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Handbook Of Thick Film Hybrid Microelectronics
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Book Synopsis Handbook of Thick Film Hybrid Microelectronics by : Charles A. Harper
Download or read book Handbook of Thick Film Hybrid Microelectronics written by Charles A. Harper and published by McGraw-Hill Companies. This book was released on 1974 with total page 712 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Handbook of Thick- and Thin-Film Hybrid Microelectronics by : Tapan Gupta
Download or read book Handbook of Thick- and Thin-Film Hybrid Microelectronics written by Tapan Gupta and published by Wiley-Interscience. This book was released on 2003-04-17 with total page 432 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the first handbook on the fabrication and design of hybrid microelectronic circuits. * Deals with all aspects of the technology, design, layout and processing of materials. * Fills the need for a comprehensive survey of a widely-used technology.
Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Book Synopsis Handbook of Thick Film Hybrid Microelectronics by : Charles A. Harper
Download or read book Handbook of Thick Film Hybrid Microelectronics written by Charles A. Harper and published by . This book was released on 1985 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Hybrid Microcircuit Technology Handbook by : James J. Licari
Download or read book Hybrid Microcircuit Technology Handbook written by James J. Licari and published by Elsevier. This book was released on 1998-12-31 with total page 603 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will be of value to materials and process engineers, chemists, and electrical engineers who design and test hybrid circuits.
Book Synopsis The Electronics Handbook by : Jerry C. Whitaker
Download or read book The Electronics Handbook written by Jerry C. Whitaker and published by CRC Press. This book was released on 2018-10-03 with total page 2640 pages. Available in PDF, EPUB and Kindle. Book excerpt: During the ten years since the appearance of the groundbreaking, bestselling first edition of The Electronics Handbook, the field has grown and changed tremendously. With a focus on fundamental theory and practical applications, the first edition guided novice and veteran engineers along the cutting edge in the design, production, installation, operation, and maintenance of electronic devices and systems. Completely updated and expanded to reflect recent advances, this second edition continues the tradition. The Electronics Handbook, Second Edition provides a comprehensive reference to the key concepts, models, and equations necessary to analyze, design, and predict the behavior of complex electrical devices, circuits, instruments, and systems. With 23 sections that encompass the entire electronics field, from classical devices and circuits to emerging technologies and applications, The Electronics Handbook, Second Edition not only covers the engineering aspects, but also includes sections on reliability, safety, and engineering management. The book features an individual table of contents at the beginning of each chapter, which enables engineers from industry, government, and academia to navigate easily to the vital information they need. This is truly the most comprehensive, easy-to-use reference on electronics available.
Book Synopsis Ceramic Interconnect Technology Handbook by : Fred D. Barlow, III
Download or read book Ceramic Interconnect Technology Handbook written by Fred D. Barlow, III and published by CRC Press. This book was released on 2018-10-03 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
Book Synopsis History of Wireless by : T. K. Sarkar
Download or read book History of Wireless written by T. K. Sarkar and published by John Wiley & Sons. This book was released on 2006-01-17 with total page 692 pages. Available in PDF, EPUB and Kindle. Book excerpt: Important new insights into how various components and systems evolved Premised on the idea that one cannot know a science without knowing its history, History of Wireless offers a lively new treatment that introduces previously unacknowledged pioneers and developments, setting a new standard for understanding the evolution of this important technology. Starting with the background-magnetism, electricity, light, and Maxwell's Electromagnetic Theory-this book offers new insights into the initial theory and experimental exploration of wireless. In addition to the well-known contributions of Maxwell, Hertz, and Marconi, it examines work done by Heaviside, Tesla, and passionate amateurs such as the Kentucky melon farmer Nathan Stubblefield and the unsung hero Antonio Meucci. Looking at the story from mathematical, physics, technical, and other perspectives, the clearly written text describes the development of wireless within a vivid scientific milieu. History of Wireless also goes into other key areas, including: The work of J. C. Bose and J. A. Fleming German, Japanese, and Soviet contributions to physics and applications of electromagnetic oscillations and waves Wireless telegraphic and telephonic development and attempts to achieve transatlantic wireless communications Wireless telegraphy in South Africa in the early twentieth century Antenna development in Japan: past and present Soviet quasi-optics at near-mm and sub-mm wavelengths The evolution of electromagnetic waveguides The history of phased array antennas Augmenting the typical, Marconi-centered approach, History of Wireless fills in the conventionally accepted story with attention to more specific, less-known discoveries and individuals, and challenges traditional assumptions about the origins and growth of wireless. This allows for a more comprehensive understanding of how various components and systems evolved. Written in a clear tone with a broad scientific audience in mind, this exciting and thorough treatment is sure to become a classic in the field.
Book Synopsis A Refresher Guide to Thin Film Technology by : Ashok K. Batra
Download or read book A Refresher Guide to Thin Film Technology written by Ashok K. Batra and published by Mahi Publication. This book was released on 2023-12-15 with total page 76 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thin films have significantly impacted the present modern era of technology and are considered the backbone of advanced applications in various fields, such as optical devices, environmental applications, telecommunications devices, energy storage, photovoltaic solar cells, integrated circuits, and others. The critical issue for all applications of thin films depends on their morphology and stability. The morphology of thin films strongly depends on the deposition techniques. Hence due to its multidisciplinary nature, a background in thin film technology requires skills such as chemistry, physics, electrical engineering, and materials science and engineering
Book Synopsis Ceramic Materials for Electronics by : Relva C. Buchanan
Download or read book Ceramic Materials for Electronics written by Relva C. Buchanan and published by CRC Press. This book was released on 2018-10-08 with total page 692 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Third Edition of Ceramic Materials for Electronics studies a wide range of ceramic materials, including insulators, conductors, piezoelectrics, and ferroelectrics, through detailed discussion of their properties, characterization, fabrication, and applications in electronics. The author summarizes the latest trends and advancements in the field, and explores important topics such as ceramic thin film, functional device technology, and thick film technology. Edited by a leading expert on the subject, this new edition includes more than 150 pages of new information; restructured reference materials, figures, and tables; as well as additional device application-oriented segments.
Book Synopsis Sensors for Safety and Process Control in Hydrogen Technologies by : Thomas Hübert
Download or read book Sensors for Safety and Process Control in Hydrogen Technologies written by Thomas Hübert and published by CRC Press. This book was released on 2018-10-09 with total page 387 pages. Available in PDF, EPUB and Kindle. Book excerpt: Understand, Select, and Design Sensors for Hydrogen-Based Applications The use of hydrogen generated from renewable energy sources is expected to become an essential component of a low-carbon, environmentally friendly energy supply, spurring the worldwide development of hydrogen technologies. Sensors for Safety and Process Control in Hydrogen Technologies provides practical, expert-driven information on modern sensors for hydrogen and other gases as well as physical parameters essential for safety and process control in hydrogen technologies. It illustrates how sensing technologies can ensure the safe and efficient implementation of the emerging global hydrogen market. The book explains the various facets of sensor technologies, including practical aspects relevant in hydrogen technologies. It presents a comprehensive and up-to-date account of the theory (physical and chemical principles), design, and implementations of sensors in hydrogen technologies. The authors also offer guidance on the development of new sensors based on the analysis of the capabilities and limitations of existing sensors with respect to current performance requirements. Suitable for both technical and non-technical personnel, the book provides a balance between detailed descriptions and simple explanations. It gives invaluable insight into the role sensors play as key enabling devices for both control and safety in established and emerging hydrogen technologies.
Author : Publisher :Elsevier ISBN 13 :0080945074 Total Pages :409 pages Book Rating :4.0/5 (89 download)
Download or read book written by and published by Elsevier. This book was released on with total page 409 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Copper Interconnect Technology by : Tapan Gupta
Download or read book Copper Interconnect Technology written by Tapan Gupta and published by Springer Science & Business Media. This book was released on 2010-01-22 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.
Book Synopsis The International Journal for Hybrid Microelectronics by :
Download or read book The International Journal for Hybrid Microelectronics written by and published by . This book was released on 1983 with total page 660 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Fundamentals of RF and Microwave Transistor Amplifiers by : Inder Bahl
Download or read book Fundamentals of RF and Microwave Transistor Amplifiers written by Inder Bahl and published by John Wiley & Sons. This book was released on 2009-06-17 with total page 696 pages. Available in PDF, EPUB and Kindle. Book excerpt: A Comprehensive and Up-to-Date Treatment of RF and Microwave Transistor Amplifiers This book provides state-of-the-art coverage of RF and microwave transistor amplifiers, including low-noise, narrowband, broadband, linear, high-power, high-efficiency, and high-voltage. Topics covered include modeling, analysis, design, packaging, and thermal and fabrication considerations. Through a unique integration of theory and practice, readers will learn to solve amplifier-related design problems ranging from matching networks to biasing and stability. More than 240 problems are included to help readers test their basic amplifier and circuit design skills-and more than half of the problems feature fully worked-out solutions. With an emphasis on theory, design, and everyday applications, this book is geared toward students, teachers, scientists, and practicing engineers who are interested in broadening their knowledge of RF and microwave transistor amplifier circuit design.
Download or read book Carbon written by Tapan Gupta and published by Springer. This book was released on 2017-10-25 with total page 327 pages. Available in PDF, EPUB and Kindle. Book excerpt: All living things contain carbon in some form, as it is the primary component of macromolecules including proteins, lipids, nucleic acids (RNA and DNA), and carbohydrates. As a matter of fact, it is the backbone of all organic (chemistry) compounds forming different kinds of bonds. Carbon: The Black, the Gray and the Transparent is not a complete scientific history of the material, but a book that describes key discoveries about this old faithful element while encouraging broader perspectives and approaches to its research due to its vast applications. All allotropes of carbon are described in this book, along with their properties, uses, and methods of procurement or manufacturing. Black carbon is represented by coal, gray carbon is represented by graphite, and transparent carbon is represented by diamond.
Book Synopsis MicroSystem Based on SiP Technology by : Suny Li
Download or read book MicroSystem Based on SiP Technology written by Suny Li and published by Springer Nature. This book was released on 2022-05-28 with total page 867 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new original concepts and thoughts, such as Function Density Law,Si3P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging. Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification. Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance for the research and development of SiP projects. This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case. Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.