book was released on 2012-03-07 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains a wealth of useful information on current rheology research. By covering a broad variety of rheology-related topics, this e-book is addressed to a wide spectrum of academic and applied researchers and scientists but it could also prove useful to industry specialists. The subject areas include, polymer gels, food rheology, drilling fluids and liquid crystals among others.
Author : Yi (Grace) Li
Publisher : Springer Science & Business Media
ISBN 13 : 0387887830
Total Pages : 445 pages
Book Rating : 4.3/5 (878 download)
Download or read book Electrical Conductive Adhesives with Nanotechnologies written by Yi (Grace) Li and published by Springer Science & Business Media. This book was released on 2009-10-08 with total page 445 pages. Available in PDF, EPUB and Kindle. Book excerpt: “Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.
Author : Nishar Hameed
Publisher : Elsevier
ISBN 13 : 0323985351
Total Pages : 301 pages
Book Rating : 4.3/5 (239 download)
Download or read book Rapid Cure Composites written by Nishar Hameed and published by Elsevier. This book was released on 2023-05-17 with total page 301 pages. Available in PDF, EPUB and Kindle. Book excerpt: Rapid Cure Composites: Materials, Processing and Manufacturing presents up-to-date information on the design criteria to formulate matrix systems for rapid curing. Emphasis is placed on the role different materials [resin compound and fiber reinforcement] play in developing fast curing composites, assessment of current and novel manufacturing techniques for adapting fast curing processes, the comparison between conventional curing and rapid curing, and different applications in various industrial sectors [e.g., aerospace, automotive, renewables and marine]. The book will be an essential reference resource for academic and industrial researchers working in the field of composite materials, processing and manufacturing organizations, materials scientists, and more. Polymer composites are widely used in several industries, including aerospace, automobile, spray and coatings, and electronics due to their lightweight and superior mechanical properties. However, one of the dominant hurdles towards their growth in commercial industries is the long curing cycle and slow production. - Comprehensively addresses the scientific and technological development of rapid cured epoxy composites - Covers, in detail, the chemistry, processing, structure and performance of rapid cured epoxy composites - Provides detailed comparisons of how/why rapid cure composites are different to conventional composites - Discusses the challenges of the existing technology and future trends
Author : Sergey Yurish
Publisher : Lulu.com
ISBN 13 : 8469786334
Total Pages : 536 pages
Book Rating : 4.4/5 (697 download)
Download or read book 'Advances in Microelectronics: Reviews', Vol_1 written by Sergey Yurish and published by Lulu.com. This book was released on 2017-12-24 with total page 536 pages. Available in PDF, EPUB and Kindle. Book excerpt: The 1st volume of 'Advances in Microelectronics: Reviews' Book Series contains 19 chapters written by 72 authors from academia and industry from 16 countries. With unique combination of information in each volume, the 'Advances in Microelectronics: Reviews' Book Series will be of value for scientists and engineers in industry and at universities. In order to offer a fast and easy reading of the state of the art of each topic, every chapter in this book is independent and self-contained. All chapters have the same structure: first an introduction to specific topic under study; second particular field description including sensing applications. Each of chapter is ending by well selected list of references with books, journals, conference proceedings and web sites. This book ensures that readers will stay at the cutting edge of the field and get the right and effective start point and road map for the further researches and developments.
Author : John Kieffer
Publisher : John Wiley & Sons
ISBN 13 : 0470295058
Total Pages : 290 pages
Book Rating : 4.4/5 (72 download)
Download or read book 60th Conference on Glass Problems written by John Kieffer and published by John Wiley & Sons. This book was released on 2009-09-28 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume is part of the Ceramic Engineering and Science Proceeding (CESP) series. This series contains a collection of papers dealing with issues in both traditional ceramics (i.e., glass, whitewares, refractories, and porcelain enamel) and advanced ceramics. Topics covered in the area of advanced ceramic include bioceramics, nanomaterials, composites, solid oxide fuel cells, mechanical properties and structural design, advanced ceramic coatings, ceramic armor, porous ceramics, and more.
Author : Sanka Ganesan
Publisher : John Wiley & Sons
ISBN 13 : 0471786179
Total Pages : 804 pages
Book Rating : 4.4/5 (717 download)
Download or read book Lead-free Electronics written by Sanka Ganesan and published by John Wiley & Sons. This book was released on 2006-02-17 with total page 804 pages. Available in PDF, EPUB and Kindle. Book excerpt: Lead-free Electronics provides guidance on the design and use of lead-free electronics as well as technical and legislative perspectives. All the complex challenges confronting the elec-tronics industry are skillfully addressed: * Complying with state legislation * Implementing the transition to lead-free electronics, including anticipating associated costs and potential supply chain issues * Understanding intellectual property issues in lead-free alloys and their applications, including licensing and infringement * Implementing cost effective manufacturing and testing * Reducing risks due to tin whiskers * Finding lead-free solutions in harsh environments such as in the automotive and telecommunications industries * Understanding the capabilities and limitations of conductive adhesives in lead-free interconnects * Devising solutions for lead-free, flip-chip interconnects in high-performance integrated circuit products Each chapter is written by leading experts in the field and carefully edited to ensure a consistent approach. Readers will find all the latest information, including the most recent data on cyclic thermomechanical deformation properties of lead-free SnAgCu alloys and a comparison of the properties of standard Sn-Pb versus lead-free alloys, using the energy partitioning approach. With legislative and market pressure to eliminate the use of lead in electronics manufacturing, this timely publication is essential reading for all engineers and professionals in the electronics industry.
Author : Ernst Obermeier
Publisher : Springer
ISBN 13 : 3642594972
Total Pages : 1763 pages
Book Rating : 4.6/5 (425 download)
Download or read book Transducers ’01 Eurosensors XV written by Ernst Obermeier and published by Springer. This book was released on 2016-05-12 with total page 1763 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Conference is the premier international meeting for the presentation of original work addressing all aspects of the theory, design, fabrication, assembly, packaging, testing and application of solid-state sensors, actuators, MEMS, and microsystems.
Author : Jürg Schwizer
Publisher : Springer Science & Business Media
ISBN 13 : 3540269452
Total Pages : 184 pages
Book Rating : 4.5/5 (42 download)
Download or read book Force Sensors for Microelectronic Packaging Applications written by Jürg Schwizer and published by Springer Science & Business Media. This book was released on 2005-12-11 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt: Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire-bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding and future development of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are also illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.
