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Fip 90 Pt T Modern Technology
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Book Synopsis FIP '90: pt. T. Modern technology by : Fédération internationale de la précontrainte. Congrès
Download or read book FIP '90: pt. T. Modern technology written by Fédération internationale de la précontrainte. Congrès and published by . This book was released on 1990 with total page 308 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Advanced Flip Chip Packaging by : Ho-Ming Tong
Download or read book Advanced Flip Chip Packaging written by Ho-Ming Tong and published by Springer Science & Business Media. This book was released on 2013-03-20 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Book Synopsis Materials for Advanced Packaging by : Daniel Lu
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Book Synopsis Soft Errors in Modern Electronic Systems by : Michael Nicolaidis
Download or read book Soft Errors in Modern Electronic Systems written by Michael Nicolaidis and published by Springer Science & Business Media. This book was released on 2010-09-24 with total page 331 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive presentation of the most advanced research results and technological developments enabling understanding, qualifying and mitigating the soft errors effect in advanced electronics, including the fundamental physical mechanisms of radiation induced soft errors, the various steps that lead to a system failure, the modelling and simulation of soft error at various levels (including physical, electrical, netlist, event driven, RTL, and system level modelling and simulation), hardware fault injection, accelerated radiation testing and natural environment testing, soft error oriented test structures, process-level, device-level, cell-level, circuit-level, architectural-level, software level and system level soft error mitigation techniques. The book contains a comprehensive presentation of most recent advances on understanding, qualifying and mitigating the soft error effect in advanced electronic systems, presented by academia and industry experts in reliability, fault tolerance, EDA, processor, SoC and system design, and in particular, experts from industries that have faced the soft error impact in terms of product reliability and related business issues and were in the forefront of the countermeasures taken by these companies at multiple levels in order to mitigate the soft error effects at a cost acceptable for commercial products. In a fast moving field, where the impact on ground level electronics is very recent and its severity is steadily increasing at each new process node, impacting one after another various industry sectors (as an example, the Automotive Electronics Council comes to publish qualification requirements on soft errors), research and technology developments and industrial practices have evolve very fast, outdating the most recent books edited at 2004.
Author :Thucydides Xanthopoulos Publisher :Springer Science & Business Media ISBN 13 :1441902619 Total Pages :339 pages Book Rating :4.4/5 (419 download)
Book Synopsis Clocking in Modern VLSI Systems by : Thucydides Xanthopoulos
Download or read book Clocking in Modern VLSI Systems written by Thucydides Xanthopoulos and published by Springer Science & Business Media. This book was released on 2009-08-19 with total page 339 pages. Available in PDF, EPUB and Kindle. Book excerpt: . . . ????????????????????????????????? ????????????? ????????????,????? ???? ??????????? ???????????????????? ???. THUCYDIDIS HISTORIAE IV:108 C. Hude ed. , Teubner, Lipsiae MCMXIII ???????????,????? ??,? ????????????????? ???????????????????? ?????? ?????? ?????? ??? ????????? ??? ?’ ?????????? ??’ ?????????? ? ??????? ??? ????????????? ???????. ???????????????????:108 ???????????? ?????????????????????? ?. ?????????????. ????????????,????? It being the fashion of men, what they wish to be true to admit even upon an ungrounded hope, and what they wish not, with a magistral kind of arguing to reject. Thucydides (the Peloponnesian War Part I), IV:108 Thomas Hobbes Trans. , Sir W. Molesworth ed. In The English Works of Thomas Hobbes of Malmesbury, Vol. VIII I have been introduced to clock design very early in my professional career when I was tapped right out of school to design and implement the clock generation and distribution of the Alpha 21364 microprocessor. Traditionally, Alpha processors - hibited highly innovative clocking systems, always worthy of ISSCC/JSSC publi- tions and for a while Alpha processors were leading the industry in terms of clock performance. I had huge shoes to ?ll. Obviously, I was overwhelmed, confused and highly con?dent that I would drag the entire project down.
Book Synopsis Scientific and Technical Aerospace Reports by :
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1992 with total page 590 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology by : John H. Lau
Download or read book Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology written by John H. Lau and published by Springer Nature. This book was released on with total page 515 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Comprehensive Semiconductor Science and Technology by :
Download or read book Comprehensive Semiconductor Science and Technology written by and published by Newnes. This book was released on 2011-01-28 with total page 3572 pages. Available in PDF, EPUB and Kindle. Book excerpt: Semiconductors are at the heart of modern living. Almost everything we do, be it work, travel, communication, or entertainment, all depend on some feature of semiconductor technology. Comprehensive Semiconductor Science and Technology, Six Volume Set captures the breadth of this important field, and presents it in a single source to the large audience who study, make, and exploit semiconductors. Previous attempts at this achievement have been abbreviated, and have omitted important topics. Written and Edited by a truly international team of experts, this work delivers an objective yet cohesive global review of the semiconductor world. The work is divided into three sections. The first section is concerned with the fundamental physics of semiconductors, showing how the electronic features and the lattice dynamics change drastically when systems vary from bulk to a low-dimensional structure and further to a nanometer size. Throughout this section there is an emphasis on the full understanding of the underlying physics. The second section deals largely with the transformation of the conceptual framework of solid state physics into devices and systems which require the growth of extremely high purity, nearly defect-free bulk and epitaxial materials. The last section is devoted to exploitation of the knowledge described in the previous sections to highlight the spectrum of devices we see all around us. Provides a comprehensive global picture of the semiconductor world Each of the work's three sections presents a complete description of one aspect of the whole Written and Edited by a truly international team of experts
Download or read book The Last Lecture written by Randy Pausch and published by . This book was released on 2010 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: The author, a computer science professor diagnosed with terminal cancer, explores his life, the lessons that he has learned, how he has worked to achieve his childhood dreams, and the effect of his diagnosis on him and his family.
Book Synopsis Primitive Technology by : John Plant
Download or read book Primitive Technology written by John Plant and published by Clarkson Potter. This book was released on 2019-10-29 with total page 194 pages. Available in PDF, EPUB and Kindle. Book excerpt: From the craftsman behind the popular YouTube channel Primitive Technology comes a practical guide to building huts and tools using only natural materials from the wild. John Plant, the man behind the channel, Primitive Technology, is a bonafide YouTube star. With almost 10 million subscribers and an average of 5 million views per video, John's channel is beloved by a wide-ranging fan base, from campers and preppers to hipster woodworkers and craftsmen. Now for the first time, fans will get a detailed, behind-the-scenes look into John's process. Featuring 50 projects with step-by-step instructions on how to make tools, weapons, shelters, pottery, clothing, and more, Primitive Technology is the ultimate guide to the craft. Each project is accompanied by illustrations as well as mini-sidebars with the history behind each item, plus helpful tips for building, material sourcing, and so forth. Whether you're a wilderness aficionado or just eager to spend more time outdoors, Primitive Technology has something for everyone's inner nature lover.
Book Synopsis The Current Trends of Optics and Photonics by : Cheng-Chung Lee
Download or read book The Current Trends of Optics and Photonics written by Cheng-Chung Lee and published by Springer. This book was released on 2014-11-25 with total page 543 pages. Available in PDF, EPUB and Kindle. Book excerpt: Optics and photonics offer new and vibrant approaches to meeting the challenges of the 21st century concerning energy conservation, education, agriculture, personal health and the environment. One of the most effective ways to address these global problems is to provide updated and reliable content on light-based technologies. Optical thin films and meta-materials, lasers, optical communications, light-emitting diodes, solar cells, liquid crystal technology, nanophotonics and biophotonics all play vital roles in enriching our lives. We hope to raise readers’ awareness of how optical technologies are now promoting sustainable development and providing reliable solutions to basic human needs. Furthermore, in order to broaden new research fields, we hope to inspire them to pursue further cutting-edge breakthroughs on the basis of the accomplishments that have already been made.
Book Synopsis Reflow Soldering Processes by : Ning-Cheng Lee
Download or read book Reflow Soldering Processes written by Ning-Cheng Lee and published by Newnes. This book was released on 2002-01-11 with total page 282 pages. Available in PDF, EPUB and Kindle. Book excerpt: Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process
Download or read book Transdex Index written by and published by . This book was released on 1990-09 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt: An index to translations issued by the United States Joint Publications Research Service (JPRS).
Book Synopsis Microelectronics Packaging Handbook by : R.R. Tummala
Download or read book Microelectronics Packaging Handbook written by R.R. Tummala and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 1060 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Book Synopsis Nano-Semiconductors by : Krzysztof Iniewski
Download or read book Nano-Semiconductors written by Krzysztof Iniewski and published by CRC Press. This book was released on 2018-09-03 with total page 602 pages. Available in PDF, EPUB and Kindle. Book excerpt: With contributions from top international experts from both industry and academia, Nano-Semiconductors: Devices and Technology is a must-read for anyone with a serious interest in future nanofabrication technologies. Taking into account the semiconductor industry’s transition from standard CMOS silicon to novel device structures—including carbon nanotubes (CNT), graphene, quantum dots, and III-V materials—this book addresses the state of the art in nano devices for electronics. It provides an all-encompassing, one-stop resource on the materials and device structures involved in the evolution from micro- to nanoelectronics. The book is divided into three parts that address: Semiconductor materials (i.e., carbon nanotubes, memristors, and spin organic devices) Silicon devices and technology (i.e., BiCMOS, SOI, various 3D integration and RAM technologies, and solar cells) Compound semiconductor devices and technology This reference explores the groundbreaking opportunities in emerging materials that will take system performance beyond the capabilities of traditional CMOS-based microelectronics. Contributors cover topics ranging from electrical propagation on CNT to GaN HEMTs technology and applications. Approaching the trillion-dollar nanotech industry from the perspective of real market needs and the repercussions of technological barriers, this resource provides vital information about elemental device architecture alternatives that will lead to massive strides in future development.
Book Synopsis Nanomagnetic and Spintronic Devices for Energy-Efficient Memory and Computing by : Jayasimha Atulasimha
Download or read book Nanomagnetic and Spintronic Devices for Energy-Efficient Memory and Computing written by Jayasimha Atulasimha and published by John Wiley & Sons. This book was released on 2016-03-07 with total page 356 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanomagnetic and spintronic computing devices are strong contenders for future replacements of CMOS. This is an important and rapidly evolving area with the semiconductor industry investing significantly in the study of nanomagnetic phenomena and in developing strategies to pinpoint and regulate nanomagnetic reliably with a high degree of energy efficiency. This timely book explores the recent and on-going research into nanomagnetic-based technology. Key features: Detailed background material and comprehensive descriptions of the current state-of-the-art research on each topic. Focuses on direct applications to devices that have potential to replace CMOS devices for computing applications such as memory, logic and higher order information processing. Discusses spin-based devices where the spin degree of freedom of charge carriers are exploited for device operation and ultimately information processing. Describes magnet switching methodologies to minimize energy dissipation. Comprehensive bibliographies included for each chapter enabling readers to conduct further research in this field. Written by internationally recognized experts, this book provides an overview of a rapidly burgeoning field for electronic device engineers, field-based applied physicists, material scientists and nanotechnologists. Furthermore, its clear and concise form equips readers with the basic understanding required to comprehend the present stage of development and to be able to contribute to future development. Nanomagnetic and Spintronic Devices for Energy-Efficient Memory and Computing is also an indispensable resource for students and researchers interested in computer hardware, device physics and circuits design.
Book Synopsis Current Status of Metal-on-Metal Hip Resurfacing, An Issue of Orthopedic Clinics by : Harlan Amstutz
Download or read book Current Status of Metal-on-Metal Hip Resurfacing, An Issue of Orthopedic Clinics written by Harlan Amstutz and published by Elsevier Health Sciences. This book was released on 2011-04-28 with total page 168 pages. Available in PDF, EPUB and Kindle. Book excerpt: Long Term Results of BHR and Lessons Learned, Effect of Patient Selection and Surgical Techniques on Outcome Results of Conserve Plus, Results and Use of Mono Block Cups (Thick vs Thin), Changes in High Activity After Resurfacing, Incidence and Prevention of Complications for Resurfacing, A Survey of Incidence of Pseudotumors with MOM Hip Resurfacing in Canadian Academic Centers, Effects of Component Orientation, Coverage, and Design on Ion Levels and ALTR After Hip Resurfacing: A Multi-Center Study, Imaging and In Vivo Validation of MARS MRI After Hip Resurfacing, Histological Features of Femoral Hip Resurfacing with Neck Narrowing, Risk Factors and Affects on Incidence on Pseudotumors, Promising New Techniques for Hip Resurfacing, Comparison of Functional Results of Hip Resurfacing and Total Hip Replacement, Indications, Techniques, and Results of Revision of Hip Resurfacing, Comparison of Cemented and Cementless Hip Resurfacing- A 2-5 year Follow-up
