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Heterogeneous Integration Technology For Hybrid Optoelectronic And Electronic Device And Module Fabrication
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Book Synopsis Heterogeneous Integration Technology for Hybrid Optoelectronic and Electronic Device and Module Fabrication by : Michael Sungchun Jin
Download or read book Heterogeneous Integration Technology for Hybrid Optoelectronic and Electronic Device and Module Fabrication written by Michael Sungchun Jin and published by . This book was released on 1998 with total page 302 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Heterogeneous Optoelectronics Integration by : Elias Towe
Download or read book Heterogeneous Optoelectronics Integration written by Elias Towe and published by SPIE Press. This book was released on 2000 with total page 304 pages. Available in PDF, EPUB and Kindle. Book excerpt: Numerous efforts are directed at investigating the use of optics at short distances--for example, at the chip-to-chip and board-to-board levels of the interconnection hierarchy. This book provides an overview of the state of the art in heterogeneous integration of electronics, optoelectronics, and micro-optics for short-distance optical interconnections.
Book Synopsis Materials to Microsystems:Heterogeneous Integration Technologies by :
Download or read book Materials to Microsystems:Heterogeneous Integration Technologies written by and published by . This book was released on 2003 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Microsystems technology is increasingly comprised of multi-function devices and materials. Heterogeneous integration technologies are being developed to enable the flexible integration of high-performance devices, materials, and circuits. In our approach, the processing required for integration, such as substrate removal and bonding, is coupled with pre-and post-processing to enable new device and materials configurations not achieved in standard fabrication sequences. Materials and device processes and designs must be considered differently in the context of integration. Herein, we examine these issues specifically for InAs-, InP-and GaN-based heterojunction electronic and optoelectronic device integration processes.
Book Synopsis Heterogeneous Integrations by : John H. Lau
Download or read book Heterogeneous Integrations written by John H. Lau and published by Springer. This book was released on 2019-04-03 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Book Synopsis Heterogeneous Integration by : Anis Husain
Download or read book Heterogeneous Integration written by Anis Husain and published by SPIE-International Society for Optical Engineering. This book was released on 1998 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Book Synopsis 3D Integration in VLSI Circuits by : Katsuyuki Sakuma
Download or read book 3D Integration in VLSI Circuits written by Katsuyuki Sakuma and published by CRC Press. This book was released on 2018-04-17 with total page 219 pages. Available in PDF, EPUB and Kindle. Book excerpt: Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.
Book Synopsis Scaling And Integration Of High-speed Electronics And Optomechanical Systems by : Willander Magnus
Download or read book Scaling And Integration Of High-speed Electronics And Optomechanical Systems written by Willander Magnus and published by World Scientific. This book was released on 2017-04-17 with total page 152 pages. Available in PDF, EPUB and Kindle. Book excerpt: Coined as the third revolution in electronics is under way; Manufacturing is going digital, driven by computing revolution, powered by MOS technology, in particular, by the CMOS technology and its development. In this book, the scaling challenges for CMOS: SiGe BiCMOS, THz and niche technology are covered; the first article looks at scaling challenges for CMOS from an industrial point of view (review of the latest innovations); the second article focuses on SiGe BiCMOS technologies (deals with high-speed up to the THz-region), and the third article reports on circuits associated with source/drain integration in 14 nm and beyond FinFET technology nodes. Followed by the last two articles on niche applications for emerging technologies: one deals with carbon nanotube network and plasmonics for the THz region carbon, while the other reviews the recent developments in integrated on-chip nano-optomechanical systems. Contents: PrefaceScaling Challenges for Advanced CMOS Devices (Ajey P Jacob, Ruilong Xie, Min Gyu Sung, Lars Liebmann, Rinus T P Lee and Bill Taylor)High-Speed SiGe BiCMOS Technologies and Circuits (A Mai, I Garcia Lopez, P Rito, R Nagulapalli, A Awny, M Elkhouly, M Eissa, M Ko, A Malignaggi, M Kucharski, H J Ng, K Schmalz and D Kissinger)Optimization of Selective Growth of SiGe for Source/Drain in 14nm and Beyond Nodes FinFETs (Henry H Radamson, Jun Luo, Changliang Qin, Huaxiang Yin, Huilong Zhu, Chao Zhao and Guilei Wang)Dynamic Conductivity and Two-Dimensional Plasmons in Lateral CNT Networks (Maxim Ryzhii, Taiichi Otsuji, Victor Ryzhii, Vladimir Mitin, Michael S Shur, Georgy Fedorov and Vladimir Leiman)Integrated On-Chip Nano-Optomechanical Systems (Zhu Diao, Vincent T K Sauer and Wayne K Hiebert)Author Index Readership: Scientists, engineers, research leaders, and even investors interested in microelectronics, nanoelectronics, and optoelectronics. It is also recommended to graduate students working in these fields.
Book Synopsis Dissertation Abstracts International by :
Download or read book Dissertation Abstracts International written by and published by . This book was released on 1999 with total page 704 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Optoelectronic Integration: Physics, Technology and Applications by : Osamu Wada
Download or read book Optoelectronic Integration: Physics, Technology and Applications written by Osamu Wada and published by Springer Science & Business Media. This book was released on 1994-05-31 with total page 490 pages. Available in PDF, EPUB and Kindle. Book excerpt: By combining optoelectronics with electronics, optoelectronic integration is the challenging merger of many different areas of science and technology. Optoelectronic Integration: Physics, Technology, and Applications presents the basic physics, materials, fabrication techniques, and systems applications of optoelectronic integration in a concise and organized form. Comprehensive and up to date, this book describes fundamental device physics and III-V semiconductor growth and processing; covers the basic design and integration of lasers, photodetectors, waveguides, and transistors; reviews and analyzes optoelectronic integrated circuits (OEICs), photonic integrated circuits (PICs), and vertical optoelectronic functional device arrays; discusses packaging and systems architecture for applications in optical telecommunications, interconnections and signal processing. With numerous cross-references, end-of-chapter references, and extended summaries identifying key issues and prospects in each technical area, Optoelectronic Integration: Physics, Technology, and Applications is an invaluable reference for engineers, scientists and students working in optoelectronics.
Book Synopsis Through-Silicon Vias for 3D Integration by : John H. Lau
Download or read book Through-Silicon Vias for 3D Integration written by John H. Lau and published by McGraw Hill Professional. This book was released on 2012-08-05 with total page 513 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to TSV and other enabling technologies for 3D integration Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed. This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems. Coverage includes: Nanotechnology and 3D integration for the semiconductor industry TSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing TSVs: mechanical, thermal, and electrical behaviors Thin-wafer strength measurement Wafer thinning and thin-wafer handling Microbumping, assembly, and reliability Microbump electromigration Transient liquid-phase bonding: C2C, C2W, and W2W 2.5D IC integration with interposers 3D IC integration with interposers Thermal management of 3D IC integration 3D IC packaging
Download or read book Labs on Chip written by Eugenio Iannone and published by CRC Press. This book was released on 2018-09-03 with total page 1351 pages. Available in PDF, EPUB and Kindle. Book excerpt: Labs on Chip: Principles, Design and Technology provides a complete reference for the complex field of labs on chip in biotechnology. Merging three main areas— fluid dynamics, monolithic micro- and nanotechnology, and out-of-equilibrium biochemistry—this text integrates coverage of technology issues with strong theoretical explanations of design techniques. Analyzing each subject from basic principles to relevant applications, this book: Describes the biochemical elements required to work on labs on chip Discusses fabrication, microfluidic, and electronic and optical detection techniques Addresses planar technologies, polymer microfabrication, and process scalability to huge volumes Presents a global view of current lab-on-chip research and development Devotes an entire chapter to labs on chip for genetics Summarizing in one source the different technical competencies required, Labs on Chip: Principles, Design and Technology offers valuable guidance for the lab-on-chip design decision-making process, while exploring essential elements of labs on chip useful both to the professional who wants to approach a new field and to the specialist who wants to gain a broader perspective.
Book Synopsis Optical Switching in Next Generation Data Centers by : Francesco Testa
Download or read book Optical Switching in Next Generation Data Centers written by Francesco Testa and published by Springer. This book was released on 2017-08-29 with total page 334 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book introduces the reader to the optical switching technology for its application to data centers. In addition, it takes a picture of the status of the technology and system architecture evolution and of the research in the area of optical switching in data center. The book is organized in four parts: the first part is focused on the system aspects of optical switching in intra-data center networking, the second part is dedicated to describing the recently demonstrated optical switching networks, the third part deals with the latest technologies developed to enable optical switching and, finally, the fourth part of the book outlines the future prospects and trends.
Book Synopsis American Doctoral Dissertations by :
Download or read book American Doctoral Dissertations written by and published by . This book was released on 1998 with total page 784 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :Xingcun Colin Tong Ph.D Publisher :Springer Science & Business Media ISBN 13 :3319015508 Total Pages :574 pages Book Rating :4.3/5 (19 download)
Book Synopsis Advanced Materials for Integrated Optical Waveguides by : Xingcun Colin Tong Ph.D
Download or read book Advanced Materials for Integrated Optical Waveguides written by Xingcun Colin Tong Ph.D and published by Springer Science & Business Media. This book was released on 2013-10-17 with total page 574 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive introduction to integrated optical waveguides for information technology and data communications. Integrated coverage ranges from advanced materials, fabrication, and characterization techniques to guidelines for design and simulation. A concluding chapter offers perspectives on likely future trends and challenges. The dramatic scaling down of feature sizes has driven exponential improvements in semiconductor productivity and performance in the past several decades. However, with the potential of gigascale integration, size reduction is approaching a physical limitation due to the negative impact on resistance and inductance of metal interconnects with current copper-trace based technology. Integrated optics provides a potentially lower-cost, higher performance alternative to electronics in optical communication systems. Optical interconnects, in which light can be generated, guided, modulated, amplified, and detected, can provide greater bandwidth, lower power consumption, decreased interconnect delays, resistance to electromagnetic interference, and reduced crosstalk when integrated into standard electronic circuits. Integrated waveguide optics represents a truly multidisciplinary field of science and engineering, with continued growth requiring new developments in modeling, further advances in materials science, and innovations in integration platforms. In addition, the processing and fabrication of these new devices must be optimized in conjunction with the development of accurate and precise characterization and testing methods. Students and professionals in materials science and engineering will find Advanced Materials for Integrated Optical Waveguides to be an invaluable reference for meeting these research and development goals.
Book Synopsis Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology by : John H. Lau
Download or read book Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology written by John H. Lau and published by Springer Nature. This book was released on with total page 515 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Thin-Film Organic Photonics by : Tetsuzo Yoshimura
Download or read book Thin-Film Organic Photonics written by Tetsuzo Yoshimura and published by CRC Press. This book was released on 2017-12-19 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt: Among the many atomic/molecular assembling techniques used to develop artificial materials, molecular layer deposition (MLD) continues to receive special attention as the next-generation growth technique for organic thin-film materials used in photonics and electronics. Thin-Film Organic Photonics: Molecular Layer Deposition and Applications describes how photonic/electronic properties of thin films can be improved through MLD, which enables precise control of atomic and molecular arrangements to construct a wire network that achieves "three-dimensional growth". MLD facilitates dot-by-dot—or molecule-by-molecule—growth of polymer and molecular wires, and that enhanced level of control creates numerous application possibilities. Explores the wide range of MLD applications in solar energy and optics, as well as proposed uses in biomedical photonics This book addresses the prospects for artificial materials with atomic/molecular-level tailored structures, especially those featuring MLD and conjugated polymers with multiple quantum dots (MQDs), or polymer MQDs. In particular, the author focuses on the application of artificial organic thin films to: Photonics/electronics, particularly in optical interconnects used in computers Optical switching and solar energy conversion systems Bio/ medical photonics, such as photodynamic therapy Organic photonic materials, devices, and integration processes With its clear and concise presentation, this book demonstrates exactly how MLD enables electron wavefunction control, thereby improving material performance and generating new photonic/electronic phenomena.
Book Synopsis Silicon Photonics II by : David J. Lockwood
Download or read book Silicon Photonics II written by David J. Lockwood and published by Springer Science & Business Media. This book was released on 2010-10-13 with total page 264 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is volume II of a series of books on silicon photonics. It gives a fascinating picture of the state-of-the-art in silicon photonics from a component perspective. It presents a perspective on what can be expected in the near future. It is formed from a selected number of reviews authored by world leaders in the field, and is written from both academic and industrial viewpoints. An in-depth discussion of the route towards fully integrated silicon photonics is presented. This book will be useful not only to physicists, chemists, materials scientists, and engineers but also to graduate students who are interested in the fields of micro- and nanophotonics and optoelectronics.
