Harsh Environment Electronics

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Publisher : John Wiley & Sons
ISBN 13 : 3527344195
Total Pages : 398 pages
Book Rating : 4.5/5 (273 download)

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Book Synopsis Harsh Environment Electronics by : Ahmed Sharif

Download or read book Harsh Environment Electronics written by Ahmed Sharif and published by John Wiley & Sons. This book was released on 2019-08-05 with total page 398 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.

Extreme-temperature and Harsh-environment Electronics

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Author :
Publisher :
ISBN 13 : 9780750311571
Total Pages : 0 pages
Book Rating : 4.3/5 (115 download)

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Book Synopsis Extreme-temperature and Harsh-environment Electronics by : Vinod Kumar Khanna

Download or read book Extreme-temperature and Harsh-environment Electronics written by Vinod Kumar Khanna and published by . This book was released on 2017 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Electronic devices and circuits are employed by a range of industries in testing conditions from extremes of high- or low-temperature, in chemically corrosive environments, subject to shock and vibration or exposure to radiation. This book describes the diverse measures necessary to make electronics capable of coping with such situations as well as to gainfully exploit any new phenomena that take place only under these conditions."--Prové de l'editor.

Harsh Environment Electronics

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Author :
Publisher : John Wiley & Sons
ISBN 13 : 3527813993
Total Pages : 400 pages
Book Rating : 4.5/5 (278 download)

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Book Synopsis Harsh Environment Electronics by : Ahmed Sharif

Download or read book Harsh Environment Electronics written by Ahmed Sharif and published by John Wiley & Sons. This book was released on 2019-03-19 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.

Extreme Environment Electronics

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Author :
Publisher : CRC Press
ISBN 13 : 143987431X
Total Pages : 1041 pages
Book Rating : 4.4/5 (398 download)

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Book Synopsis Extreme Environment Electronics by : John D. Cressler

Download or read book Extreme Environment Electronics written by John D. Cressler and published by CRC Press. This book was released on 2017-12-19 with total page 1041 pages. Available in PDF, EPUB and Kindle. Book excerpt: Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.

Silicon Carbide Microsystems for Harsh Environments

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Author :
Publisher : Springer Science & Business Media
ISBN 13 : 1441971211
Total Pages : 247 pages
Book Rating : 4.4/5 (419 download)

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Book Synopsis Silicon Carbide Microsystems for Harsh Environments by : Muthu Wijesundara

Download or read book Silicon Carbide Microsystems for Harsh Environments written by Muthu Wijesundara and published by Springer Science & Business Media. This book was released on 2011-05-17 with total page 247 pages. Available in PDF, EPUB and Kindle. Book excerpt: Silicon Carbide Microsystems for Harsh Environments reviews state-of-the-art Silicon Carbide (SiC) technologies that, when combined, create microsystems capable of surviving in harsh environments, technological readiness of the system components, key issues when integrating these components into systems, and other hurdles in harsh environment operation. The authors use the SiC technology platform suite the model platform for developing harsh environment microsystems and then detail the current status of the specific individual technologies (electronics, MEMS, packaging). Additionally, methods towards system level integration of components and key challenges are evaluated and discussed based on the current state of SiC materials processing and device technology. Issues such as temperature mismatch, process compatibility and temperature stability of individual components and how these issues manifest when building the system receive thorough investigation. The material covered not only reviews the state-of-the-art MEMS devices, provides a framework for the joining of electronics and MEMS along with packaging into usable harsh-environment-ready sensor modules.

Semiconductor Devices in Harsh Conditions

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Publisher : CRC Press
ISBN 13 : 149874382X
Total Pages : 257 pages
Book Rating : 4.4/5 (987 download)

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Book Synopsis Semiconductor Devices in Harsh Conditions by : Kirsten Weide-Zaage

Download or read book Semiconductor Devices in Harsh Conditions written by Kirsten Weide-Zaage and published by CRC Press. This book was released on 2016-11-25 with total page 257 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book introduces the reader to a number of challenges for the operation of electronic devices in various harsh environmental conditions. While some chapters focus on measuring and understanding the effects of these environments on electronic components, many also propose design solutions, whether in choice of material, innovative structures, or strategies for amelioration and repair. Many applications need electronics designed to operate in harsh environments. Readers will find, in this collection of topics, tools and ideas useful in their own pursuits and of interest to their intellectual curiosity. With a focus on radiation, operating conditions, sensor systems, package, and system design, the book is divided into three parts. The first part deals with sensing devices designed for operating in the presence of radiation, commercials of the shelf (COTS) products for space computing, and influences of single event upset. The second covers system and package design for harsh operating conditions. The third presents devices for biomedical applications under moisture and temperature loads in the frame of sensor systems and operating conditions.

High Temperature Electronics

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Publisher : CRC Press
ISBN 13 : 9780849396236
Total Pages : 354 pages
Book Rating : 4.3/5 (962 download)

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Book Synopsis High Temperature Electronics by : F. Patrick McCluskey

Download or read book High Temperature Electronics written by F. Patrick McCluskey and published by CRC Press. This book was released on 1996-12-13 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.

High Temperature Electronics Design for Aero Engine Controls and Health Monitoring

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Author :
Publisher : River Publishers
ISBN 13 : 8793379250
Total Pages : 162 pages
Book Rating : 4.7/5 (933 download)

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Book Synopsis High Temperature Electronics Design for Aero Engine Controls and Health Monitoring by : Stoica Lucian

Download or read book High Temperature Electronics Design for Aero Engine Controls and Health Monitoring written by Stoica Lucian and published by River Publishers. This book was released on 2016-09-30 with total page 162 pages. Available in PDF, EPUB and Kindle. Book excerpt: There is a growing desire to install electronic power and control systems in high temperature harsh environments to improve the accuracy of critical measurements, reduce the amount of cabling and to eliminate cooling systems. Typical target applications include electronics for energy exploration, power generation and control systems. Technical topics presented in this book include: High temperature electronics marketHigh temperature devices, materials and assembly processesDesign, manufacture and testing of multi-sensor data acquisition system for aero-engine controlFuture applications for high temperature electronicsHigh Temperature Electronics Design for Aero Engine Controls and Health Monitoring contains details of state of the art design and manufacture of electronics targeted towards a high temperature aero-engine application. High Temperature Electronics Design for Aero Engine Controls and Health Monitoring is ideal for design, manufacturing and test personnel in the aerospace and other harsh environment industries as well as academic staff and master/research students in electronics engineering, materials science and aerospace engineering.

Resilient Hybrid Electronics for Extreme/Harsh Environments

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Author :
Publisher : CRC Press
ISBN 13 : 1003857183
Total Pages : 187 pages
Book Rating : 4.0/5 (38 download)

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Book Synopsis Resilient Hybrid Electronics for Extreme/Harsh Environments by : Amanda Schrand

Download or read book Resilient Hybrid Electronics for Extreme/Harsh Environments written by Amanda Schrand and published by CRC Press. This book was released on 2024-06-06 with total page 187 pages. Available in PDF, EPUB and Kindle. Book excerpt: The success of future innovative technology relies upon a community with a shared vision. Here, we present an overview of the latest technological progress in the field of printed electronics for use in harsh or extreme environments. Each chapter unlocksscientific and engineering discoveries that will undoubtedly lead to progression from proof of concept to device creation. The main topics covered in this book include some of the most promising materials, methods, and the ability to integrate printed materials with commercial components to provide the basis for the next generation of electronics that are dubbed “survivable” in environments with high g‐orces, corrosion, vibration, and large temperature fluctuations. A wide variety of materials are discussed that contribute to robust hybrid electronics, including printable conductive composite inks, ceramics and ceramic matrix composites, polymer‐erived ceramics, thin metal films, elastomers, solders and epoxies, to name a few. Collectively, these materials and associated components are used to construct conductive traces, interconnects, antennas, pressure sensors, temperature sensors, power inducting devices, strain sensors and gauges, soft actuators, supercapacitors, piezo ionic elements, resistors, waveguides, filters, electrodes, batteries, various detectors, monitoring devices, transducers, and RF systems and graded dielectric, or graded index (GRIN) structures. New designs that incorporate the electronics as embedded materials into channels, slots and other methods to protect the electronics from the extreme elements of the operational environment are also envisioned to increase their survivability while remaining cognizant of the required frequency of replacement, reapplication and integration of power sources. Lastly, the ability of printer manufacturers, software providers and users to work together to build multi‐axis, multi‐material and commercial‐off‐the‐shelf (COTS) integration into user‐friendly systems will be a great advancement for the field of printed electronics. Therefore, the blueprint for manufacturing resilient hybrid electronics consists of novel designs that exploit the benefits of advances in additive manufacturing that are then efficiently paired with commercially available components to produce devices that exceed known constraints. As a primary example, metals can be deposited onto polymers in a variety of ways, including aerosol jetting, microdispensing, electroplating, sintering, vacuum deposition, supersonic beam cluster deposition, and plasma‐based techniques, to name a few. Taking these scientific discoveries and creatively combining them into robotic, multi‐material factories of the future could be one shared aim of the printed electronics community toward survivable device creation.

Low Temperature Electronics

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Author :
Publisher : Elsevier
ISBN 13 : 0080510507
Total Pages : 986 pages
Book Rating : 4.0/5 (85 download)

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Book Synopsis Low Temperature Electronics by : Edmundo A. Gutierrez-D

Download or read book Low Temperature Electronics written by Edmundo A. Gutierrez-D and published by Elsevier. This book was released on 2000-10-25 with total page 986 pages. Available in PDF, EPUB and Kindle. Book excerpt: Low Temperature Electronics: Physics, Devices, Circuits, and Applications summarizes the recent advances in cryoelectronics starting from the fundamentals in physics and semiconductor devices to electronic systems, hybrid superconductor-semiconductor technologies, photonic devices, cryocoolers and thermal management. Furthermore, this book provides an exploration of the currently available theory, research, and technologies related to cryoelectronics, including treatment of the solid state physical properties of the materials used in these systems. Current applications are found in infrared systems, satellite communications and medical equipment. There are opportunities to expand in newer fields such as wireless and mobile communications, computers, and measurement and scientific equipment. Low temperature operations can offer certain advantages such as higher operational speeds, lower power dissipation, shorter signal transmission times, higher semiconductor and metal thermal conductivities, and improved digital and analog circuit performance.The computer, telecommunication, and cellular phone market is pushing the semiconductor industry towards the development of very aggressive device and integrated circuit fabrication technologies. This is taking these technologies towards the physical miniaturization limit, where quantum effects and fabrication costs are becoming a technological and economical barrier for further development. In view of these limitations, operation of semiconductor devices and circuits at low temperature (cryogenic temperature) is studied in this book.* It is a book intended for a wide audience: students, scientists, technology development engineers, private companies, universities, etc.* It contains information which is for the first time available as an all-in-one source; Interdisciplinary material is arranged and made compatible in this book* It is a must as reference source

Progress in SOI Structures and Devices Operating at Extreme Conditions

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Author :
Publisher : Springer Science & Business Media
ISBN 13 : 9401003394
Total Pages : 349 pages
Book Rating : 4.4/5 (1 download)

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Book Synopsis Progress in SOI Structures and Devices Operating at Extreme Conditions by : Francis Balestra

Download or read book Progress in SOI Structures and Devices Operating at Extreme Conditions written by Francis Balestra and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 349 pages. Available in PDF, EPUB and Kindle. Book excerpt: A review of the electrical properties, performance and physical mechanisms of the main silicon-on-insulator (SOI) materials and devices. Particular attention is paid to the reliability of SOI structures operating in harsh conditions. The first part of the book deals with material technology and describes the SIMOX and ELTRAN technologies, the smart-cut technique, SiCOI structures and MBE growth. The second part covers reliability of devices operating under extreme conditions, with an examination of low and high temperature operation of deep submicron MOSFETs and novel SOI technologies and circuits, SOI in harsh environments and the properties of the buried oxide. The third part deals with the characterization of advanced SOI materials and devices, covering laser-recrystallized SOI layers, ultrashort SOI MOSFETs and nanostructures, gated diodes and SOI devices produced by a variety of techniques. The last part reviews future prospects for SOI structures, analyzing wafer bonding techniques, applications of oxidized porous silicon, semi-insulating silicon materials, self-organization of silicon dots and wires on SOI and some new physical phenomena.

Radiation Tolerant Electronics

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Author :
Publisher : MDPI
ISBN 13 : 3039212796
Total Pages : 210 pages
Book Rating : 4.0/5 (392 download)

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Book Synopsis Radiation Tolerant Electronics by : Paul Leroux

Download or read book Radiation Tolerant Electronics written by Paul Leroux and published by MDPI. This book was released on 2019-08-26 with total page 210 pages. Available in PDF, EPUB and Kindle. Book excerpt: Research on radiation-tolerant electronics has increased rapidly over the past few years, resulting in many interesting approaches to modeling radiation effects and designing radiation-hardened integrated circuits and embedded systems. This research is strongly driven by the growing need for radiation-hardened electronics for space applications, high-energy physics experiments such as those on the Large Hadron Collider at CERN, and many terrestrial nuclear applications including nuclear energy and nuclear safety. With the progressive scaling of integrated circuit technologies and the growing complexity of electronic systems, their susceptibility to ionizing radiation has raised many exciting challenges, which are expected to drive research in the coming decade. In this book we highlight recent breakthroughs in the study of radiation effects in advanced semiconductor devices, as well as in high-performance analog, mixed signal, RF, and digital integrated circuits. We also focus on advances in embedded radiation hardening in both FPGA and microcontroller systems and apply radiation-hardened embedded systems for cryptography and image processing, targeting space applications.

Design for Excellence in Electronics Manufacturing

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Publisher : John Wiley & Sons
ISBN 13 : 1119109388
Total Pages : 400 pages
Book Rating : 4.1/5 (191 download)

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Book Synopsis Design for Excellence in Electronics Manufacturing by : Cheryl Tulkoff

Download or read book Design for Excellence in Electronics Manufacturing written by Cheryl Tulkoff and published by John Wiley & Sons. This book was released on 2021-03-22 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: An authoritative guide to optimizing design for manufacturability and reliability from a team of experts Design for Excellence in Electronics Manufacturing is a comprehensive, state-of-the-art book that covers design and reliability of electronics. The authors—noted experts on the topic—explain how using the DfX concepts of design for reliability, design for manufacturability, design for environment, design for testability, and more, reduce research and development costs and decrease time to market and allow companies to confidently issue warranty coverage. By employing the concepts outlined in Design for Excellence in Electronics Manufacturing, engineers and managers can increase customer satisfaction, market share, and long-term profits. In addition, the authors describe the best practices regarding product design and show how the practices can be adapted for different manufacturing processes, suppliers, use environments, and reliability expectations. This important book: Contains a comprehensive review of the design and reliability of electronics Covers a range of topics: establishing a reliability program, design for the use environment, design for manufacturability, and more Includes technical information on electronic packaging, discrete components, and assembly processes Shows how aspects of electronics can fail under different environmental stresses Written for reliability engineers, electronics engineers, design engineers, component engineers, and others, Design for Excellence in Electronics Manufacturing is a comprehensive book that reveals how to get product design right the first time.

Optoelectronic Devices

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Publisher : Elsevier
ISBN 13 : 9780080444260
Total Pages : 602 pages
Book Rating : 4.4/5 (442 download)

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Book Synopsis Optoelectronic Devices by : M Razeghi

Download or read book Optoelectronic Devices written by M Razeghi and published by Elsevier. This book was released on 2004 with total page 602 pages. Available in PDF, EPUB and Kindle. Book excerpt: Tremendous progress has been made in the last few years in the growth, doping and processing technologies of the wide bandgap semiconductors. As a result, this class of materials now holds significant promis for semiconductor electronics in a broad range of applications. The principal driver for the current revival of interest in III-V Nitrides is their potential use in high power, high temperature, high frequency and optical devices resistant to radiation damage. This book provides a wide number of optoelectronic applications of III-V nitrides and covers the entire process from growth to devices and applications making it essential reading for those working in the semiconductors or microelectronics. Broad review of optoelectronic applications of III-V nitrides

High Tech Trash

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Author :
Publisher : Island Press
ISBN 13 : 1597263834
Total Pages : 351 pages
Book Rating : 4.5/5 (972 download)

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Book Synopsis High Tech Trash by : Elizabeth Grossman

Download or read book High Tech Trash written by Elizabeth Grossman and published by Island Press. This book was released on 2006-05-06 with total page 351 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Digital Age was expected to usher in an era of clean production, an alternative to smokestack industries and their pollutants. But as environmental journalist Elizabeth Grossman reveals in this penetrating analysis of high tech manufacture and disposal, digital may be sleek, but it's anything but clean. Deep within every electronic device lie toxic materials that make up the bits and bytes, a complex thicket of lead, mercury, cadmium, plastics, and a host of other often harmful ingredients. High Tech Trash is a wake-up call to the importance of the e-waste issue and the health hazards involved. Americans alone own more than two billion pieces of high tech electronics and discard five to seven million tons each year. As a result, electronic waste already makes up more than two-thirds of the heavy metals and 40 percent of the lead found in our landfills. But the problem goes far beyond American shores, most tragically to the cities in China and India where shiploads of discarded electronics arrive daily. There, they are "recycled"-picked apart by hand, exposing thousands of workers and community residents to toxics. As Grossman notes, "This is a story in which we all play a part, whether we know it or not. If you sit at a desk in an office, talk to friends on your cell phone, watch television, listen to music on headphones, are a child in Guangdong, or a native of the Arctic, you are part of this story." The answers lie in changing how we design, manufacture, and dispose of high tech electronics. Europe has led the way in regulating materials used in electronic devices and in e-waste recycling. But in the United States many have yet to recognize the persistent human health and environmental effects of the toxics in high tech devices. If Silent Spring brought national attention to the dangers of DDT and other pesticides, High Tech Trash could do the same for a new generation of technology's products.

Microscale Heat Transfer - Fundamentals and Applications

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Author :
Publisher : Springer Science & Business Media
ISBN 13 : 1402033613
Total Pages : 517 pages
Book Rating : 4.4/5 (2 download)

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Book Synopsis Microscale Heat Transfer - Fundamentals and Applications by : S. Kakaç

Download or read book Microscale Heat Transfer - Fundamentals and Applications written by S. Kakaç and published by Springer Science & Business Media. This book was released on 2006-05-20 with total page 517 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume contains an archival record of the NATO Advanced Institute on Microscale Heat Transfer – Fundamental and Applications in Biological and Microelectromechanical Systems held in Çesme – Izmir, Turkey, July 18–30, 2004. The ASIs are intended to be high-level teaching activity in scientific and technical areas of current concern. In this volume, the reader may find interesting chapters and various Microscale Heat Transfer Fundamental and Applications. The growing use of electronics, in both military and civilian applications has led to the widespread recognition for need of thermal packaging and management. The use of higher densities and frequencies in microelectronic circuits for computers are increasing day by day. They require effective cooling due to heat generated that is to be dissipated from a relatively low surface area. Hence, the development of efficient cooling techniques for integrated circuit chips is one of the important contemporary applications of Microscale Heat Transfer which has received much attention for cooling of high power electronics and applications in biomechanical and aerospace industries. Microelectromechanical systems are subject of increasing active research in a widening field of discipline. These topics and others are the main themeof this Institute.

Signal Integrity Issues and Printed Circuit Board Design

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Author :
Publisher : Prentice Hall Professional
ISBN 13 : 9780131418844
Total Pages : 418 pages
Book Rating : 4.4/5 (188 download)

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Book Synopsis Signal Integrity Issues and Printed Circuit Board Design by : Douglas Brooks

Download or read book Signal Integrity Issues and Printed Circuit Board Design written by Douglas Brooks and published by Prentice Hall Professional. This book was released on 2003 with total page 418 pages. Available in PDF, EPUB and Kindle. Book excerpt: Complicated concepts explained succinctly and in laymen's terms to both experienced and novice PCB designers. Numerous examples allow reader to visualize how high-end software simulators see various types of SI problems and then their solutions. Author is a frequent and recognized seminar leader in the industry.