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Carbon Nanotube Based Vlsi Interconnects
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Book Synopsis Carbon Nanotube Based VLSI Interconnects by : Brajesh Kumar Kaushik
Download or read book Carbon Nanotube Based VLSI Interconnects written by Brajesh Kumar Kaushik and published by Springer. This book was released on 2014-11-01 with total page 94 pages. Available in PDF, EPUB and Kindle. Book excerpt: The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.
Book Synopsis Design and Crosstalk Analysis in Carbon Nanotube Interconnects by : P. Uma Sathyakam
Download or read book Design and Crosstalk Analysis in Carbon Nanotube Interconnects written by P. Uma Sathyakam and published by Springer Nature. This book was released on 2020-10-31 with total page 134 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a single-source reference on carbon nanotubes for interconnect applications. It presents the recent advances in modelling and challenges of carbon nanotube (CNT)-based VLSI interconnects. Starting with a background of carbon nanotubes and interconnects, this book details various aspects of CNT interconnect models, the design metrics of CNT interconnects, crosstalk analysis of recently proposed CNT interconnect structures, and geometries. Various topics covered include the use of semiconducting CNTs around metallic CNTs, CNT interconnects with air gaps, use of emerging ultra low-k materials and their integration with CNT interconnects, and geometry-based crosstalk reduction techniques. This book will be useful for researchers and design engineers working on carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
Book Synopsis Carbon Nanotube and Graphene Nanoribbon Interconnects by : Debaprasad Das
Download or read book Carbon Nanotube and Graphene Nanoribbon Interconnects written by Debaprasad Das and published by CRC Press. This book was released on 2017-12-19 with total page 197 pages. Available in PDF, EPUB and Kindle. Book excerpt: An Alternative to Copper-Based Interconnect Technology With an increase in demand for more circuit components on a single chip, there is a growing need for nanoelectronic devices and their interconnects (a physical connecting medium made of thin metal films between several electrical nodes in a semiconducting chip that transmit signals from one point to another without any distortion). Carbon Nanotube and Graphene Nanoribbon Interconnects explores two new important carbon nanomaterials, carbon nanotube (CNT) and graphene nanoribbon (GNR), and compares them with that of copper-based interconnects. These nanomaterials show almost 1,000 times more current-carrying capacity and significantly higher mean free path than copper. Due to their remarkable properties, CNT and GNR could soon replace traditional copper interconnects. Dedicated to proving their benefits, this book covers the basic theory of CNT and GNR, and provides a comprehensive analysis of the CNT- and GNR-based VLSI interconnects at nanometric dimensions. Explore the Potential Applications of CNT and Graphene for VLSI Circuits The book starts off with a brief introduction of carbon nanomaterials, discusses the latest research, and details the modeling and analysis of CNT and GNR interconnects. It also describes the electrical, thermal, and mechanical properties, and structural behavior of these materials. In addition, it chronicles the progression of these fundamental properties, explores possible engineering applications and growth technologies, and considers applications for CNT and GNR apart from their use in VLSI circuits. Comprising eight chapters this text: Covers the basics of carbon nanotube and graphene nanoribbon Discusses the growth and characterization of carbon nanotube and graphene nanoribbon Presents the modeling of CNT and GNR as future VLSI interconnects Examines the applicability of CNT and GNR in terms of several analysis works Addresses the timing and frequency response of the CNT and GNR interconnects Explores the signal integrity analysis for CNT and GNR interconnects Models and analyzes the applicability of CNT and GNR as power interconnects Considers the future scope of CNT and GNR Beneficial to VLSI designers working in this area, Carbon Nanotube and Graphene Nanoribbon Interconnects provides a complete understanding of carbon-based materials and interconnect technology, and equips the reader with sufficient knowledge about the future scope of research and development for this emerging topic.
Book Synopsis Carbon Nanotubes for Interconnects by : Aida Todri-Sanial
Download or read book Carbon Nanotubes for Interconnects written by Aida Todri-Sanial and published by Springer. This book was released on 2016-07-09 with total page 340 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
Book Synopsis Carbon-Based Electronics by : Ashok Srivastava
Download or read book Carbon-Based Electronics written by Ashok Srivastava and published by CRC Press. This book was released on 2015-03-19 with total page 153 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discovery of one-dimensional material carbon nanotubes in 1991 by the Japanese physicist Dr. Sumio Iijima has resulted in voluminous research in the field of carbon nanotubes for numerous applications, including possible replacement of silicon used in the fabrication of CMOS chips. One interesting feature of carbon nanotubes is that these can be me
Book Synopsis Major Applications of Carbon Nanotube Field-Effect Transistors (CNTFET) by : Raj, Balwinder
Download or read book Major Applications of Carbon Nanotube Field-Effect Transistors (CNTFET) written by Raj, Balwinder and published by IGI Global. This book was released on 2019-12-06 with total page 255 pages. Available in PDF, EPUB and Kindle. Book excerpt: With recent advancements in electronics, specifically nanoscale devices, new technologies are being implemented to improve the properties of automated systems. However, conventional materials are failing due to limited mobility, high leakage currents, and power dissipation. To mitigate these challenges, alternative resources are required to advance electronics further into the nanoscale domain. Carbon nanotube field-effect transistors are a potential solution yet lack the information and research to be properly utilized. Major Applications of Carbon Nanotube Field-Effect Transistors (CNTFET) is a collection of innovative research on the methods and applications of converting semiconductor devices from micron technology to nanotechnology. The book provides readers with an updated status on existing CNTs, CNTFETs, and their applications and examines practical applications to minimize short channel effects and power dissipation in nanoscale devices and circuits. While highlighting topics including interconnects, digital circuits, and single-wall CNTs, this book is ideally designed for electrical engineers, electronics engineers, students, researchers, academicians, industry professionals, and practitioners working in nanoscience, nanotechnology, applied physics, and electrical and electronics engineering.
Book Synopsis Nano Interconnects by : Afreen Khursheed
Download or read book Nano Interconnects written by Afreen Khursheed and published by CRC Press. This book was released on 2021-12-23 with total page 239 pages. Available in PDF, EPUB and Kindle. Book excerpt: This textbook comprehensively covers on-chip interconnect dimension and application of carbon nanomaterials for modeling VLSI interconnect and buffer circuits. It provides analysis of ultra-low power high speed nano-interconnects based on different facets such as material modeling, circuit modeling and the adoption of repeater insertion strategies and measurement techniques. It covers important topics including on-chip interconnects, interconnect modeling, electrical impedance modeling of on-chip interconnects, modeling of repeater buffer and variability analysis. Pedagogical features including solved problems and unsolved exercises are interspersed throughout the text for better understanding. Aimed at senior undergraduate and graduate students in the field of electrical engineering, electronics and communications engineering for courses on Advanced VLSI Interconnects/Advanced VLSI Design/VLSI Interconnects/VLSI Design Automation and Techniques, this book: Provides comprehensive coverage of fundamental concepts related to nanotube transistors and interconnects. Discusses properties and performance of practical nanotube devices and related applications. Covers physical and electrical phenomena of carbon nanotubes, as well as applications enabled by this nanotechnology. Discusses the structure, properties, and characteristics of graphene-based on-chip interconnect. Examines interconnect power and interconnect delay issues arising due to downscaling of device size.
Book Synopsis Crosstalk in Modern On-Chip Interconnects by : B.K. Kaushik
Download or read book Crosstalk in Modern On-Chip Interconnects written by B.K. Kaushik and published by Springer. This book was released on 2016-04-06 with total page 126 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book provides accurate FDTD models for on-chip interconnects, covering most recent advancements in materials and design. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for CNT and GNR based interconnects are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR-based interconnects are also discussed in the book. The proposed models are validated with the HSPICE simulations. The book introduces the current research scenario in the modeling of on-chip interconnects. It presents the structure, properties, and characteristics of graphene based on-chip interconnects and the FDTD modeling of Cu based on-chip interconnects. The model considers the non-linear effects of CMOS driver as well as the transmission line effects of interconnect line that includes coupling capacitance and mutual inductance effects. In a more realistic manner, the proposed model includes the effect of width-dependent MFP of the MLGNR while taking into account the edge roughness.
Book Synopsis High-Speed VLSI Interconnections by : Ashok K. Goel
Download or read book High-Speed VLSI Interconnections written by Ashok K. Goel and published by Wiley-Interscience. This book was released on 2007-10-19 with total page 472 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.
Book Synopsis Interconnect Challenges and Carbon Nanotube as Interconnect in Nano VLSI Circuits by : Davood Fathi
Download or read book Interconnect Challenges and Carbon Nanotube as Interconnect in Nano VLSI Circuits written by Davood Fathi and published by . This book was released on 2010 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: In this chapter, we have studied interconnect challenges and the behaviour of carbon nanotube (CNT) as interconnect in VLSI circuits. In this review we discussed about the two main structures of CNT, including CNT bundles and MWCNTs, which achieve good performance due to the parallel SWCNTs in a bundle or the parallel shells in a MWCNT. These optimized configurations give the better characteristics including decreased delay time in comparison with SWCNTs, which is a vital parameter for the application as interconnect. The repeater (buffer) insertion technique that is used for the reduction of delay time in the global interconnects, has been discussed. Also in this chapter, we analyzed the time domain response of CNT bundle interconnect in a driver-interconnect-load configuration, based on the formulations and discussions we have presented in the reference [44]. At the continuation, we discussed briefly about the stability concept in CNT bundle interconnects, versus the length and diameter of each CNT in a CNT bundle.
Book Synopsis Advances in VLSI, Communication, and Signal Processing by : Debashis Dutta
Download or read book Advances in VLSI, Communication, and Signal Processing written by Debashis Dutta and published by Springer Nature. This book was released on 2019-12-03 with total page 1004 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book comprises select proceedings of the International Conference on VLSI, Communication and Signal processing (VCAS 2018). It looks at latest research findings in VLSI design and applications. The book covers a wide range of topics in electronics and communication engineering, especially in the area of microelectronics and VLSI design, communication systems and networks, and image and signal processing. The contents of this book will be useful to researchers and professionals alike.
Book Synopsis The Comparison Study of Future On-chip Interconnects for High Performance VLSI Applications by : Kyung Hoae Koo
Download or read book The Comparison Study of Future On-chip Interconnects for High Performance VLSI Applications written by Kyung Hoae Koo and published by Stanford University. This book was released on 2011 with total page 135 pages. Available in PDF, EPUB and Kindle. Book excerpt: Moore's law has driven the scaling of digital electronic devices' dimensions and performances over the last 40 years. As a result, logic components in a microprocessor have shown dramatic performance improvement. On the other hand, an on-chip interconnect which was considered only as a parasitic load before 1990s became the real performance bottleneck due to its extremely reduced cross section dimension. Now, on-chip global interconnect with conventional Cu/low-k and delay optimized repeater scheme faces great challenges in the nanometer regime, imposing problems of slower delay, higher power dissipation and limited bandwidth. Carbon based materials such as carbon nanotubes and graphene nanoribbons, and optical interconnect have been proposed for the alternate solution for the future nodes due to their special physical characteristics. This dissertation investigates the basic physical properties of novel materials for future interconnect, and describes the analytical and numerical models of local and global wire system based on new materials and novel signaling paradigms. This work also compares their basic performance metrics and circuit architectures to cope with the interconnect performance bottlenecks. We quantify the performance of these novel interconnects and compare them with Cu/low-k wires for future high-performance ICs.
Book Synopsis Modeling of Thermally Aware Carbon Nanotube and Graphene Based Post CMOS VLSI Interconnect by : K. M. Mohsin
Download or read book Modeling of Thermally Aware Carbon Nanotube and Graphene Based Post CMOS VLSI Interconnect written by K. M. Mohsin and published by . This book was released on 2017 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Carbon Nanotube Based Integrated Circuit Interconnects by : Muhammad Ahmad
Download or read book Carbon Nanotube Based Integrated Circuit Interconnects written by Muhammad Ahmad and published by . This book was released on 2013 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Nano-Interconnect Materials and Models for Next Generation Integrated Circuit Design by : Sandip Bhattacharya
Download or read book Nano-Interconnect Materials and Models for Next Generation Integrated Circuit Design written by Sandip Bhattacharya and published by CRC Press. This book was released on 2023-12-22 with total page 251 pages. Available in PDF, EPUB and Kindle. Book excerpt: Aggressive scaling of device and interconnect dimensions has resulted in many low dimensional issues in the nanometer regime. This book deals with various new generation interconnect materials and interconnect modeling and highlights the significance of novel nano interconnect materials for 3D integrated circuit design. It provides information about advanced nanomaterials like carbon nanotube (CNT) and graphene nanoribbon (GNR) for the realization of interconnects, interconnect models, and crosstalk noise analysis. Features: Focusses on materials and nanomaterials utilization in next generation interconnects based on Carbon nanotubes (CNT) and Graphene nanoribbons (GNR). Helps readers realize interconnects, interconnect models, and crosstalk noise analysis. Describes Hybrid CNT and GNR based interconnects. Presents the details of power supply voltage drop analysis in CNT and GNR interconnects. Overviews pertinent RF performance and stability analysis. This book is aimed at graduate students and researchers in electrical and materials engineering, nano/microelectronics.
Book Synopsis CMOS Logic Circuit Design by : John P. Uyemura
Download or read book CMOS Logic Circuit Design written by John P. Uyemura and published by Springer Science & Business Media. This book was released on 2007-05-08 with total page 542 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is an up-to-date treatment of the analysis and design of CMOS integrated digital logic circuits. The self-contained book covers all of the important digital circuit design styles found in modern CMOS chips, emphasizing solving design problems using the various logic styles available in CMOS.
Book Synopsis Electronic Properties of Carbon Nanotubes by : Jose Mauricio Marulanda
Download or read book Electronic Properties of Carbon Nanotubes written by Jose Mauricio Marulanda and published by IntechOpen. This book was released on 2011-07-27 with total page 698 pages. Available in PDF, EPUB and Kindle. Book excerpt: Carbon nanotubes (CNTs), discovered in 1991, have been a subject of intensive research for a wide range of applications. These one-dimensional (1D) graphene sheets rolled into a tubular form have been the target of many researchers around the world. This book concentrates on the semiconductor physics of carbon nanotubes, it brings unique insight into the phenomena encountered in the electronic structure when operating with carbon nanotubes. This book also presents to reader useful information on the fabrication and applications of these outstanding materials. The main objective of this book is to give in-depth understanding of the physics and electronic structure of carbon nanotubes. Readers of this book should have a strong background on physical electronics and semiconductor device physics. This book first discusses fabrication techniques followed by an analysis on the physical properties of carbon nanotubes, including density of states and electronic structures. Ultimately, the book pursues a significant amount of work in the industry applications of carbon nanotubes.
