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Burn In Testing
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Book Synopsis Thermal and Power Management of Integrated Circuits by : Arman Vassighi
Download or read book Thermal and Power Management of Integrated Circuits written by Arman Vassighi and published by Springer Science & Business Media. This book was released on 2006-06-01 with total page 188 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.
Book Synopsis Wafer-Level Testing and Test During Burn-In for Integrated Circuits by : Sudarshan Bahukudumbi
Download or read book Wafer-Level Testing and Test During Burn-In for Integrated Circuits written by Sudarshan Bahukudumbi and published by Artech House. This book was released on 2010 with total page 198 pages. Available in PDF, EPUB and Kindle. Book excerpt: Wafer-level testing refers to a critical process of subjecting integrated circuits and semiconductor devices to electrical testing while they are still in wafer form. Burn-in is a temperature/bias reliability stress test used in detecting and screening out potential early life device failures. This hands-on resource provides a comprehensive analysis of these methods, showing how wafer-level testing during burn-in (WLTBI) helps lower product cost in semiconductor manufacturing. Engineers learn how to implement the testing of integrated circuits at the wafer-level under various resource constraints. Moreover, this unique book helps practitioners address the issue of enabling next generation products with previous generation testers. Practitioners also find expert insights on current industry trends in WLTBI test solutions.
Book Synopsis Reliability Prediction from Burn-In Data Fit to Reliability Models by : Joseph Bernstein
Download or read book Reliability Prediction from Burn-In Data Fit to Reliability Models written by Joseph Bernstein and published by Academic Press. This book was released on 2014-03-06 with total page 108 pages. Available in PDF, EPUB and Kindle. Book excerpt: This work will educate chip and system designers on a method for accurately predicting circuit and system reliability in order to estimate failures that will occur in the field as a function of operating conditions at the chip level. This book will combine the knowledge taught in many reliability publications and illustrate how to use the knowledge presented by the semiconductor manufacturing companies in combination with the HTOL end-of-life testing that is currently performed by the chip suppliers as part of their standard qualification procedure and make accurate reliability predictions. This book will allow chip designers to predict FIT and DPPM values as a function of operating conditions and chip temperature so that users ultimately will have control of reliability in their design so the reliability and performance will be considered concurrently with their design. - The ability to include reliability calculations and test results in their product design - The ability to use reliability data provided to them by their suppliers to make meaningful reliability predictions - Have accurate failure rate calculations for calculating warrantee period replacement costs
Book Synopsis Burn-in Testing by : Dimitri Kececioglu
Download or read book Burn-in Testing written by Dimitri Kececioglu and published by Prentice Hall. This book was released on 1997 with total page 712 pages. Available in PDF, EPUB and Kindle. Book excerpt: When scientifically planned and conducted, burn-in testing offers one of the most effective methods of reliability screening at the component level. By testing individual elements under constant temperature stress, electrical stress, temperature cycling stress, or a combined thermal-electrical stress, burn-in testing can identify discrete faults that may be harder to perceive at the assembly, module, or system level. This book covers all aspects of burn-in testing, from basic definitions to state-of-the-art concepts. Drawing on a broad database of studies, Burn-In Testing emphasizes mathematical and statistical models for quantifying the failure process, optimizing component reliability, and minimizing the total cost. Vividly illustrated with figures, tables and charts, Burn-In Testing includes: * Definitions, classifications, and test conditions * A review of failure patterns during burn-in * Seven general mathematical models including four bathtub curve models * A quick calculation approach for time determination * Representative cost models and burn-in time optimization * The bimodal mixed-exponential life distribution applied to quantify and optimize burn-in * The Mean Residual Life (MRL) concept applied to quantify and optimize burn-in * The Total Time on Test (TTT) transform and the TTT plot applied to quantify and optimize burn-in * Accelerated testing and its quantification * A roadmap for practical applications With each chapter, Burn-In Testing also offers the appropriate FORTRAN code for the processes described. Burn-In Testing is ideal for practicing engineers in the fields of reliability, life testing, and product assurance. It is also useful for upper division and graduate students in these and related fields.
Download or read book Burn-in written by P. W. Singer and published by Mariner Books. This book was released on 2020 with total page 437 pages. Available in PDF, EPUB and Kindle. Book excerpt: An FBI agent teams up with the first police robot to hunt a shadowy terrorist in this gripping technothriller--and fact-based tour of tomorrow--from the authors of Ghost Fleet America is on the brink of a revolution. AI and robotics have realized science fiction's dreams, but have also taken millions of jobs and left many citizens fearful that the future is leaving them behind. After narrowly averting a bombing at Washington's Union Station, FBI Special Agent Lara Keegan receives a new assignment: to field test the first police robot. In the wake of a series of shocking catastrophes, the two find themselves investigating a conspiracy whose mastermind is using cutting-edge tech to rip the nation apart. To stop this new breed of terrorist, Keegan's only hope is to forge a new kind of partnership. With every tech, trend, and scene drawn from the real world, Burn-In blends a technothriller's excitement with nonfiction's insight to illuminate the darkest corners of our chilling tomorrow.
Book Synopsis Spacecraft Thermal Control Handbook by : David G. Gilmore
Download or read book Spacecraft Thermal Control Handbook written by David G. Gilmore and published by . This book was released on 2002 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Annotation This is a revised and updated of (1994) and has been expanded to discuss interplanetary spacecraft as well as Earth- orbiting satellites. The work is presented as a compendium of corporate knowledge in the field of thermal control of uncrewed spacecraft and was written for thermal engineers of a range of experience levels. After discussing general issues and historical design approaches chapters examine current thermal control hardware, the thermal design and testing process, and emerging thermal technologies. Annotation c. Book News, Inc., Portland, OR (booknews.com).
Book Synopsis Recommendations on the Transport of Dangerous Goods by : United Nations
Download or read book Recommendations on the Transport of Dangerous Goods written by United Nations and published by . This book was released on 2020-01-06 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Manual of Tests and Criteria contains criteria, test methods and procedures to be used for classification of dangerous goods according to the provisions of Parts 2 and 3 of the United Nations Recommendations on the Transport of Dangerous Goods, Model Regulations, as well as of chemicals presenting physical hazards according to the Globally Harmonized System of Classification and Labelling of Chemicals (GHS). As a consequence, it supplements also national or international regulations which are derived from the United Nations Recommendations on the Transport of Dangerous Goods or the GHS. At its ninth session (7 December 2018), the Committee adopted a set of amendments to the sixth revised edition of the Manual as amended by Amendment 1. This seventh revised edition takes account of these amendments. In addition, noting that the work to facilitate the use of the Manual in the context of the GHS had been completed, the Committee considered that the reference to the "Recommendations on the Transport of Dangerous Goods" in the title of the Manual was no longer appropriate, and decided that from now on, the Manual should be entitled "Manual of Tests and Criteria".
Book Synopsis Thermal Issues in Testing of Advanced Systems on Chip by : Nima Aghaee Ghaleshahi
Download or read book Thermal Issues in Testing of Advanced Systems on Chip written by Nima Aghaee Ghaleshahi and published by Linköping University Electronic Press. This book was released on 2015-09-23 with total page 219 pages. Available in PDF, EPUB and Kindle. Book excerpt: Many cutting-edge computer and electronic products are powered by advanced Systems-on-Chip (SoC). Advanced SoCs encompass superb performance together with large number of functions. This is achieved by efficient integration of huge number of transistors. Such very large scale integration is enabled by a core-based design paradigm as well as deep-submicron and 3D-stacked-IC technologies. These technologies are susceptible to reliability and testing complications caused by thermal issues. Three crucial thermal issues related to temperature variations, temperature gradients, and temperature cycling are addressed in this thesis. Existing test scheduling techniques rely on temperature simulations to generate schedules that meet thermal constraints such as overheating prevention. The difference between the simulated temperatures and the actual temperatures is called temperature error. This error, for past technologies, is negligible. However, advanced SoCs experience large errors due to large process variations. Such large errors have costly consequences, such as overheating, and must be taken care of. This thesis presents an adaptive approach to generate test schedules that handle such temperature errors. Advanced SoCs manufactured as 3D stacked ICs experience large temperature gradients. Temperature gradients accelerate certain early-life defect mechanisms. These mechanisms can be artificially accelerated using gradient-based, burn-in like, operations so that the defects are detected before shipping. Moreover, temperature gradients exacerbate some delay-related defects. In order to detect such defects, testing must be performed when appropriate temperature-gradients are enforced. A schedule-based technique that enforces the temperature-gradients for burn-in like operations is proposed in this thesis. This technique is further developed to support testing for delay-related defects while appropriate gradients are enforced. The last thermal issue addressed by this thesis is related to temperature cycling. Temperature cycling test procedures are usually applied to safety-critical applications to detect cycling-related early-life failures. Such failures affect advanced SoCs, particularly through-silicon-via structures in 3D-stacked-ICs. An efficient schedule-based cycling-test technique that combines cycling acceleration with testing is proposed in this thesis. The proposed technique fits into existing 3D testing procedures and does not require temperature chambers. Therefore, the overall cycling acceleration and testing cost can be drastically reduced. All the proposed techniques have been implemented and evaluated with extensive experiments based on ITC’02 benchmarks as well as a number of 3D stacked ICs. Experiments show that the proposed techniques work effectively and reduce the costs, in particular the costs related to addressing thermal issues and early-life failures. We have also developed a fast temperature simulation technique based on a closed-form solution for the temperature equations. Experiments demonstrate that the proposed simulation technique reduces the schedule generation time by more than half.
Download or read book Burned written by Ellen Hopkins and published by Simon and Schuster. This book was released on 2013-09-10 with total page 560 pages. Available in PDF, EPUB and Kindle. Book excerpt: The #1 "New York Times"-bestselling author of "Crank" returns with a gripping, masterful novel, told in verse, that weaves a riveting story about a teenage girl who is raised in a fundamentally religious yet abusive family.
Book Synopsis Springer Handbook of Engineering Statistics by : Hoang Pham
Download or read book Springer Handbook of Engineering Statistics written by Hoang Pham and published by Springer Science & Business Media. This book was released on 2006 with total page 1135 pages. Available in PDF, EPUB and Kindle. Book excerpt: In today’s global and highly competitive environment, continuous improvement in the processes and products of any field of engineering is essential for survival. This book gathers together the full range of statistical techniques required by engineers from all fields. It will assist them to gain sensible statistical feedback on how their processes or products are functioning and to give them realistic predictions of how these could be improved. The handbook will be essential reading for all engineers and engineering-connected managers who are serious about keeping their methods and products at the cutting edge of quality and competitiveness.
Book Synopsis An Introduction to Reliability and Maintainability Engineering by : Charles E. Ebeling
Download or read book An Introduction to Reliability and Maintainability Engineering written by Charles E. Ebeling and published by Waveland Press. This book was released on 2019-04-12 with total page 658 pages. Available in PDF, EPUB and Kindle. Book excerpt: Many books on reliability focus on either modeling or statistical analysis and require an extensive background in probability and statistics. Continuing its tradition of excellence as an introductory text for those with limited formal education in the subject, this classroom-tested book introduces the necessary concepts in probability and statistics within the context of their application to reliability. The Third Edition adds brief discussions of the Anderson-Darling test, the Cox proportionate hazards model, the Accelerated Failure Time model, and Monte Carlo simulation. Over 80 new end-of-chapter exercises have been added, as well as solutions to all odd-numbered exercises. Moreover, Excel workbooks, available for download, save students from performing numerous tedious calculations and allow them to focus on reliability concepts. Ebeling has created an exceptional text that enables readers to learn how to analyze failure, repair data, and derive appropriate models for reliability and maintainability as well as apply those models to all levels of design.
Download or read book Burn Factor written by Kyle Mills and published by Harper Collins. This book was released on 2010-11-16 with total page 438 pages. Available in PDF, EPUB and Kindle. Book excerpt: From the #1 New York Times bestselling author of Vince Flynn Bright, young, and ambitious, Quinn Barry desperately wants to be an FBI agent, even as she programs databases in the basement of the J. Edgar Hoover Building. But Quinn's career -- and her life -- are about to change wildly. Testing a new program, Quinn's computer savvy turns up a mysterious DNA link among five gruesome murders. A link that the old FBI system had been carefully programmed to miss. A link that nearly costs Quinn her job, and soon, her life...Pitted against a conspiracy of unimaginable proportions, Quinn will match wits against powerful government forces that will use any means necessary to keep their dirty secrets hidden -- secrets that will land her in the clutches of a sadistic, brilliant madman who holds the key to it all.
Book Synopsis A Designer’s Guide to Built-In Self-Test by : Charles E. Stroud
Download or read book A Designer’s Guide to Built-In Self-Test written by Charles E. Stroud and published by Springer Science & Business Media. This book was released on 2005-12-27 with total page 338 pages. Available in PDF, EPUB and Kindle. Book excerpt: A recent technological advance is the art of designing circuits to test themselves, referred to as a Built-In Self-Test. This book is written from a designer's perspective and describes the major BIST approaches that have been proposed and implemented, along with their advantages and limitations.
Book Synopsis Counterfeit Integrated Circuits by : Mark (Mohammad) Tehranipoor
Download or read book Counterfeit Integrated Circuits written by Mark (Mohammad) Tehranipoor and published by Springer. This book was released on 2015-02-12 with total page 282 pages. Available in PDF, EPUB and Kindle. Book excerpt: This timely and exhaustive study offers a much-needed examination of the scope and consequences of the electronic counterfeit trade. The authors describe a variety of shortcomings and vulnerabilities in the electronic component supply chain, which can result in counterfeit integrated circuits (ICs). Not only does this book provide an assessment of the current counterfeiting problems facing both the public and private sectors, it also offers practical, real-world solutions for combatting this substantial threat. · Helps beginners and practitioners in the field by providing a comprehensive background on the counterfeiting problem; · Presents innovative taxonomies for counterfeit types, test methods, and counterfeit defects, which allows for a detailed analysis of counterfeiting and its mitigation; · Provides step-by-step solutions for detecting different types of counterfeit ICs; · Offers pragmatic and practice-oriented, realistic solutions to counterfeit IC detection and avoidance, for industry and government.
Book Synopsis Encyclopedia of Quantitative Risk Analysis and Assessment by :
Download or read book Encyclopedia of Quantitative Risk Analysis and Assessment written by and published by John Wiley & Sons. This book was released on 2008-09-02 with total page 2163 pages. Available in PDF, EPUB and Kindle. Book excerpt: Leading the way in this field, the Encyclopedia of Quantitative Risk Analysis and Assessment is the first publication to offer a modern, comprehensive and in-depth resource to the huge variety of disciplines involved. A truly international work, its coverage ranges across risk issues pertinent to life scientists, engineers, policy makers, healthcare professionals, the finance industry, the military and practising statisticians. Drawing on the expertise of world-renowned authors and editors in this field this title provides up-to-date material on drug safety, investment theory, public policy applications, transportation safety, public perception of risk, epidemiological risk, national defence and security, critical infrastructure, and program management. This major publication is easily accessible for all those involved in the field of risk assessment and analysis. For ease-of-use it is available in print and online.
Book Synopsis Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore by : Hengyun Zhang
Download or read book Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore written by Hengyun Zhang and published by Woodhead Publishing. This book was released on 2019-11-14 with total page 436 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. - Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging - Features experimental characterization and qualifications for the analysis and verification of electronic packaging design - Provides multiphysics modeling and analysis techniques of electronic packaging
Book Synopsis Design for Reliability by : Dana Crowe
Download or read book Design for Reliability written by Dana Crowe and published by CRC Press. This book was released on 2017-12-19 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt: Today's marketplace demands product reliability. At the same time, it places ever-increasing demands on products that push the limits of their performance and their functional life, and it does so with the expectation of lower per-unit product costs. To meet these demands, product design now requires a focused, streamlined, concurrent engineering process that will produce a product at the lowest possible cost in the least amount of time. Design for Reliability provides a systematic approach to the design process that is sharply focused on reliability and firmly based on the physics of failure. It imparts an understanding of how, why, and when to use the wide variety of reliability engineering tools available and offers fundamental insight into the total design cycle. Applicable from the idea phase of the product development cycle through product obsolescence, Design for Reliability (DfR) concepts integrated with reliability verification and analytical physics form a coherent stage gate/phase design process that helps ensure that a product will meet customers' reliability objectives. Whether you are a high-volume manufacturer of consumer items or a low volume producer of military commodities, your goal is the same: to bring a product to market using a process focused on designing out or mitigating potential failure modes prior to production release. Readers of Design for Reliability will learn to meet that goal and move beyond solidifying a basic offering to the marketplace to creating a true competitive advantage.
