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Ic Interconnect Analysis
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Book Synopsis IC Interconnect Analysis by : Mustafa Celik
Download or read book IC Interconnect Analysis written by Mustafa Celik and published by Springer Science & Business Media. This book was released on 2007-05-08 with total page 316 pages. Available in PDF, EPUB and Kindle. Book excerpt: As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components. Once viewed as merely parasitics in terms of their relevance to the overall circuit behavior, the interconnect can now have a dominant impact on the IC area and performance. Beginning in the late 1980's there was significant research toward better modeling and characterization of the resistance, capacitance and ultimately the inductance of on-chip interconnect. IC Interconnect Analysis covers the state-of-the-art methods for modeling and analyzing IC interconnect based on the past fifteen years of research. This is done at a level suitable for most practitioners who work in the semiconductor and electronic design automation fields, but also includes significant depth for the research professionals who will ultimately extend this work into other areas and applications. IC Interconnect Analysis begins with an in-depth coverage of delay metrics, including the ubiquitous Elmore delay and its many variations. This is followed by an outline of moment matching methods, calculating moments efficiently, and Krylov subspace methods for model order reduction. The final two chapters describe how to interface these reduced-order models to circuit simulators and gate-level timing analyzers respectively. IC Interconnect Analysis is written for CAD tool developers, IC designers and graduate students.
Book Synopsis Interconnect Analysis and Synthesis by : Chung-Kuan Cheng
Download or read book Interconnect Analysis and Synthesis written by Chung-Kuan Cheng and published by Wiley-Interscience. This book was released on 2000 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt: State-of-the-art methods and current perspectives on interconnect The irrepressible march toward smaller and faster integrated circuits has made interconnect a hot topic for semiconductor research. The effects of wire size, topology construction, and network design on system performance and reliability have all been thoroughly investigated in recent years. Interconnect Analysis and Synthesis provides CAD researchers and engineers with powerful, state-of-the-art tools for the analysis, design, and optimization of interconnect. It brings together a wealth of information previously scattered throughout the literature, explaining in depth available analysis techniques and presenting a range of CAD algorithms for synthesizing and optimizing interconnect. Along with examples and results from the semiconductor industry and 150 illustrations, this practical work features: Models for interconnect as well as devices and the impact of scaling trends Modern analysis techniques, from matrix reduction and moment matching to transmission-line analysis An overview of the effects of inductance on on-chip interconnect Flexible CAD algorithms that can be generalized for different needs, from buffer insertion to wire sizing to routing topology Emphasis on realistic problem formulations, addressing key design tradeoffs such as those between area and performance
Book Synopsis Fast High-order Variation-aware IC Interconnect Analysis by : Xiaoji Ye
Download or read book Fast High-order Variation-aware IC Interconnect Analysis written by Xiaoji Ye and published by . This book was released on 2010 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Interconnects constitute a dominant source of circuit delay for modern chip designs. The variations of critical dimensions in modern VLSI technologies lead to variability in interconnect performance that must be fully accounted for in timing verification. However, handling a multitude of inter-die/intra-die variations and assessing their impacts on circuit performance can dramatically complicate the timing analysis. In this thesis, three practical interconnect delay and slew analysis methods are presented to facilitate efficient evaluation of wire performance variability. The first method is described in detail in Chapter III. It harnesses a collection of computationally efficient procedures and closed-form formulas. By doing so, process variations are directly mapped into the variability of the output delay and slew. This method can provide the closed-form formulas of the output delay and slew at any sink node of the interconnect nets fully parameterized, in-process variations. The second method is based on adjoint sensitivity analysis and driving point model. It constructs the driving point model of the driver which drives the interconnect net by using the adjoint sensitivity analysis method. Then the driving point model can be propagated through the interconnect network by using the first method to obtain the closedform formulas of the output delay and slew. The third method is the generalized second-order adjoint sensitivity analysis. We give the mathematical derivation of this method in Chapter V. The theoretical value of this method is it can not only handle this particular variational interconnect delay and slew analysis, but it also provides an avenue for automatical linear network analysis and optimization. The proposed methods not only provide statistical performance evaluations of the interconnect network under analysis but also produce delay and slew expressions parameterized in the underlying process variations in a quadratic parametric form. Experimental results show that superior accuracy can be achieved by our proposed methods.
Book Synopsis Interconnect Technology and Design for Gigascale Integration by : Jeffrey A. Davis
Download or read book Interconnect Technology and Design for Gigascale Integration written by Jeffrey A. Davis and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 417 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.
Book Synopsis Three-Dimensional Integrated Circuit Design by : Vasilis F. Pavlidis
Download or read book Three-Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and published by Newnes. This book was released on 2017-07-04 with total page 770 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization
Book Synopsis Digital Integrated Circuits by : John E. Ayers
Download or read book Digital Integrated Circuits written by John E. Ayers and published by CRC Press. This book was released on 2018-09-03 with total page 598 pages. Available in PDF, EPUB and Kindle. Book excerpt: Exponential improvement in functionality and performance of digital integrated circuits has revolutionized the way we live and work. The continued scaling down of MOS transistors has broadened the scope of use for circuit technology to the point that texts on the topic are generally lacking after a few years. The second edition of Digital Integrated Circuits: Analysis and Design focuses on timeless principles with a modern interdisciplinary view that will serve integrated circuits engineers from all disciplines for years to come. Providing a revised instructional reference for engineers involved with Very Large Scale Integrated Circuit design and fabrication, this book delves into the dramatic advances in the field, including new applications and changes in the physics of operation made possible by relentless miniaturization. This book was conceived in the versatile spirit of the field to bridge a void that had existed between books on transistor electronics and those covering VLSI design and fabrication as a separate topic. Like the first edition, this volume is a crucial link for integrated circuit engineers and those studying the field, supplying the cross-disciplinary connections they require for guidance in more advanced work. For pedagogical reasons, the author uses SPICE level 1 computer simulation models but introduces BSIM models that are indispensable for VLSI design. This enables users to develop a strong and intuitive sense of device and circuit design by drawing direct connections between the hand analysis and the SPICE models. With four new chapters, more than 200 new illustrations, numerous worked examples, case studies, and support provided on a dynamic website, this text significantly expands concepts presented in the first edition.
Book Synopsis 3-D Modelling of IC Interconnect Using OpenAccess and Art of Illusion by : Navaneeth Prasannakumar Jamadagni
Download or read book 3-D Modelling of IC Interconnect Using OpenAccess and Art of Illusion written by Navaneeth Prasannakumar Jamadagni and published by . This book was released on 2010 with total page 106 pages. Available in PDF, EPUB and Kindle. Book excerpt: In search of higher speed and integration, the integrated circuit (IC) technology is scaling down. The total on-chip interconnect length is increasing exponentially. In fact, interconnect takes up the most part of the total chip area. The parasitics associated with these interconnect have significant impact on the circuit performance. Some of the effects of parasitics include cross talk, voltage drop and high current density. These issues can result in cross-talk induced functional failure and failures due to IR drop and electro-migration. This has resulted in interconnect- driven design trend in state-of-the-art integrated circuits. Reliability analysis, that includes simulating the effects of parasitics for voltage drop, current density, has become one of the most important steps in the VLSI design flow. Most of the CAD/EDA tools available, map these analysis results two dimensionally. Although this helps the designer, providing a three dimensional view of these results is highly desirable when dealing with complex circuits. In pursuit of visualizing reliability analysis results three dimensionally, as a first step, this work presents a tool that can visualize IC interconnect three dimensionally. Throughout the course of this research open source tools were used to achieve the objective. In this work the circuit layout is stored as an OpenAccess database. A C++ program reads the design information using OpenAccess API and converts it to the .OBJ file format. Art of Illusion, an open source 3D modeling and rendering tool, reads this .OBJ file and models the IC interconnect three-dimensionally. In addition, Eclipse, an open source java IDE is used as a development platform. The tool presented has the capability to zoom in, zoom out and pan in real time.
Book Synopsis On-Chip Inductance in High Speed Integrated Circuits by : Yehea I. Ismail
Download or read book On-Chip Inductance in High Speed Integrated Circuits written by Yehea I. Ismail and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: The appropriate interconnect model has changed several times over the past two decades due to the application of aggressive technology scaling. New, more accurate interconnect models are required to manage the changing physical characteristics of integrated circuits. Currently, RC models are used to analyze high resistance nets while capacitive models are used for less resistive interconnect. However, on-chip inductance is becoming more important with integrated circuits operating at higher frequencies, since the inductive impedance is proportional to the frequency. The operating frequencies of integrated circuits have increased dramatically over the past decade and are expected to maintain the same rate of increase over the next decade, approaching 10 GHz by the year 2012. Also, wide wires are frequently encountered in important global nets, such as clock distribution networks and in upper metal layers, and performance requirements are pushing the introduction of new materials for low resistance interconnect, such as copper interconnect already used in many commercial CMOS technologies. On-Chip Inductance in High Speed Integrated Circuits deals with the design and analysis of integrated circuits with a specific focus on on-chip inductance effects. It has been described throughout this book that inductance can have a tangible effect on current high speed integrated circuits. For example, neglecting inductance and using an RC interconnect model in a production 0.25 mum CMOS technology can cause large errors (over 35%) in estimates of the propagation delay of on-chip interconnect. It has also been shown that including inductance in the repeater insertion design process as compared to using an RC model improves the overall repeater solution in terms of area, power, and delay with average savings of 40.8%, 15.6%, and 6.7%, respectively. On-Chip Inductance in High Speed Integrated Circuits is full of design and analysis techniques for RLC interconnect. These techniques are compared to techniques traditionally used for RC interconnect design to emphasize the effect of inductance. emOn-Chip Inductance in High Speed Integrated Circuits will be of interest to researchers in the area of high frequency interconnect, noise, and high performance integrated circuit design.
Book Synopsis Interconnect Capacitance Extraction Under Geometric Uncertainties by : Prasad S. Sumant
Download or read book Interconnect Capacitance Extraction Under Geometric Uncertainties written by Prasad S. Sumant and published by . This book was released on 2010 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Interconnects are an important constituent of any large scale integrated circuit, and accurate interconnect analysis is essential not only for post-layout verification but also for synthesis. For instance, extraction of interconnect capacitance is needed for the prediction of interconnect-induced delay, crosstalk, and other signal distortion related effects that are used to guide IC routing and floor planning. The continuous progress of semiconductor technology is leading ICs to the era of 45 nm technology and beyond. However, this progress has been associated with increasing variability during the manufacturing processes. This variability leads to stochastic variations in geometric and material parameters and has a significant impact on interconnect capacitance. It is therefore important to be able to quantify the effect of such process induced variations on interconnect capacitance. In this thesis, we have worked on a methodology towards modeling of interconnect capacitance in the presence of geometric uncertainties. More specifically, a methodology is proposed for the finite element solution of Laplace's equation for the calculation of the per-unit-length capacitance matrix of a multi-conductor interconnect structure embedded in a multi-layered insulating substrate and in the presence of statistical variation in conductor and substrate geometry. The proposed method is founded on the idea of defining a single, mean geometry, which is subsequently used with a single finite element discretization, to extract the statistics of the interconnect capacitance in an expedient fashion. We demonstrate the accuracy and efficiency of our method through its application to the extraction of capacitances in some representative geometries for IC interconnects.
Book Synopsis Interconnect Technologies for Integrated Circuits and Flexible Electronics by : Yash Agrawal
Download or read book Interconnect Technologies for Integrated Circuits and Flexible Electronics written by Yash Agrawal and published by Springer Nature. This book was released on 2023-10-17 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.
Book Synopsis Interconnect Modeling, Signal Integrity and Reliability Analysis for Deep Sub-micron Integrated Circuits by : NS. Nagaraj
Download or read book Interconnect Modeling, Signal Integrity and Reliability Analysis for Deep Sub-micron Integrated Circuits written by NS. Nagaraj and published by . This book was released on 2003 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis High Performance Integrated Circuit Design by : Emre Salman
Download or read book High Performance Integrated Circuit Design written by Emre Salman and published by McGraw Hill Professional. This book was released on 2012-08-21 with total page 738 pages. Available in PDF, EPUB and Kindle. Book excerpt: The latest techniques for designing robust, high performance integrated circuits in nanoscale technologies Focusing on a new technological paradigm, this practical guide describes the interconnect-centric design methodologies that are now the major focus of nanoscale integrated circuits (ICs). High Performance Integrated Circuit Design begins by discussing the dominant role of on-chip interconnects and provides an overview of technology scaling. The book goes on to cover data signaling, power management, synchronization, and substrate-aware design. Specific design constraints and methodologies unique to each type of interconnect are addressed. This comprehensive volume also explains the design of specialized circuits such as tapered buffers and repeaters for data signaling, voltage regulators for power management, and phase-locked loops for synchronization. This is an invaluable resource for students, researchers, and engineers working in the area of high performance ICs. Coverage includes: Technology scaling Interconnect modeling and extraction Signal propagation and delay analysis Interconnect coupling noise Global signaling Power generation Power distribution networks CAD of power networks Techniques to reduce power supply noise Power dissipation Synchronization theory and tradeoffs Synchronous system characteristics On-chip clock generation and distribution Substrate noise in mixed-signal ICs Techniques to reduce substrate noise
Book Synopsis Interconnect Technologies for Integrated Circuits and Flexible Electronics by : Yash Agrawal
Download or read book Interconnect Technologies for Integrated Circuits and Flexible Electronics written by Yash Agrawal and published by Springer. This book was released on 2023-10-07 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.
Book Synopsis Fundamentals of Electromigration-Aware Integrated Circuit Design by : Jens Lienig
Download or read book Fundamentals of Electromigration-Aware Integrated Circuit Design written by Jens Lienig and published by Springer. This book was released on 2018-02-23 with total page 171 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.
Book Synopsis Application of Effective Medium Theory to the Analysis of Integrated Circuit Interconnects by : Sonia M. Holik
Download or read book Application of Effective Medium Theory to the Analysis of Integrated Circuit Interconnects written by Sonia M. Holik and published by . This book was released on 2010 with total page 163 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis CMOS Digital Integrated Circuits by : Sung-Mo Kang
Download or read book CMOS Digital Integrated Circuits written by Sung-Mo Kang and published by . This book was released on 2002 with total page 655 pages. Available in PDF, EPUB and Kindle. Book excerpt: The fourth edition of CMOS Digital Integrated Circuits: Analysis and Design continues the well-established tradition of the earlier editions by offering the most comprehensive coverage of digital CMOS circuit design, as well as addressing state-of-the-art technology issues highlighted by the widespread use of nanometer-scale CMOS technologies. In this latest edition, virtually all chapters have been re-written, the transistor model equations and device parameters have been revised to reflect the sigificant changes that must be taken into account for new technology generations, and the material has been reinforced with up-to-date examples. The broad-ranging coverage of this textbook starts with the fundamentals of CMOS process technology, and continues with MOS transistor models, basic CMOS gates, interconnect effects, dynamic circuits, memory circuits, arithmetic building blocks, clock and I/O circuits, low power design techniques, design for manufacturability and design for testability.
Book Synopsis An integrated methodology for electronic system interconnect analysis by : Vivek Raghavan
Download or read book An integrated methodology for electronic system interconnect analysis written by Vivek Raghavan and published by . This book was released on 1992 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
