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Composite Materials For Electronic Functions
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Book Synopsis Composite Materials for Electronic Functions by : D.D.L. Chung
Download or read book Composite Materials for Electronic Functions written by D.D.L. Chung and published by Trans Tech Publications Ltd. This book was released on 2000-02-03 with total page 88 pages. Available in PDF, EPUB and Kindle. Book excerpt: Composite materials are traditionally designed for the mechanical properties, due to their structural applications. However, composite materials are increasingly used in non-structural applications, such as electronic packaging and thermal management. Moreover, structural composite materials that are multifunctional are increasingly needed, due to the demand of smart structures and the importance of weight saving. As a consequence, structural materials that can provide electronic functions are needed. Thus, electronic functions are desirable for both non-structural and structural composite materials.
Book Synopsis Composite Materials by : Deborah D.L. Chung
Download or read book Composite Materials written by Deborah D.L. Chung and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 297 pages. Available in PDF, EPUB and Kindle. Book excerpt: Composite Materials is a modern reference book, tutorial in style, covering functions of composites relating to applications in electronic packaging, thermal management, smart structures and other timely technologies rarely covered in existing books on composites. It also treats materials with polymer, metal, cement, carbon and ceramics matrices, contrasting with others that emphasise polymer-matrix composites. This functional approach will be useful to both practitioners and students. A good selection of example problems, solutions and figures, together with a new and vibrant approach, provides a valuable reference source for all engineers working with composite materials.
Book Synopsis Composite Materials for Combined Functions by : Eraldus Scala
Download or read book Composite Materials for Combined Functions written by Eraldus Scala and published by . This book was released on 1973 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Electronic Composites by : Minoru Taya
Download or read book Electronic Composites written by Minoru Taya and published by Cambridge University Press. This book was released on 2008-04-24 with total page 258 pages. Available in PDF, EPUB and Kindle. Book excerpt: This 2005 book describes the processing, simulation and applications of electronic composites.
Book Synopsis Composite Materials for Industry, Electronics, and the Environment by : Omari V. Mukbaniani
Download or read book Composite Materials for Industry, Electronics, and the Environment written by Omari V. Mukbaniani and published by CRC Press. This book was released on 2019-06-03 with total page 414 pages. Available in PDF, EPUB and Kindle. Book excerpt: This new volume focuses on different aspects of composite systems that are associated with research and development, helping to bridge the gap between classical analysis and modern real-life applications. The chapters look at the experimental and theoretical aspects of composite materials, regarding preparation, processing, design, properties, and practical implications. It also presents recent advancements, research, and development prospects of advanced composite materials that provide new solutions for advanced technologies.
Book Synopsis Biopolymer Composites in Electronics by : Kishor Kumar Sadasivuni
Download or read book Biopolymer Composites in Electronics written by Kishor Kumar Sadasivuni and published by Elsevier. This book was released on 2016-09-10 with total page 546 pages. Available in PDF, EPUB and Kindle. Book excerpt: Biopolymer Composites in Electronics examines the current state-of-the-art in the electronic application based on biopolymer composites. Covering the synthesis, dispersion of fillers, characterization and fabrication of the composite materials, the book will help materials scientists and engineers address the challenges posed by the increased use of biopolymeric materials in electronic applications. The influence of preparation techniques on the generation of micro, meso, and nanoscale fillers, and the effect of filler size and dispersion on various biopolymers are discussed in detail. Applications covered include sensors, actuators, optics, fuel cells, photovoltaics, dielectrics, electromagnetic shielding, piezoelectrics, flexible displays, and microwave absorbers. In addition, characterization techniques are discussed and compared, enabling scientists and engineers to make the correct choice of technique. This book is a ‘one-stop’ reference for researchers, covering the entire state-of-the-art in biopolymer electronics. Written by a collection of expert worldwide contributors from industry, academia, government, and private research institutions, it is an outstanding reference for researchers in the field of biopolymer composites for advanced technologies. Enables researchers to keep up with the rapid development of biopolymer electronics, which offer light, flexible, and more cost-effective alternatives to conventional materials of solar cells, light-emitting diodes, and transistors Includes thorough coverage of the physics and chemistry behind biopolymer composites, helping readers to become rapidly acquainted with the fiel Provides in-depth information on the range of biopolymer applications in electronics, from printed flexible conductors and novel semiconductor components, to intelligent labels, large area displays, and solar panels
Book Synopsis Electronic Properties of Composite Materials by : M. A. Leeds
Download or read book Electronic Properties of Composite Materials written by M. A. Leeds and published by Springer Science & Business Media. This book was released on 2013-03-14 with total page 105 pages. Available in PDF, EPUB and Kindle. Book excerpt: Composites are the fastest growing class of structural material. Consequently, electronic properties are often difficult to find. This report was prepared in order to present a compilation of reliable data on the electronic and electrical properties of composites. Composites provide an opportunity to tailor the properties to the application; a factor that allows designers an unlimited variety of new materials for new uses. It is this feature that has contributed to the rapid growth of composites. The electrical properties of a composite can be of vital importance in the use or application of the material in a system. The designer therefore, must be able to obtain the necessary electrical or electronic property data to guide him in the materials selection. It is the purpose of this report to assist the designer and engineer in fulfilling that requirement. Properties This report provides a compilation of the most commonly required electronic properties data of structural composites. Thermal properties often influence electrical design; consequently several of these properties are included. The specific properties tabulated are: Arc Resistance Thermal Conductivity Arc Tracking Resistance Linear Thermal Expansion Dielectric Constant Coefficient Dissipation Factor Electrical (Volume) Resistivity Electrical (Volume) Conductivity Other electrical and thermal properties are compiled as the data was made available.
Book Synopsis Advanced Materials for Thermal Management of Electronic Packaging by : Xingcun Colin Tong
Download or read book Advanced Materials for Thermal Management of Electronic Packaging written by Xingcun Colin Tong and published by Springer Science & Business Media. This book was released on 2011-01-05 with total page 633 pages. Available in PDF, EPUB and Kindle. Book excerpt: The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Book Synopsis Microwave Materials and Applications by : Mailadil T. Sebastian
Download or read book Microwave Materials and Applications written by Mailadil T. Sebastian and published by John Wiley & Sons. This book was released on 2017-03-02 with total page 997 pages. Available in PDF, EPUB and Kindle. Book excerpt: Die jüngsten Fortschritte im Bereich der drahtlosen Telekommunikation und dem Internet der Dinge sorgen bei drahtlosen Systemen, beim Satellitenfernsehen und bei intelligenten Transportsystemen der 5. Generation für eine höhere Nachfrage nach dielektrischen Materialien und modernen Fertigungstechniken. Diese Materialien bieten ausgezeichnete elektrische, dielektrische und thermische Eigenschaften und verfügen über enormes Potenzial, vor allem bei der drahtlosen Kommunikation, bei flexibler Elektronik und gedruckter Elektronik. Microwave Materials and Applications erläutert die herkömmlichen Methoden zur Messung der dielektrischen Eigenschaften im Mikrowellenbereich, die verschiedenen Ansätze zur Lösung von Problemen der Materialchemie und von Kristallstrukturen, in den Bereichen Doping, Substitution und Aufbau von Verbundwerkstoffen. Besonderer Schwerpunkt liegt auf Verarbeitungstechniken, Einflüssen der Morphologie und der Anwendung von Materialien in der Mikrowellentechnik. Gleichzeitig werden viele der jüngsten Forschungserkenntnisse bei Mikrowellen-Dielektrika und -Anwendungen zusammengefasst. Die verschiedenen Kapitel untersuchen: Oxidkeramiken für dielektrische Resonatoren und Substrate, HTCC-, LTCC- und ULTCC-Bänder für Substrate, Polymer-Keramik-Verbundstoffe für Leiterplatten, Elastomer-Keramik-Verbundstoffe für flexible Elektronik, dielektrische Tinten, Materialien für die EMV-Abschirmung, Mikrowellen-Ferrite. Ein umfassender Anhang präsentiert die grundlegenden Eigenschaften von mehr als 4000 verlustarmen dielektrischen Keramiken, deren Zusammensetzung, kristalline Struktur und dielektrischen Eigenschaften für Mikrowellenanwendungen. Microwave Materials and Applications wirft einen Blick auf sämtliche Aspekte von Mikrowellenmaterialien und -anwendungen, ein nützliches Handbuch für Wissenschaftler, Unternehmen, Ingenieure und Studenten, die sich mit heutigen und neuen Anwendungen in den Bereichen drahtlose Kommunikation und Unterhaltungselektronik beschäftigen.
Book Synopsis Materials for Electronic Packaging by : Deborah D.L. Chung
Download or read book Materials for Electronic Packaging written by Deborah D.L. Chung and published by Elsevier. This book was released on 1995-03-31 with total page 383 pages. Available in PDF, EPUB and Kindle. Book excerpt: Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems. Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems
Book Synopsis Composite Materials: Functional Materials For Modern Technologies by : Chung
Download or read book Composite Materials: Functional Materials For Modern Technologies written by Chung and published by . This book was released on 2006-06-01 with total page 289 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Polymer Materials for Energy and Electronic Applications by : Huisheng Peng
Download or read book Polymer Materials for Energy and Electronic Applications written by Huisheng Peng and published by Academic Press. This book was released on 2016-09-01 with total page 388 pages. Available in PDF, EPUB and Kindle. Book excerpt: Polymer Materials for Energy and Electronic Applications is among the first books to systematically describe the recent developments in polymer materials and their electronic applications. It covers the synthesis, structures, and properties of polymers, along with their composites. In addition, the book introduces, and describes, four main kinds of electronic devices based on polymers, including energy harvesting devices, energy storage devices, light-emitting devices, and electrically driving sensors. Stretchable and wearable electronics based on polymers are a particular focus and main achievement of the book that concludes with the future developments and challenges of electronic polymers and devices. Provides a basic understanding on the structure and morphology of polymers and their electronic properties and applications Highlights the current applications of conducting polymers on energy harvesting and storage Introduces the emerging flexible and stretchable electronic devices Adds a new family of fiber-shaped electronic devices
Book Synopsis Polymer Nanocomposite Materials by : Ye Zhou
Download or read book Polymer Nanocomposite Materials written by Ye Zhou and published by John Wiley & Sons. This book was released on 2021-06-28 with total page 306 pages. Available in PDF, EPUB and Kindle. Book excerpt: Polymer Nanocomposite Materials Discover an authoritative overview of zero-, one-, and two-dimensional polymer nanomaterials Polymer Nanocomposite Materials: Applications in Integrated Electronic Devices delivers an original and insightful treatment of polymer nanocomposite applications in energy, information, and biotechnology. The book systematically reviews the preparation and characterization of polymer nanocomposites from zero-, one-, and two-dimensional nanomaterials. The two distinguished editors have selected resources that thoroughly explore the applications of polymer nanocomposites in energy, information, and biotechnology devices like sensors, solar cells, data storage devices, and artificial synapses. Academic researchers and professional developers alike will enjoy one of the first books on the subject of this environmentally friendly and versatile new technology. Polymer Nanocomposite Materials discusses challenges associated with the devices and materials, possible strategies for future directions of the technology, and the possible commercial applications of electronic devices built on these materials. Readers will also benefit from the inclusion of: A thorough introduction to the fabrication of conductive polymer composites and their applications in sensors An exploration of biodegradable polymer nanocomposites for electronics and polymer nanocomposites for photodetectors Practical discussions of polymer nanocomposites for pressure sensors and the application of polymer nanocomposites in energy storage devices An examination of functional polymer nanocomposites for triboelectric nanogenerators and resistive switching memory Perfect for materials scientists and polymer chemists, Polymer Nanocomposite Materials: Applications in Integrated Electronic Devices will also earn a place in the libraries of sensor developers, electrical engineers, and other professionals working in the sensor industry seeking an authoritative one-stop reference for nanocomposite applications.
Book Synopsis Composite Materials Technology by : S.M. Sapuan
Download or read book Composite Materials Technology written by S.M. Sapuan and published by CRC Press. This book was released on 2009-12-23 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt: Artificial neural networks (ANN) can provide new insight into the study of composite materials and can normally be combined with other artificial intelligence tools such as expert system, genetic algorithm, and fuzzy logic. Because research on this field is very new, there is only a limited amount of published literature on the subject.Compiling in
Download or read book DIMAT 2000 written by and published by . This book was released on 2000 with total page 996 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Advanced Electrical and Electronics Materials by : K. M. Gupta
Download or read book Advanced Electrical and Electronics Materials written by K. M. Gupta and published by John Wiley & Sons. This book was released on 2015-02-23 with total page 698 pages. Available in PDF, EPUB and Kindle. Book excerpt: This comprehensive and unique book is intended to cover the vast and fast-growing field of electrical and electronic materials and their engineering in accordance with modern developments. Basic and pre-requisite information has been included for easy transition to more complex topics. Latest developments in various fields of materials and their sciences/engineering, processing and applications have been included. Latest topics like PLZT, vacuum as insulator, fiber-optics, high temperature superconductors, smart materials, ferromagnetic semiconductors etc. are covered. Illustrations and examples encompass different engineering disciplines such as robotics, electrical, mechanical, electronics, instrumentation and control, computer, and their inter-disciplinary branches. A variety of materials ranging from iridium to garnets, microelectronics, micro alloys to memory devices, left-handed materials, advanced and futuristic materials are described in detail.
Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
