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Dynamic Fracture Of Solar Grade Single Crystalline Silicon Wafers
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Book Synopsis Dynamic Fracture of Solar Grade Single Crystalline Silicon Wafers by : Meng Wang
Download or read book Dynamic Fracture of Solar Grade Single Crystalline Silicon Wafers written by Meng Wang and published by . This book was released on 2019 with total page 142 pages. Available in PDF, EPUB and Kindle. Book excerpt: Crystalline silicon has attracted substantial attention for decades because of its large applications in solar cells and microelectromechanical systems. The high brittleness of silicon raises wide concerns since the failure of this semiconductor material increases the manufacturing cost and decreases the efficiency of the utilization of Si-based devices. Crack propagation of crystalline silicon is the main cause of catastrophic failure of silicon components. It has been intensively studied but is not fully understood yet due to intricate dynamic fracture behavior linked to small-scale phenomena. Therefore, the development of feasible methods to study the dynamic fracture, as well as the deeper understanding of fracture mechanism of crystalline silicon, are of paramount importance to improve the reliability and durability of Si-based systems for both industrial and scientific practitioners. In this work, dynamic fracture behavior of solar-grade single crystalline silicon wafers under mechanical loads was studied. We carried out fracture experiments on (001) silicon wafers using three-line or four-line bending apparatus under quasi-static loading. The entire fracture process was captured using a high-speed camera and was analyzed by the high-speed imaging technique. We studied the post-mortem fracture surface using a digital microscope, a laser scanning profilometer, as well as an atomic force microscope. The failure source of the silicon wafer was identified using fractographic analysis. Coupling the crack velocity measurement and fractographic analysis, we determined the crack front during dynamic crack propagation, which exhibits a velocity-dependent shape. We revealed the source of (110)-(111) cleavage plane deflection phenomena during high-speeding crack propagation under line-contact effects. Besides, jointly with the finite element simulations, we demonstrated how dynamics of the crack front is governed by the crystallographic direction-dependent dynamic fracture toughness. Finally, in comparison with the Wallner lines on the fracture surface, generated by linear perturbations of elastic waves on the crack front, we highlight the nucleation and strong nonlinear characteristics of out-of-plane corrugation waves, leaving specific markings that alter the surface roughness of asperity-free material.
Book Synopsis On the Fracture of Solar Grade Crystalline Silicon Wafer by : Lv Zhao
Download or read book On the Fracture of Solar Grade Crystalline Silicon Wafer written by Lv Zhao and published by . This book was released on 2016 with total page 183 pages. Available in PDF, EPUB and Kindle. Book excerpt: The profitability of silicon solar cells is a critical point for the PV market and it requires improved electrical performance, lower wafer production costs and enhancing reliability and durability of the cells. Innovative processes are emerging that provide thinner wafers with less raw material loss. But the induced crystallinity and distribution of defects compared to the classical wafers are unclear. It is therefore necessary to develop methods of microstructural and mechanical characterization to assess the rigidity and mechanical strength of these materials. In this work, 4-point bending tests were performed under quasi-static loading. This allowed to conduct both the stiffness estimation and the rupture study. A high speed camera was set up in order to track the fracture process thanks to a 45° tilted mirror. Fractographic analysis were performed using confocal optical microscope, scanning electron microscope and atomic force microscope. Electron Back-Scatter Diffraction and Laue X-Ray diffraction were used to explore the relationship between the microstructural grains orientations/textures of our material and the observed mechanical behavior. Jointly, finite element modeling and simulations were carried out to provide auxiliary characterization tools and help to understand the involved fracture mechanism. Thanks to the experiment-simulation coupled method, we have assessed accurately the rigidity of silicon wafers stemming from different manufacturing processes. A fracture origin identification strategy has been proposed combining high speed imaging and post-mortem fractography. Fracture investigations on silicon single crystals have highlighted the deflection free (110) cleavage path, the high initial crack velocity, the velocity dependent crack front shape and the onset of front waves in high velocity crack propagation. The investigations on the fracture of multi-crystalline wafers demonstrate a systematic transgranular cracking. Furthermore, thanks to twin multi-crystalline silicon plates, we have addressed the crack path reproducibility. A special attention has been paid to the nature of the cleavage planes and the grain boundaries barrier effect. Finally, based on these observations, an extended finite element model (XFEM) has been carried out which fairly reproduces the experimental crack path.
Book Synopsis Detection of Cracks in Single-crystalline Silicon Wafers Using Impact Testing by : Christina Hilmersson
Download or read book Detection of Cracks in Single-crystalline Silicon Wafers Using Impact Testing written by Christina Hilmersson and published by . This book was released on 2006 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: ABSTRACT: This thesis is about detection of cracks in single-crystalline silicon wafers by using a vibration method in the form of an impact test. The goal to detect cracks from vibration measurements introduced by striking the silicon wafer with an impact hammer. Such a method would reduce costs in the production of solar cells. It is an inexpensive, relatively simple method which if commercialized could be used as an efficient in-line production quality test. A hammer is used as the actuator and a microphone as the response sensor. A signal analyzer is used to collect the data and to compute frequency response. Parameters of interest are audible natural frequencies, peak magnitudes, damping ratio and coherence. The data reveals that there are differences in frequency between the cracked silicon wafers and the non-cracked silicon wafers. The resonant peaks in the defective wafers were not as sharp (i.e., lightly damped) and occurred at lower frequencies (i.e., lower stiffness) with a lower magnitude and a higher damping ratio. These differences could be used to detect damaged product in a solar cell production line.
Book Synopsis Experimental and Molecular Dynamics Determination of Fractal Fracture in Single Crystal Silicon by : Yueh-Long Tsai
Download or read book Experimental and Molecular Dynamics Determination of Fractal Fracture in Single Crystal Silicon written by Yueh-Long Tsai and published by . This book was released on 1993 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Mechanics of Microsystems by : Alberto Corigliano
Download or read book Mechanics of Microsystems written by Alberto Corigliano and published by John Wiley & Sons. This book was released on 2017-11-20 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: Mechanics of Microsystems Alberto Corigliano, Raffaele Ardito, Claudia Comi, Attilio Frangi, Aldo Ghisi and Stefano Mariani, Politecnico di Milano, Italy A mechanical approach to microsystems, covering fundamental concepts including MEMS design, modelling and reliability Mechanics of Microsystems takes a mechanical approach to microsystems and covers fundamental concepts including MEMS design, modelling and reliability. The book examines the mechanical behaviour of microsystems from a ‘design for reliability’ point of view and includes examples of applications in industry. Mechanics of Microsystems is divided into two main parts. The first part recalls basic knowledge related to the microsystems behaviour and offers an overview on microsystems and fundamental design and modelling tools from a mechanical point of view, together with many practical examples of real microsystems. The second part covers the mechanical characterization of materials at the micro-scale and considers the most important reliability issues (fracture, fatigue, stiction, damping phenomena, etc) which are fundamental to fabricate a real working device. Key features: Provides an overview of MEMS, with special focus on mechanical-based Microsystems and reliability issues. Includes examples of applications in industry. Accompanied by a website hosting supplementary material. The book provides essential reading for researchers and practitioners working with MEMS, as well as graduate students in mechanical, materials and electrical engineering.
Book Synopsis IC-processed Polysilicon Micromechanics by : Yu-Chong Tai
Download or read book IC-processed Polysilicon Micromechanics written by Yu-Chong Tai and published by . This book was released on 1989 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Springer Handbook of Nanotechnology by : Bharat Bhushan
Download or read book Springer Handbook of Nanotechnology written by Bharat Bhushan and published by Springer Science & Business Media. This book was released on 2010-04-23 with total page 1968 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since 2004 and with the 2nd edition in 2006, the Springer Handbook of Nanotechnology has established itself as the definitive reference in the nanoscience and nanotechnology area. It integrates the knowledge from nanofabrication, nanodevices, nanomechanics, Nanotribology, materials science, and reliability engineering in just one volume. Beside the presentation of nanostructures, micro/nanofabrication, and micro/nanodevices, special emphasis is on scanning probe microscopy, nanotribology and nanomechanics, molecularly thick films, industrial applications and microdevice reliability, and on social aspects. In its 3rd edition, the book grew from 8 to 9 parts now including a part with chapters on biomimetics. More information is added to such fields as bionanotechnology, nanorobotics, and (bio)MEMS/NEMS, bio/nanotribology and bio/nanomechanics. The book is organized by an experienced editor with a universal knowledge and written by an international team of over 150 distinguished experts. It addresses mechanical and electrical engineers, materials scientists, physicists and chemists who work either in the nano area or in a field that is or will be influenced by this new key technology.
Download or read book Microelectromechanical Systems written by and published by . This book was released on 2000 with total page 756 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book CMOS - MEMS written by Henry Baltes and published by John Wiley & Sons. This book was released on 2013-03-26 with total page 610 pages. Available in PDF, EPUB and Kindle. Book excerpt: This edition of 'CMOS-MEMS' was originally published in the successful series 'Advanced Micro & Nanosystems'. Here, the combination of the globally established, billion dollar chip mass fabrication technology CMOS with the fascinating and commercially promising new world of MEMS is covered from all angles. The book introduces readers to this fi eld and takes them from fabrication technologies and material charaterization aspects to the actual applications of CMOS-MEMS - a wide range of miniaturized physical, chemical and biological sensors and RF systems. Vital knowledge on circuit and system integration issues concludes this in-depth treatise, illustrating the advantages of combining CMOS and MEMS in the first place, rather than having a hybrid solution.
Book Synopsis Engineering Against Fracture by : S. G. Pantelakis
Download or read book Engineering Against Fracture written by S. G. Pantelakis and published by Springer Science & Business Media. This book was released on 2009-02-14 with total page 554 pages. Available in PDF, EPUB and Kindle. Book excerpt: Within the last thirty years there is a growing acknowledgement that prevention of catastrophic failures necessitates engagement of a large pool of expertise. Herein it is not excessive to seek advice from disciplines like materials science, structural engineering, mathematics, physics, reliability engineering and even economics. Today’s engineering goals, independently of size; do not have the luxury of being outsideaglobalperspective.Survivaloftheintegratedmarketsand?nancialsystems require a web of safe transportation, energy production and product manufacturing. It is perhaps the ?rst decade in engineering history that multidisciplinary - proaching is not just an idea that needs to materialise but has matured beyond infancy. We can witness such transition by examining engineering job descriptions and postgraduate curricula. The undertaking of organising a conference to re?ect the above was not easy and de?nitely, not something that was brought to life without a lot of work and c- st mitment. The 1 Conference of Engineering Against Fracture from its conceptual day until completion was designed in a way of underlying the need of bringing all the key players on a common ground that once properly cultivated can ?ourish. To achieve that the conference themes were numerous and despite their, in principle notional differences, it was apparent that the attendees established such common ground through argumentation. The reader can see this from the variety of research areas re?ected by the works and keynote lecturers presented.
Book Synopsis Scientific and Technical Aerospace Reports by :
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1995 with total page 692 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Silicon Devices by : Kenneth A. Jackson
Download or read book Silicon Devices written by Kenneth A. Jackson and published by John Wiley & Sons. This book was released on 2008-11-21 with total page 210 pages. Available in PDF, EPUB and Kindle. Book excerpt: Silicon is the most important material for the electronics industry. In modern microelectronics silicon devices like diodes and transistors play a major role, and devices like photodetectors or solar cells gain ever more importance. This concise handbook deals with one of the most important topics for the electronics industry. World renowned authors have contributed to this unique overview of the processing of silicon and silicon devices.
Download or read book NBS Special Publication written by and published by . This book was released on 1968 with total page 452 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Dynamic Fracture Mechanics by : L. B. Freund
Download or read book Dynamic Fracture Mechanics written by L. B. Freund and published by Cambridge University Press. This book was released on 1998-03-28 with total page 592 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume focuses on the development and analysis of mathematical models of fracture phenomena.
Book Synopsis Crystal Growth and Evaluation of Silicon for VLSI and ULSI by : Golla Eranna
Download or read book Crystal Growth and Evaluation of Silicon for VLSI and ULSI written by Golla Eranna and published by CRC Press. This book was released on 2014-12-08 with total page 432 pages. Available in PDF, EPUB and Kindle. Book excerpt: Silicon, as a single-crystal semiconductor, has sparked a revolution in the field of electronics and touched nearly every field of science and technology. Though available abundantly as silica and in various other forms in nature, silicon is difficult to separate from its chemical compounds because of its reactivity. As a solid, silicon is chemically inert and stable, but growing it as a single crystal creates many technological challenges. Crystal Growth and Evaluation of Silicon for VLSI and ULSI is one of the first books to cover the systematic growth of silicon single crystals and the complete evaluation of silicon, from sand to useful wafers for device fabrication. Written for engineers and researchers working in semiconductor fabrication industries, this practical text: Describes different techniques used to grow silicon single crystals Explains how grown single-crystal ingots become a complete silicon wafer for integrated-circuit fabrication Reviews different methods to evaluate silicon wafers to determine suitability for device applications Analyzes silicon wafers in terms of resistivity and impurity concentration mapping Examines the effect of intentional and unintentional impurities Explores the defects found in regular silicon-crystal lattice Discusses silicon wafer preparation for VLSI and ULSI processing Crystal Growth and Evaluation of Silicon for VLSI and ULSI is an essential reference for different approaches to the selection of the basic silicon-containing compound, separation of silicon as metallurgical-grade pure silicon, subsequent purification, single-crystal growth, and defects and evaluation of the deviations within the grown crystals.
Book Synopsis Handbook of Micro/Nano Tribology by : Bharat Bushan
Download or read book Handbook of Micro/Nano Tribology written by Bharat Bushan and published by CRC Press. This book was released on 2020-10-28 with total page 884 pages. Available in PDF, EPUB and Kindle. Book excerpt: This second edition of Handbook of Micro/Nanotribology addresses the rapid evolution within this field, serving as a reference for the novice and the expert alike. Two parts divide this handbook: Part I covers basic studies, and Part II addresses design, construction, and applications to magnetic storage devices and MEMS. Discussions include: surface physics and methods for physically and chemically characterizing solid surfaces roughness characterization and static contact models using fractal analysis sliding at the interface and friction on an atomic scale scratching and wear as a result of sliding nanofabrication/nanomachining as well as nano/picoindentation lubricants for minimizing friction and wear surface forces and microrheology of thin liquid films measurement of nanomechanical properties of surfaces and thin films atomic-scale simulations of interfacial phenomena micro/nanotribology and micro/nanomechanics of magnetic storage devices This comprehensive book contains 16 chapters contributed by more than 20 international researchers. In each chapter, the presentation starts with macroconcepts and then lead to microconcepts. With more than 500 illustrations and 50 tables, Handbook of Micro/Nanotribology covers the range of relevant topics, including characterization of solid surfaces, measurement techniques and applications, and theoretical modeling of interfaces. What's New in the Second Edition? New chapters on: AFM instrumentation Surface forces and adhesion Design and construction of magnetic storage devices Microdynamical devices and systems Mechanical properties of materials in microstructure Micro/nanotribology and micro/nanomechanics of MEMS devices
Book Synopsis Publications of the National Institute of Standards and Technology ... Catalog by : National Institute of Standards and Technology (U.S.)
Download or read book Publications of the National Institute of Standards and Technology ... Catalog written by National Institute of Standards and Technology (U.S.) and published by . This book was released on 1983 with total page 442 pages. Available in PDF, EPUB and Kindle. Book excerpt:
