Read Books Online and Download eBooks, EPub, PDF, Mobi, Kindle, Text Full Free.
Characterization Of Integrated Circuit Packaging Materials
Download Characterization Of Integrated Circuit Packaging Materials full books in PDF, epub, and Kindle. Read online Characterization Of Integrated Circuit Packaging Materials ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!
Book Synopsis Characterization of Integrated Circuit Packaging Materials by : Thomas Moore
Download or read book Characterization of Integrated Circuit Packaging Materials written by Thomas Moore and published by Elsevier. This book was released on 2013-10-22 with total page 293 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.
Book Synopsis Integrated Circuit Packaging, Assembly and Interconnections by : William Greig
Download or read book Integrated Circuit Packaging, Assembly and Interconnections written by William Greig and published by Springer Science & Business Media. This book was released on 2007-04-24 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
Book Synopsis Failure Analysis of Integrated Circuits by : Lawrence C. Wagner
Download or read book Failure Analysis of Integrated Circuits written by Lawrence C. Wagner and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt: This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.
Book Synopsis Microelectronics Failure Analysis by : EDFAS Desk Reference Committee
Download or read book Microelectronics Failure Analysis written by EDFAS Desk Reference Committee and published by ASM International. This book was released on 2011 with total page 673 pages. Available in PDF, EPUB and Kindle. Book excerpt: Includes bibliographical references and index.
Book Synopsis Microelectronics Failure Analysis by :
Download or read book Microelectronics Failure Analysis written by and published by ASM International. This book was released on 2004-01-01 with total page 813 pages. Available in PDF, EPUB and Kindle. Book excerpt: For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron
Book Synopsis Microelectronics Fialure Analysis Desk Reference, Seventh Edition by : Tejinder Gandhi
Download or read book Microelectronics Fialure Analysis Desk Reference, Seventh Edition written by Tejinder Gandhi and published by ASM International. This book was released on 2019-11-01 with total page 719 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
Book Synopsis Power Electronic Packaging by : Yong Liu
Download or read book Power Electronic Packaging written by Yong Liu and published by Springer Science & Business Media. This book was released on 2012-02-15 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Book Synopsis Encyclopedia of Materials Characterization by : Charles A. Evans
Download or read book Encyclopedia of Materials Characterization written by Charles A. Evans and published by Gulf Professional Publishing. This book was released on 1992 with total page 784 pages. Available in PDF, EPUB and Kindle. Book excerpt: "This is a comprehensive volume on analytical techniques used in materials science for the characterization of surfaces, interfaces and thin films. This flagship volume is a unique, stand-alone reference for materials science practitioners, process engineers, students and anyone with a need to know about the capabilities available in materials analysis. An encyclopedia of 50 concise articles, this book will also be a practical companion to the forthcoming books in the series."--Knovel.
Book Synopsis Auger Electron Spectroscopy by : John Wolstenholme
Download or read book Auger Electron Spectroscopy written by John Wolstenholme and published by Momentum Press. This book was released on 2015-07-28 with total page 217 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses the use of AES and SAM for the characterization of a wide range of technological materials. These include metals and alloys, semiconductors, nanostructures, and insulators. Its value as a tool for high-resolution elemental imaging and compositional depth profiling is illustrated. The application of the technique for obtaining compositional information from the surfaces, interfaces, and thin film structures of technological and engineering materials is demonstrated. This volume also describes the basic physical principles of AES in simple, largely qualitative, terms understandable by any undergraduate science or engineering student. Major components of typical Auger spectrometers are also described because an understanding of the instrumentation is important to anyone wishing to become a skilled analyst. Mention is also made of other types of analysis for which an Auger electron spectrometer may be used, for example, secondary electron microscopy, backscattered electron imaging, X-ray spectroscopy. The relationship between AES and other analysis techniques is also discussed.
Book Synopsis Physical Assurance by : Navid Asadizanjani
Download or read book Physical Assurance written by Navid Asadizanjani and published by Springer Nature. This book was released on 2021-02-15 with total page 193 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with a comprehensive introduction to physical inspection-based approaches for electronics security. The authors explain the principles of physical inspection techniques including invasive, non-invasive and semi-invasive approaches and how they can be used for hardware assurance, from IC to PCB level. Coverage includes a wide variety of topics, from failure analysis and imaging, to testing, machine learning and automation, reverse engineering and attacks, and countermeasures.
Book Synopsis Handbook of Semiconductor Manufacturing Technology by : Yoshio Nishi
Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2017-12-19 with total page 3276 pages. Available in PDF, EPUB and Kindle. Book excerpt: Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Book Synopsis Managing for Ethical-Organizational Integrity by : Abe J. Zakhem
Download or read book Managing for Ethical-Organizational Integrity written by Abe J. Zakhem and published by Momentum Press. This book was released on 2012 with total page 228 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides guidelines for ethical decision making in business that are philosophically sound and strategically advantageous. This title explains the concepts of basic and derivative rights in a way that can enable managers to identify those ethical duties that must be met in order to morally justify the pursuit of profit.
Book Synopsis Semiconductor Packaging by : Andrea Chen
Download or read book Semiconductor Packaging written by Andrea Chen and published by CRC Press. This book was released on 2016-04-19 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt: In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Book Synopsis Materials for Electronics Security and Assurance by : Navid Asadizanjani
Download or read book Materials for Electronics Security and Assurance written by Navid Asadizanjani and published by Elsevier. This book was released on 2024-01-15 with total page 224 pages. Available in PDF, EPUB and Kindle. Book excerpt: Materials for Electronics Security and Assurance reviews the properties of materials that could enable devices that are resistant to tampering and manipulation. The book discusses recent advances in materials synthesis and characterization techniques for security applications. Topics addressed include anti-reverse engineering, detection, prevention, track and trace, fingerprinting, obfuscation, and how materials could enable these security solutions. The book introduces opportunities and challenges and provides a clear direction of the requirements for material-based solutions to address electronics security challenges. It is suitable for materials scientists and engineers who seek to enable future research directions, current computer and hardware security engineers who want to enable materials selection, and as a way to inspire cross-collaboration between both communities. - Discusses materials as enablers to provide electronics assurance, counterfeit detection/protection, and fingerprinting - Provides an overview of benefits and challenges of materials-based security solutions to inspire future materials research directions - Includes an introduction to material perspectives on hardware security to enable cross collaboration between materials, design, and testing
Book Synopsis Hardware Security by : Mark Tehranipoor
Download or read book Hardware Security written by Mark Tehranipoor and published by Springer Nature. This book was released on with total page 538 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Characterization of Catalytic Materials by : Israel E. Wachs
Download or read book Characterization of Catalytic Materials written by Israel E. Wachs and published by Momentum Press. This book was released on 2010 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heterogeneous catalysis has undergone a revolutionary change in the past two decades due to the development of sophisticated characterization methods that provide fundamental information about the catalyst bulk structures, surfaces, and their properties. For the first time, these characterization methods have allowed researchers to "see" the surfaces of catalytic materials, their bulk structures (crystalline as well as amorphous phases), the influence of the process conditions on the catalytic material, as well as the effect of different synthesis methods. This new information has tremendously advanced our understanding of catalytic materials and their properties. These characterization methods have become our "eyes" and are indispensible in the development of new catalytic materials. It is hard to conceive of a modern heterogeneous catalysis activity, be it research or manufacturing, without the aid of these new characterization techniques.
Book Synopsis Characterization of Tribological Materials, Second Edition by : William A. Glaeser
Download or read book Characterization of Tribological Materials, Second Edition written by William A. Glaeser and published by Momentum Press. This book was released on 2012-11-16 with total page 194 pages. Available in PDF, EPUB and Kindle. Book excerpt: This classic text discusses the use of advanced surface science characterization techniques in friction, adhesive and abrasive wear, boundary lubrication, contact fatigue, and other important failure processes. Surface characterization of bearings, gears, seals, and other manufactured rolling and sliding surfaces are increasingly routine in advanced quality control of processes and in the manufacture of precision components. This book is an indispensable asset to scientists and engineers using tribological characterization techniques. New content in this edition include: • four new figures to illustrate real surface contact added to Chapter 1. • coverage of the use of the Environmental SEM (ESEM) in examining wear of fiber glass filled PTFE added to chapter 4. • new information on the wear of ceramics added to Chapter 5. • updates for new analytical systems added to Chapter 6. • coverage of Atomic Force Microscope (ATM) and its usefulness in the field of nano-tribology, providing not only full microtopography of surface roughness but also measurement of nano-friction and nanohardness of surface films, added in a new Chapter 9. • the 17 Appendices have been completely revamped with essential information organized into convenient tables.
