Development of Vertical Bulk Gallium Nitride Power Devices

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Publisher :
ISBN 13 :
Total Pages : 92 pages
Book Rating : 4.:/5 (114 download)

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Book Synopsis Development of Vertical Bulk Gallium Nitride Power Devices by : Ayrton D. Muñoz

Download or read book Development of Vertical Bulk Gallium Nitride Power Devices written by Ayrton D. Muñoz and published by . This book was released on 2019 with total page 92 pages. Available in PDF, EPUB and Kindle. Book excerpt: Gallium nitride (GaN) is a promising material for power electronics due to its outstanding properties, such as high critical electric field and large bandgap. Despite its superior intrinsic properties, fabrication processes and technology for vertical GaN power electronics is still not as mature as in conventional materials. This thesis covers three aspects of vertical power devices on bulk GaN to increase their reliability and performance. The first is the breakdown behavior of GaN under high electric fields. Vertical Schottky diodes with multi-finger anodes are simulated, fabricated and characterized. Evidence of impact ionization and signs of avalanche breakdown are shown. The second aspect is scalable fabrication technologies for vertical power FinFETs. Key processing stesps are refined and demonstrated on large-area devices. The final topic covered is GaN superjunction (SJ) technology in the context vertical power FinFETs. The SJ FinFET concept is first introduced then an underutilized method for p-type doping GaN is explored as an alternative to conventional p-type regrowth and ion implantation. Finally, the proposed GaN SJ FinFET is investigated with simulations. Various standard SJ parameters are optimized and a novel electric field management technique is proposed.

Gallium Nitride Power Devices

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Publisher : CRC Press
ISBN 13 : 1351767607
Total Pages : 301 pages
Book Rating : 4.3/5 (517 download)

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Book Synopsis Gallium Nitride Power Devices by : Hongyu Yu

Download or read book Gallium Nitride Power Devices written by Hongyu Yu and published by CRC Press. This book was released on 2017-07-06 with total page 301 pages. Available in PDF, EPUB and Kindle. Book excerpt: GaN is considered the most promising material candidate in next-generation power device applications, owing to its unique material properties, for example, bandgap, high breakdown field, and high electron mobility. Therefore, GaN power device technologies are listed as the top priority to be developed in many countries, including the United States, the European Union, Japan, and China. This book presents a comprehensive overview of GaN power device technologies, for example, material growth, property analysis, device structure design, fabrication process, reliability, failure analysis, and packaging. It provides useful information to both students and researchers in academic and related industries working on GaN power devices. GaN wafer growth technology is from Enkris Semiconductor, currently one of the leading players in commercial GaN wafers. Chapters 3 and 7, on the GaN transistor fabrication process and GaN vertical power devices, are edited by Dr. Zhihong Liu, who has been working on GaN devices for more than ten years. Chapters 2 and 5, on the characteristics of polarization effects and the original demonstration of AlGaN/GaN heterojunction field-effect transistors, are written by researchers from Southwest Jiaotong University. Chapters 6, 8, and 9, on surface passivation, reliability, and package technologies, are edited by a group of researchers from the Southern University of Science and Technology of China.

Vertical GaN and SiC Power Devices

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Publisher : Artech House
ISBN 13 : 1630814296
Total Pages : 284 pages
Book Rating : 4.6/5 (38 download)

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Book Synopsis Vertical GaN and SiC Power Devices by : Kazuhiro Mochizuki

Download or read book Vertical GaN and SiC Power Devices written by Kazuhiro Mochizuki and published by Artech House. This book was released on 2018-04-30 with total page 284 pages. Available in PDF, EPUB and Kindle. Book excerpt: This unique new resource provides a comparative introduction to vertical Gallium Nitride (GaN) and Silicon Carbide (SiC) power devices using real commercial device data, computer, and physical models. This book uses commercial examples from recent years and presents the design features of various GaN and SiC power components and devices. Vertical verses lateral power semiconductor devices are explored, including those based on wide bandgap materials. The abstract concepts of solid state physics as they relate to solid state devices are explained with particular emphasis on power solid state devices. Details about the effects of photon recycling are presented, including an explanation of the phenomenon of the family tree of photon-recycling. This book offers in-depth coverage of bulk crystal growth of GaN, including hydride vapor-phase epitaxial (HVPE) growth, high-pressure nitrogen solution growth, sodium-flux growth, ammonothermal growth, and sublimation growth of SiC. The fabrication process, including ion implantation, diffusion, oxidation, metallization, and passivation is explained. The book provides details about metal-semiconductor contact, unipolar power diodes, and metal-insulator-semiconductor (MIS) capacitors. Bipolar power diodes, power switching devices, and edge terminations are also covered in this resource.

Gallium Nitride Vertical Devices for High-power and High-frequency Applications

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Publisher :
ISBN 13 :
Total Pages : 0 pages
Book Rating : 4.5/5 (825 download)

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Book Synopsis Gallium Nitride Vertical Devices for High-power and High-frequency Applications by : Siwei Li

Download or read book Gallium Nitride Vertical Devices for High-power and High-frequency Applications written by Siwei Li and published by . This book was released on 2020 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Gallium nitride (GaN) has gained considerable interest in the areas of power electronics and radio frequency (RF) devices in recent years due to its significantly higher material figure-of-merits (FOMs) than silicon (Si). The capability of operating faster as power switches also overwhelms another wide-bandgap contender, silicon carbide (SiC), especially for applications at ~600-1200 V level. GaN devices with a lateral topology such as high electron mobility transistors (HEMTs) have been extensively studied, while the development of vertical devices on high-quality free-standing GaN substrates is opening new opportunities towards improved power handling capability in high-power applications. There are still science and technology issues associated with GaN that limit its applications in high-power scenarios. One of the fundamental properties is its avalanche behavior, which is expected to be considered as a benchmark for the material but was rarely seen in GaN devices grown on foreign substrates, including sapphire, Si and SiC. Avalanche is observed and gaining increasing attention recently with the improvement of GaN-on-GaN substrate, especially in diodes. Several issues of GaN in high-power and high-speed applications are addressed in the present work. Edge terminations play a vital role in GaN devices targeting a high voltage range, and enable avalanche by optimizing the electric filed distribution, eliminating peak electric field at device edges. An ion-compensated moat etch structure is studied on GaN vertical p-n diodes. Parameters including moat etching depth and ion implantation dose are optimized. P-n diodes with a breakdown voltage (V[subscript BR]) of 1500 V and a specific on-state resistance (R[subscript ON,sp]) of 0.7 m[omega]·cm2 is demonstrated with the optimized structure, showing a device FOM of 3.2 GW·cm−2 and avalanche behavior. With avalanche performance as a prerequisite confirmed on vertical p-n diodes on bulk GaN substrates with dislocation density ranging from 1e4 cm−2 to 1e6 cm−2, the effect of dislocation density on device behavior, especially off-state leakage current is experimentally and studied in detail. The leakage mechanism is analyzed by considering its relationship to electric field and temperature. Lower leakage could be achieved on the substrate with 1e4 cm−2 dislocation density, with variable-range-hopping (VRH) procedure dominating low electric field range and Poole-Frenkel (PF) effect dominating the higher part, while VRH and other more trap-related processes may play more roles on the substrate with 1e6 cm−2 dislocation density. Large current capability is another factor for high-power applications. A DC current up to 50 A is successfully demonstrated on large-area p-n diodes by applying backside gold-to-gold thermal compression bonding. A successful scaling-up is achieved with essential factors studied. There have been few works on the RF performance of GaN vertical devices though the lateral RF devices have been widely explored. To study RF properties of GaN vertical devices, a Silvaco TCAD simulation model is established for nitride (N)-polar GaN current aperture vertical electron transistor (CAVET) based on a fitting of N-polar lateral HEMT experimental results. DC and RF properties of an N-polar CAVET are simulated, and a maximum output power of 15 W·mm−1 is expected. To experimentally demonstrate RF characteristics of a CAVET, the 1st-generation RF CAVET is then built on gallium (Ga)-polar substrate. Based on the DC characteristics, a current gain cutoff frequency (fT) at ~13 GHz is expected.

Power GaN Devices

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Publisher : Springer
ISBN 13 : 3319431994
Total Pages : 383 pages
Book Rating : 4.3/5 (194 download)

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Book Synopsis Power GaN Devices by : Matteo Meneghini

Download or read book Power GaN Devices written by Matteo Meneghini and published by Springer. This book was released on 2016-09-08 with total page 383 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the first comprehensive overview of the properties and fabrication methods of GaN-based power transistors, with contributions from the most active research groups in the field. It describes how gallium nitride has emerged as an excellent material for the fabrication of power transistors; thanks to the high energy gap, high breakdown field, and saturation velocity of GaN, these devices can reach breakdown voltages beyond the kV range, and very high switching frequencies, thus being suitable for application in power conversion systems. Based on GaN, switching-mode power converters with efficiency in excess of 99 % have been already demonstrated, thus clearing the way for massive adoption of GaN transistors in the power conversion market. This is expected to have important advantages at both the environmental and economic level, since power conversion losses account for 10 % of global electricity consumption. The first part of the book describes the properties and advantages of gallium nitride compared to conventional semiconductor materials. The second part of the book describes the techniques used for device fabrication, and the methods for GaN-on-Silicon mass production. Specific attention is paid to the three most advanced device structures: lateral transistors, vertical power devices, and nanowire-based HEMTs. Other relevant topics covered by the book are the strategies for normally-off operation, and the problems related to device reliability. The last chapter reviews the switching characteristics of GaN HEMTs based on a systems level approach. This book is a unique reference for people working in the materials, device and power electronics fields; it provides interdisciplinary information on material growth, device fabrication, reliability issues and circuit-level switching investigation.

Vertical Gallium Nitride PowerDevices: Fabrication and Characterisation

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Publisher : BoD – Books on Demand
ISBN 13 : 3752641762
Total Pages : 156 pages
Book Rating : 4.7/5 (526 download)

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Book Synopsis Vertical Gallium Nitride PowerDevices: Fabrication and Characterisation by : Rico Hentschel

Download or read book Vertical Gallium Nitride PowerDevices: Fabrication and Characterisation written by Rico Hentschel and published by BoD – Books on Demand. This book was released on 2021-01-03 with total page 156 pages. Available in PDF, EPUB and Kindle. Book excerpt: Efficient power conversion is essential to face the continuously increasing energy consumption of our society. GaN based vertical power field effect transistors provide excellent performance figures for power-conversion switches, due to their capability of handling high voltages and current densities with very low area consumption. This work focuses on a vertical trench gate metal oxide semiconductor field effect transistor (MOSFET) with conceptional advantages in a device fabrication preceded GaN epitaxy and enhancement mode characteristics. The functional layer stack comprises from the bottom an n+/n--drift/p-body/n+-source GaN layer sequence. Special attention is paid to the Mg doping of the p-GaN body layer, which is a complex topic by itself. Hydrogen passivation of magnesium plays an essential role, since only the active (hydrogen-free) Mg concentration determines the threshold voltage of the MOSFET and the blocking capability of the body diode. Fabrication specific challenges of the concept are related to the complex integration, formation of ohmic contacts to the functional layers, the specific implementation and processing scheme of the gate trench module and the lateral edge termination. The maximum electric field, which was achieved in the pn- junction of the body diode of the MOSFET is estimated to be around 2.1 MV/cm. From double-sweep transfer measurements with relatively small hysteresis, steep subthreshold slope and a threshold voltage of 3 - 4 V a reasonably good Al2O3/GaN interface quality is indicated. In the conductive state a channel mobility of around 80 - 100 cm2/Vs is estimated. This value is comparable to device with additional overgrowth of the channel. Further enhancement of the OFF-state and ON-state characteristics is expected for optimization of the device termination and the high-k/GaN interface of the vertical trench gate, respectively. From the obtained results and dependencies key figures of an area efficient and competitive device design with thick drift layer is extrapolated. Finally, an outlook is given and advancement possibilities as well as technological limits are discussed.

Gallium Nitride And Silicon Carbide Power Devices

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Publisher : World Scientific Publishing Company
ISBN 13 : 9813109424
Total Pages : 592 pages
Book Rating : 4.8/5 (131 download)

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Book Synopsis Gallium Nitride And Silicon Carbide Power Devices by : B Jayant Baliga

Download or read book Gallium Nitride And Silicon Carbide Power Devices written by B Jayant Baliga and published by World Scientific Publishing Company. This book was released on 2016-12-12 with total page 592 pages. Available in PDF, EPUB and Kindle. Book excerpt: During the last 30 years, significant progress has been made to improve our understanding of gallium nitride and silicon carbide device structures, resulting in experimental demonstration of their enhanced performances for power electronic systems. Gallium nitride power devices made by the growth of the material on silicon substrates have gained a lot of interest. Power device products made from these materials have become available during the last five years from many companies.This comprehensive book discusses the physics of operation and design of gallium nitride and silicon carbide power devices. It can be used as a reference by practicing engineers in the power electronics industry and as a textbook for a power device or power electronics course in universities.

Technology of Gallium Nitride Crystal Growth

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Publisher : Springer Science & Business Media
ISBN 13 : 3642048307
Total Pages : 337 pages
Book Rating : 4.6/5 (42 download)

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Book Synopsis Technology of Gallium Nitride Crystal Growth by : Dirk Ehrentraut

Download or read book Technology of Gallium Nitride Crystal Growth written by Dirk Ehrentraut and published by Springer Science & Business Media. This book was released on 2010-06-14 with total page 337 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses the important technological aspects of the growth of GaN single crystals by HVPE, MOCVD, ammonothermal and flux methods for the purpose of free-standing GaN wafer production.

Heteroepitaxial Thick GaN Layers and Vertical High-Power Devices by Selective Area MOCVD Growth

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Publisher :
ISBN 13 :
Total Pages : 133 pages
Book Rating : 4.:/5 (11 download)

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Book Synopsis Heteroepitaxial Thick GaN Layers and Vertical High-Power Devices by Selective Area MOCVD Growth by : Atsunori Tanaka

Download or read book Heteroepitaxial Thick GaN Layers and Vertical High-Power Devices by Selective Area MOCVD Growth written by Atsunori Tanaka and published by . This book was released on 2019 with total page 133 pages. Available in PDF, EPUB and Kindle. Book excerpt: Gallium nitride (GaN) is now widely used in commercial white Light Emitting Diodes (LEDs) thanks to the emergence of high-brightness GaN blue LEDs in 1990s. In addition to its application in solid-state lighting, GaN has been also vowed as a strong contender for next-generation high power and frequency devices due to its high critical electric field (3.3 MV/cm) and high mobility of the 2-dimensional electron gas (2DEG) at the aluminum gallium nitride (AlGaN)/GaN interface. Lateral AlGaN/GaN high-electron-mobility-transistors (HEMTs) have been available as commercial off-the-shelf devices since 2005. However, with the demand for even higher power at reduced chip area and cost and with better thermal management at high currents, vertical device architectures have emerged as the chosen structure to meet these demands. But vertical devices that can hold high power require thick and high quality GaN layers. Recent developments of bulk GaN substrate growth technologies allowed vertical GaN device with thick drift layer to be more feasible. However, GaN substrate technology is challenged with cost, reliability and uniformity issues even at the currently commercially available 2" (diameter) substrates. Therefore, GaN vertical power devices on cheap substrates without compromising the GaN material quality remains to be of great interest. Si substrates with their fab-scale integrated circuit technology can propel the development of commercial vertical high power GaN devices. The biggest challenge for realizing thick GaN layers on Si to hold high voltage in the vertical direction is the large thermal and lattice mismatch between GaN and Si that leads to cracking of the GaN layers beyond only a few micrometers. In major part of this dissertation, we will focus on the epitaxy techniques of thick crack-free GaN layers on Si by selective area growth (SAG) and the fabrication of vertical GaN switches. The epitaxy technique developed in this work resulted in crack-free thick GaN layers on Si that are of high quality with low dislocation densities and low background doping in order to sustain high breakdown voltages. The developed processes hold the potential to significantly advance the fundamental electronic materials research in power devices and their efficient system level integration.

Vertical Gallium Nitride Power Devices on Bulk Native Substrates

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Publisher :
ISBN 13 :
Total Pages : 151 pages
Book Rating : 4.:/5 (1 download)

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Book Synopsis Vertical Gallium Nitride Power Devices on Bulk Native Substrates by : Min Sun (Ph. D.)

Download or read book Vertical Gallium Nitride Power Devices on Bulk Native Substrates written by Min Sun (Ph. D.) and published by . This book was released on 2017 with total page 151 pages. Available in PDF, EPUB and Kindle. Book excerpt: Lateral power devices based on AlGaN/GaN hetero-structures have achieved excellent performance in the medium power range applications. However for higher voltage higher current switches, a vertical structure is preferred since its die area does not depend on the breakdown voltage. This thesis studies vertical GaN power diodes and transistors grown on bulk GaN substrates. The first part of the thesis studies the PiN diode. Low p-GaN ohmic contact resistance is obtained through annealing in oxygen ambient. The breakdown voltage reaches 1200 V with optimized field plate design. The resistance components of the PiN diodes are also analyzed in this part of the thesis. The second half of the thesis presents a novel vertical power FinFET design with only n-GaN epi-layers. One of the key fabrication processes required for this device structure is to achieve a smooth vertical fin sidewall by combining dry/wet etch. The normally-off power FinFET demonstrates excellent performances without the need of p-GaN layer or material regrowth. With the optimization of edge termination structures, 800 V blocking voltage was achieved. A further reduction of on resistance is achieved by increasing the cap layer doping. Switching characteristics are investigated by capacitance measurements. The thesis concludes with the demonstration of spalling off the bulk GaN substrate after device fabrication. Thanks to the substrate spalling technology, the on resistance of the device can be further reduced and the bulk GaN substrate could possibly be reused to save cost.

Wide Bandgap Semiconductor Power Devices

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Publisher : Woodhead Publishing
ISBN 13 : 0081023073
Total Pages : 420 pages
Book Rating : 4.0/5 (81 download)

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Book Synopsis Wide Bandgap Semiconductor Power Devices by : B. Jayant Baliga

Download or read book Wide Bandgap Semiconductor Power Devices written by B. Jayant Baliga and published by Woodhead Publishing. This book was released on 2018-10-17 with total page 420 pages. Available in PDF, EPUB and Kindle. Book excerpt: Wide Bandgap Semiconductor Power Devices: Materials, Physics, Design and Applications provides readers with a single resource on why these devices are superior to existing silicon devices. The book lays the groundwork for an understanding of an array of applications and anticipated benefits in energy savings. Authored by the Founder of the Power Semiconductor Research Center at North Carolina State University (and creator of the IGBT device), Dr. B. Jayant Baliga is one of the highest regarded experts in the field. He thus leads this team who comprehensively review the materials, device physics, design considerations and relevant applications discussed. Comprehensively covers power electronic devices, including materials (both gallium nitride and silicon carbide), physics, design considerations, and the most promising applications Addresses the key challenges towards the realization of wide bandgap power electronic devices, including materials defects, performance and reliability Provides the benefits of wide bandgap semiconductors, including opportunities for cost reduction and social impact

Gallium Nitride (GaN)

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Publisher : CRC Press
ISBN 13 : 1482220040
Total Pages : 372 pages
Book Rating : 4.4/5 (822 download)

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Book Synopsis Gallium Nitride (GaN) by : Farid Medjdoub

Download or read book Gallium Nitride (GaN) written by Farid Medjdoub and published by CRC Press. This book was released on 2017-12-19 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt: Addresses a Growing Need for High-Power and High-Frequency Transistors Gallium Nitride (GaN): Physics, Devices, and Technology offers a balanced perspective on the state of the art in gallium nitride technology. A semiconductor commonly used in bright light-emitting diodes, GaN can serve as a great alternative to existing devices used in microelectronics. It has a wide band gap and high electron mobility that gives it special properties for applications in optoelectronic, high-power, and high-frequency devices, and because of its high off-state breakdown strength combined with excellent on-state channel conductivity, GaN is an ideal candidate for switching power transistors. Explores Recent Progress in High-Frequency GaN Technology Written by a panel of academic and industry experts from around the globe, this book reviews the advantages of GaN-based material systems suitable for high-frequency, high-power applications. It provides an overview of the semiconductor environment, outlines the fundamental device physics of GaN, and describes GaN materials and device structures that are needed for the next stage of microelectronics and optoelectronics. The book details the development of radio frequency (RF) semiconductor devices and circuits, considers the current challenges that the industry now faces, and examines future trends. In addition, the authors: Propose a design in which multiple LED stacks can be connected in a series using interband tunnel junction (TJ) interconnects Examine GaN technology while in its early stages of high-volume deployment in commercial and military products Consider the potential use of both sunlight and hydrogen as promising and prominent energy sources for this technology Introduce two unique methods, PEC oxidation and vapor cooling condensation methods, for the deposition of high-quality oxide layers A single-source reference for students and professionals, Gallium Nitride (GaN): Physics, Devices, and Technology provides an overall assessment of the semiconductor environment, discusses the potential use of GaN-based technology for RF semiconductor devices, and highlights the current and emerging applications of GaN.

Handbook of GaN Semiconductor Materials and Devices

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Publisher : CRC Press
ISBN 13 : 1351648055
Total Pages : 775 pages
Book Rating : 4.3/5 (516 download)

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Book Synopsis Handbook of GaN Semiconductor Materials and Devices by : Wengang (Wayne) Bi

Download or read book Handbook of GaN Semiconductor Materials and Devices written by Wengang (Wayne) Bi and published by CRC Press. This book was released on 2017-10-20 with total page 775 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book addresses material growth, device fabrication, device application, and commercialization of energy-efficient white light-emitting diodes (LEDs), laser diodes, and power electronics devices. It begins with an overview on basics of semiconductor materials, physics, growth and characterization techniques, followed by detailed discussion of advantages, drawbacks, design issues, processing, applications, and key challenges for state of the art GaN-based devices. It includes state of the art material synthesis techniques with an overview on growth technologies for emerging bulk or free standing GaN and AlN substrates and their applications in electronics, detection, sensing, optoelectronics and photonics. Wengang (Wayne) Bi is Distinguished Chair Professor and Associate Dean in the College of Information and Electrical Engineering at Hebei University of Technology in Tianjin, China. Hao-chung (Henry) Kuo is Distinguished Professor and Associate Director of the Photonics Center at National Chiao-Tung University, Hsin-Tsu, Taiwan, China. Pei-Cheng Ku is an associate professor in the Department of Electrical Engineering & Computer Science at the University of Michigan, Ann Arbor, USA. Bo Shen is the Cheung Kong Professor at Peking University in China.

Design and Fabrication of Nitrogen Polar Gallium Nitride Vertical Transistors for High-power and High-frequency Applications

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Publisher :
ISBN 13 : 9781085572613
Total Pages : pages
Book Rating : 4.5/5 (726 download)

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Book Synopsis Design and Fabrication of Nitrogen Polar Gallium Nitride Vertical Transistors for High-power and High-frequency Applications by : Saba Rajabi

Download or read book Design and Fabrication of Nitrogen Polar Gallium Nitride Vertical Transistors for High-power and High-frequency Applications written by Saba Rajabi and published by . This book was released on 2018 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Gallium nitride (GaN) has remarkable potential to extend the silicon-based semiconductor industry, which is currently plateauing in performance due to its materials limits Any significant improvement comes with a price that may not be a sustainable way to support the need for next generation electronic devices. With a more efficient semiconductor, such as a GaN, engineers could design and fabricate compact devices with ultra-high-scale density, because of GaN’s high electric field strength, saturation velocity, and electron mobility. Studies have already indicated that GaN device technology has tremendous potential for high-frequency communications and photonic applications. Because of advances in growth on commercially feasible large-area substrates, high radio frequency (RF) power applications of GaN are approaching commercialization. The basic material properties of GaN translate to smaller devices, which can lead to higher operation frequencies and lower switching losses. At the same time, the component count and size of passives has decreased. To date, most reported GaN-based field effect transistors have been in a Gallium polar (Ga-polar) orientation. Recent reports have suggested that Nitrogen polar (N-polar) GaN device technology is highly attractive for high RF power applications. The reverse polarization field in N-polar GaN compared to Ga-polar GaN promises unique design advantages. For example, an Al(Ga)N back barrier induces two-dimensional electron gas (2DEG) in the GaN channel and simultaneously confines electrons into the channel. Because of improved electron confinement in the channel and the higher aspect ratio, N-polar devices can presumably achieve superior performance. Additionally, N-polar devices offer lower specific contact resistance since the contacts to the 2DEG occur through GaN rather than wider-bandgap AlGaN material, which is necessary in Ga-polar devices. Previous results have clearly established that vertical devices in the form of current aperture vertical electron transistors (CAVETs) produce dispersion-less output current-voltage (IV) characteristics with a higher blocking electric field than that of lateral devices. The electric field being buried in the bulk of the material is helpful to achieve dispersion-less output characteristics compared to high electron mobility transistors (HEMTs), where surface states cause “knee walkout” or current collapse under high frequencies. Therefore, merging a N-polar high aspect ratio channel with a vertical drift region, as a CAVET does, is an attractive design to accomplish higher RF power performance compared to lateral counterparts. An integral part of a CAVET is the current blocking layer (CBL), which blocks the current flow from all paths except the aperture. Ga-polar CAVETs have been developed with either a Mg-doped GaN CBL or [Mg2+] ion-implanted GaN CBL. The latter is an attractive technique since it can alleviate regrowth in trenches. Notably, Mg ions diffuse out during the channel regrowth process at high temperatures. An AlN interlayer with a thickness of less than a nanometer is an effective solution to stop Mg ions from diffusing out into the channel layer and thereby causing uncontrollable threshold voltage shifts. It is crucial to mention that an AlN back barrier is an essential part of the structure of a vertical N-polar device design, as it is necessary to form the 2DEG channel as well as a diffusion barrier to arrest Mg out-diffusion. Thus, it renders N-polar vertical devices an especially appealing class of devices for RF application.This dissertation aims to provide a physical understanding and insight regarding the N-polar CAVET as well as the device’s design, performance and thermal analysis.

Gallium Nitride-enabled High Frequency and High Efficiency Power Conversion

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Author :
Publisher : Springer
ISBN 13 : 331977994X
Total Pages : 242 pages
Book Rating : 4.3/5 (197 download)

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Book Synopsis Gallium Nitride-enabled High Frequency and High Efficiency Power Conversion by : Gaudenzio Meneghesso

Download or read book Gallium Nitride-enabled High Frequency and High Efficiency Power Conversion written by Gaudenzio Meneghesso and published by Springer. This book was released on 2018-05-12 with total page 242 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book demonstrates to readers why Gallium Nitride (GaN) transistors have a superior performance as compared to the already mature Silicon technology. The new GaN-based transistors here described enable both high frequency and high efficiency power conversion, leading to smaller and more efficient power systems. Coverage includes i) GaN substrates and device physics; ii) innovative GaN -transistors structure (lateral and vertical); iii) reliability and robustness of GaN-power transistors; iv) impact of parasitic on GaN based power conversion, v) new power converter architectures and vi) GaN in switched mode power conversion. Provides single-source reference to Gallium Nitride (GaN)-based technologies, from the material level to circuit level, both for power conversions architectures and switched mode power amplifiers; Demonstrates how GaN is a superior technology for switching devices, enabling both high frequency, high efficiency and lower cost power conversion; Enables design of smaller, cheaper and more efficient power supplies.

Gallium Nitride and Silicon Carbide Power Technologies 7

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Author :
Publisher : The Electrochemical Society
ISBN 13 : 1607688247
Total Pages : 297 pages
Book Rating : 4.6/5 (76 download)

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Book Synopsis Gallium Nitride and Silicon Carbide Power Technologies 7 by : M. Dudley

Download or read book Gallium Nitride and Silicon Carbide Power Technologies 7 written by M. Dudley and published by The Electrochemical Society. This book was released on with total page 297 pages. Available in PDF, EPUB and Kindle. Book excerpt:

GaN-based Materials and Devices

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Publisher : World Scientific
ISBN 13 : 9789812562364
Total Pages : 310 pages
Book Rating : 4.5/5 (623 download)

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Book Synopsis GaN-based Materials and Devices by : Michael Shur

Download or read book GaN-based Materials and Devices written by Michael Shur and published by World Scientific. This book was released on 2004 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: The unique materials properties of GaN-based semiconductors havestimulated a great deal of interest in research and developmentregarding nitride materials growth and optoelectronic andnitride-based electronic devices. High electron mobility andsaturation velocity, high sheet carrier concentration atheterojunction interfaces, high breakdown field, and low thermalimpedance of GaN-based films grown over SiC or bulk AlN substratesmake nitride-based electronic devices very promising.