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Analytical Computational And Experimental Study Of Thermo Mechanical Effects In Electronic Packaging
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Book Synopsis Packaging, Reliability and Manufacturing Issues Associated with Electronic and Photonic Products by : Charles Ume
Download or read book Packaging, Reliability and Manufacturing Issues Associated with Electronic and Photonic Products written by Charles Ume and published by . This book was released on 2001 with total page 322 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Scientific and Technical Aerospace Reports by :
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1995 with total page 704 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Applied mechanics reviews written by and published by . This book was released on 1948 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Energy Efficient Thermal Management of Data Centers by : Yogendra Joshi
Download or read book Energy Efficient Thermal Management of Data Centers written by Yogendra Joshi and published by Springer Science & Business Media. This book was released on 2012-03-23 with total page 635 pages. Available in PDF, EPUB and Kindle. Book excerpt: Energy Efficient Thermal Management of Data Centers examines energy flow in today's data centers. Particular focus is given to the state-of-the-art thermal management and thermal design approaches now being implemented across the multiple length scales involved. The impact of future trends in information technology hardware, and emerging software paradigms such as cloud computing and virtualization, on thermal management are also addressed. The book explores computational and experimental characterization approaches for determining temperature and air flow patterns within data centers. Thermodynamic analyses using the second law to improve energy efficiency are introduced and used in proposing improvements in cooling methodologies. Reduced-order modeling and robust multi-objective design of next generation data centers are discussed.
Book Synopsis Electronic and Photonics Packaging by :
Download or read book Electronic and Photonics Packaging written by and published by American Society of Mechanical Engineers. This book was released on 2007 with total page 560 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Technology for Large Space Systems by :
Download or read book Technology for Large Space Systems written by and published by . This book was released on 1987 with total page 508 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Moisture Sensitivity of Plastic Packages of IC Devices by : X.J. Fan
Download or read book Moisture Sensitivity of Plastic Packages of IC Devices written by X.J. Fan and published by Springer Science & Business Media. This book was released on 2010-07-23 with total page 573 pages. Available in PDF, EPUB and Kindle. Book excerpt: Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
Book Synopsis Advances in Electronic Packaging by :
Download or read book Advances in Electronic Packaging written by and published by . This book was released on 1999 with total page 1138 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Journal of Electronic Packaging by :
Download or read book Journal of Electronic Packaging written by and published by . This book was released on 2008 with total page 120 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings written by and published by . This book was released on 1999 with total page 1306 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Copper Wire Bonding by : Preeti S Chauhan
Download or read book Copper Wire Bonding written by Preeti S Chauhan and published by Springer Science & Business Media. This book was released on 2013-09-20 with total page 254 pages. Available in PDF, EPUB and Kindle. Book excerpt: This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.
Book Synopsis Mechanics of Microsystems by : Alberto Corigliano
Download or read book Mechanics of Microsystems written by Alberto Corigliano and published by John Wiley & Sons. This book was released on 2017-11-20 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: Mechanics of Microsystems Alberto Corigliano, Raffaele Ardito, Claudia Comi, Attilio Frangi, Aldo Ghisi and Stefano Mariani, Politecnico di Milano, Italy A mechanical approach to microsystems, covering fundamental concepts including MEMS design, modelling and reliability Mechanics of Microsystems takes a mechanical approach to microsystems and covers fundamental concepts including MEMS design, modelling and reliability. The book examines the mechanical behaviour of microsystems from a ‘design for reliability’ point of view and includes examples of applications in industry. Mechanics of Microsystems is divided into two main parts. The first part recalls basic knowledge related to the microsystems behaviour and offers an overview on microsystems and fundamental design and modelling tools from a mechanical point of view, together with many practical examples of real microsystems. The second part covers the mechanical characterization of materials at the micro-scale and considers the most important reliability issues (fracture, fatigue, stiction, damping phenomena, etc) which are fundamental to fabricate a real working device. Key features: Provides an overview of MEMS, with special focus on mechanical-based Microsystems and reliability issues. Includes examples of applications in industry. Accompanied by a website hosting supplementary material. The book provides essential reading for researchers and practitioners working with MEMS, as well as graduate students in mechanical, materials and electrical engineering.
Download or read book Technical Abstract Bulletin written by and published by . This book was released on 1967 with total page 712 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Frattura ed Integrità Strutturale: Annals 2014 by : Luca Susmel
Download or read book Frattura ed Integrità Strutturale: Annals 2014 written by Luca Susmel and published by Gruppo Italiano Frattura. This book was released on 2014-09-12 with total page 1208 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book ITHERM written by and published by . This book was released on 2004 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Mechanics of Microelectronics by : G.Q. Zhang
Download or read book Mechanics of Microelectronics written by G.Q. Zhang and published by Springer Science & Business Media. This book was released on 2006-08-25 with total page 580 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.
Book Synopsis Thermo-mechanical Characterization of Evolving Packaging Materials and Structures by : Sheng Liu
Download or read book Thermo-mechanical Characterization of Evolving Packaging Materials and Structures written by Sheng Liu and published by . This book was released on 1998 with total page 156 pages. Available in PDF, EPUB and Kindle. Book excerpt:
