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Electronic Packaging Materials Science Viii Volume 390
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Book Synopsis Electronic Packaging Materials Science VIII: Volume 390 by : Robert C. Sundahl
Download or read book Electronic Packaging Materials Science VIII: Volume 390 written by Robert C. Sundahl and published by . This book was released on 1995-09-26 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: The dynamic nature of the microelectronics industry, in particular within the area of packaging, requires a continuous updating and revision of priorities. In an effort to communicate these priorities to researchers and engineers in the field, the National Technology Road Map was developed. This proceedings volume, the eighth in a series on electronic packaging, focuses on the materials research, development and processing issues identified in the road map. Topics include: an overview of the National Technology Road Map for Semiconductors; institutional and industrial perspectives; impact on materials needs and materials science issues; and research responses. Technical subtopics include polymers, ceramics, solder and composites.
Book Synopsis Proceedings of the Symposium on High Rate Metal Dissolution Processes by : Madhav Datta
Download or read book Proceedings of the Symposium on High Rate Metal Dissolution Processes written by Madhav Datta and published by The Electrochemical Society. This book was released on 1996 with total page 362 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Reliability Prediction for Microelectronics by : Joseph B. Bernstein
Download or read book Reliability Prediction for Microelectronics written by Joseph B. Bernstein and published by John Wiley & Sons. This book was released on 2024-02-20 with total page 404 pages. Available in PDF, EPUB and Kindle. Book excerpt: RELIABILITY PREDICTION FOR MICROELECTRONICS Wiley Series in Quality & Reliability Engineering REVOLUTIONIZE YOUR APPROACH TO RELIABILITY ASSESSMENT WITH THIS GROUNDBREAKING BOOK Reliability evaluation is a critical aspect of engineering, without which safe performance within desired parameters over the lifespan of machines cannot be guaranteed. With microelectronics in particular, the challenges to evaluating reliability are considerable, and statistical methods for creating microelectronic reliability standards are complex. With nano-scale microelectronic devices increasingly prominent in modern life, it has never been more important to understand the tools available to evaluate reliability. Reliability Prediction for Microelectronics meets this need with a cluster of tools built around principles of reliability physics and the concept of remaining useful life (RUL). It takes as its core subject the ‘physics of failure’, combining a thorough understanding of conventional approaches to reliability evaluation with a keen knowledge of their blind spots. It equips engineers and researchers with the capacity to overcome decades of errant reliability physics and place their work on a sound engineering footing. Reliability Prediction for Microelectronics readers will also find: Focus on the tools required to perform reliability assessments in real operating conditions Detailed discussion of topics including failure foundation, reliability testing, acceleration factor calculation, and more New multi-physics of failure on DSM technologies, including TDDB, EM, HCI, and BTI Reliability Prediction for Microelectronics is ideal for reliability and quality engineers, design engineers, and advanced engineering students looking to understand this crucial area of product design and testing.
Book Synopsis National Semiconductor Metrology Program, Semiconductor Electronics Division, NIST List Of Publications, LP 103, March 1999 by :
Download or read book National Semiconductor Metrology Program, Semiconductor Electronics Division, NIST List Of Publications, LP 103, March 1999 written by and published by . This book was released on 1999 with total page 148 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis National Semiconductor Metrology Program by : National Institute of Standards and Technology (U.S.)
Download or read book National Semiconductor Metrology Program written by National Institute of Standards and Technology (U.S.) and published by . This book was released on 1999 with total page 148 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Electronic Packaging Materials Science IX: Volume 445 by : Steven K. Groothuis
Download or read book Electronic Packaging Materials Science IX: Volume 445 written by Steven K. Groothuis and published by . This book was released on 1997-10-20 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt: While this book continues the spirit of the MRS series on materials science related to the development of electronic packaging, it also focuses on three very specific technological areas - technology for flip-chip packaging, materials metrology and characterization, and packaging reliability and testing. These are important areas for technology development in electronic packaging, particularly since materials and processing play an important role in controlling system performance and reliability. Topics include: flip-chip and solder technology; future packaging technology; manufacturing technology in packaging; packaging materials and metrology; interfacial adhesion and fracture and packaging reliability and testing.
Book Synopsis Enabling Technology for MEMS and Nanodevices by : Henry Baltes
Download or read book Enabling Technology for MEMS and Nanodevices written by Henry Baltes and published by John Wiley & Sons. This book was released on 2013-03-27 with total page 441 pages. Available in PDF, EPUB and Kindle. Book excerpt: Mikro- und Nanotechnik haben Wissenschaft und Forschung revolutioniert. In Zukunft werden sie auch den Alltag verändern. Nun liegt der erste Band einer neuen Buchreihe vor: Advanced Micro and Nano Systems 1. Henry Baltes und seine Co-Autoren knüpfen mit AMN an die Sensors Update-Reihe an. Das Autorenteam wurde um weitere Experten erweitert. AMN wird zwei Mal pro Jahr mit einem neuen Band die aktuellen Entwicklungen in der Mikro- und Nano-Welt begleiten. Die Erforschung und der Einsatz von Mikro- und Nanosystemen sind eines der brandaktuellen Themen im Wissenschaftsbereich. Die Forschungsergebnisse werden mehr und mehr auch konkret umgesetzt. Damit werden Mikro- und Nanotechnologie zu Wirtschaftsfaktoren. Aktuelle Entwicklungen, neue Technologien, Nano-Bauelemente und Systeme im Mikromaßstab - Advanced Micro and Nano Systems, die neue Buchreihe, wird Spiegel der spannenden und faszinierenden Mikro- und Nano-Welt sein. Zweimal pro Jahr wird es einen neuen AMN-Band geben. Die Autoren sind ausgewiesene Spezialisten. Zu den Herausgebern zählt Henry Baltes, Professor an der ETH Zürich. Er zeichnete bereits für die Bände der Sensors Update-Reihe verantwortlich. Die Artikel ermöglichen Neueinsteigern einen ersten Zugriff auf die Materie. Fachleute erhalten einen umfassenden Überblick. Anspruch der Herausgeber ist es, nicht nur die theoretischen Grundlagen von Mikro- und Nanosystemen zu reflektieren, sondern immer auch praktische Möglichkeiten und die Grenzen der Anwendung im Blick zu haben. Die AMN-Bände sind Handbücher und Nachschlagewerke in einem. Die Reihe richtet sich an Vertreter unterschiedlicher Fachrichtungen: Biologie, Chemie, Mathematik, Sensorindustrie und Materialwissenschaften.
Book Synopsis National Semiconductor Metrology Program by : National Semiconductor Metrology Program (U.S.)
Download or read book National Semiconductor Metrology Program written by National Semiconductor Metrology Program (U.S.) and published by . This book was released on 1996 with total page 108 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Electronic Packaging Materials Science by :
Download or read book Electronic Packaging Materials Science written by and published by . This book was released on 1998 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis National Semiconductor Metrology Program, NIST List OF Publications, LP 103, May 2000 by :
Download or read book National Semiconductor Metrology Program, NIST List OF Publications, LP 103, May 2000 written by and published by . This book was released on 2000 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Materials Reliability in Microelectronics V: Volume 391 by : Anthony S. Oates
Download or read book Materials Reliability in Microelectronics V: Volume 391 written by Anthony S. Oates and published by . This book was released on 1995-10-24 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt: This long-standing proceedings series is highly regarded as a premier forum for the discussion of microelectronics reliability issues. In this fifth book, emphasis is on the fundamental understanding of failure phenomena in thin-film materials. Special attention is given to electromigration and mechanical stress effects. The reliability of thin dielectrics and hot carrier degradation of transistors are also featured. Topics include: modeling and simulation of failure mechanisms; reliability issues for submicron IC technologies and packaging; stresses in thin films/lines; gate oxides; barrier layers; electromigration mechanisms; reliability issues for Cu metallizations; electromigration and microstructure; electromigration and stress voiding in circuit interconnects; and resistance measurements of electromigration damage.
Book Synopsis Scientific Basis for Nuclear Waste Management XIX: Volume 412 by : Materials Research Society. Meeting
Download or read book Scientific Basis for Nuclear Waste Management XIX: Volume 412 written by Materials Research Society. Meeting and published by . This book was released on 1996-04-03 with total page 968 pages. Available in PDF, EPUB and Kindle. Book excerpt: Safe and effective management of nuclear waste provides a broad range of challenges for materials science. Waste processing, waste form and engineered barrier properties, interactions between engineered and geological systems, radiation effects, chemistry and transport of waste species, and long-term predictions of repository performance are just some of the scientific problems facing modern society. This book, the nineteenth in a very successful series from MRS, offers an international and interdisciplinary perspective on the issues, and features developments in both fundamental and applied areas. Topics include: excess plutonium dispositioning; spent nuclear fuel; glass waste forms; ceramic and crystalline waste forms; cement waste forms; waste processing; waste container materials; speciation and sorption; bentonite barriers; flow and transport; repository site characterization; natural analogs and performance assessment.
Book Synopsis Metal-Organic Chemical Vapor Deposition of Electronic Ceramics II: Volume 415 by : Seshu B. Desu
Download or read book Metal-Organic Chemical Vapor Deposition of Electronic Ceramics II: Volume 415 written by Seshu B. Desu and published by . This book was released on 1996-02-28 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt: The use of high-performance ceramic materials in microelectronics holds the potential for the development of a wide range of novel, high-value products. For example, ferroelectric ceramic capacitors are key to the development of high-density ferroelectric nonvolatile memory (FRAM). High-dielectric constant para-electric capacitors are potentially useful for the production of high-density dynamic random access memory (DRAM) and for decoupling capacitors in high-speed microprocessors. Electro-optic materials are useful as waveguides, tunable filters and switches in advance communication applications. Researchers come together in this book to discuss both the application of metal-organic chemical vapor deposited (MOCVD) materials to microelectronics and the 'nuts and bolts' of the technique. A wide variety of opto-electronic, superconducting, ferroelectric and other advanced ceramic materials are discussed. Problems of dealing with low-volatility precursors, design of new precursors, and characterization of CVD processes are addressed. Topics include: nonoxide ceramics; precursor chemistry and delivery; process analysis and characterization; and oxide ceramics.
Book Synopsis In Situ Electron and Tunneling Microscopy of Dynamic Processes: Volume 404 by : Renu Sharma
Download or read book In Situ Electron and Tunneling Microscopy of Dynamic Processes: Volume 404 written by Renu Sharma and published by . This book was released on 1996-08-26 with total page 250 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electron microscopy techniques are among the most powerful methods for characterization of materials, with the ability to reveal both the atomic-scale structure and composition. This information may be used to elucidate macroscopic properties or to optimize materials synthesis and processing. Instrumentation and techniques for dynamic in situ experiments are undergoing rapid development and have recently been applied to a wide range of problems. This book focuses on time-resolved electron microscopy (including diffraction and spectroscopy), as well as novel instrumentation for temperature and pressure control. In addition to discussing the application of electron microscopy techniques to the in situ study of the kinetics, thermodynamics and mechanisms of reaction, the book also explores their utility as efficient methods of optimizing processing conditions. Imaging techniques featured include: scanning tunneling microscopy, high-resolution electron microscopy, dark field transmission and reflection electron microscopy, Lorentz microscopy, electron holography, scanning and low-energy electron microscopy and photoemission electron microscopy
Book Synopsis Strained Layer Epitaxy: Volume 379 by : Eugene Fitzgerald
Download or read book Strained Layer Epitaxy: Volume 379 written by Eugene Fitzgerald and published by . This book was released on 1995-11-09 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt: An interdisciplinary discussion of key materials issues and controversies in strained layer epitaxy is presented in this new volume from MRS. Research involving GeSi alloys and Si:C alloys are well represented. In the case of GeSi alloys, utilizing both strained and relaxed structures appears to be a strong component of the current research. Applications, devices and synthesis of improved relaxed and strained materials are featured. Special efforts to integrate the III-V and IV communities were also made during this symposium, and those efforts are reflected in the proceedings volume as well. Results on compositional graded layers in both the GeSi and III-V materials systems are presented. Topics include: general issues; ordering/low dimensional structures; characterization; device applications; growth of Si-based materials; and growth of compound semiconductors.
Book Synopsis International Symposium on Advanced Packaging Materials by :
Download or read book International Symposium on Advanced Packaging Materials written by and published by . This book was released on 2005 with total page 322 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Surface/interface and Stress Effects in Electronic Material Nanostructures by : S. M. Prokes
Download or read book Surface/interface and Stress Effects in Electronic Material Nanostructures written by S. M. Prokes and published by . This book was released on 1996 with total page 576 pages. Available in PDF, EPUB and Kindle. Book excerpt:
