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Analyse Et Caracterisation Des Couplages Substrat Et De La Connectique Dans Les
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Book Synopsis Analyse Et Caractérisation Des Couplages Substrat Et de la Connectique Dans Les Circuits 3D by : Fengyuan Sun
Download or read book Analyse Et Caractérisation Des Couplages Substrat Et de la Connectique Dans Les Circuits 3D written by Fengyuan Sun and published by Editions Publibook. This book was released on 2016 with total page 178 pages. Available in PDF, EPUB and Kindle. Book excerpt: The proposal of doubling the number of transistors on an IC chip (with minimum costs and subtle innovations) every 24 months by Gordon Moore in 1965 (the so-called called Moore's law) has been the most powerful driver for the emphasis of the microelectronics industry in the past 50 years. This law enhances lithography scaling and integration, in 2D, of all functions on a single chip, increasingly through system-on-chip (SOC). On the other hand, the integration of all these functions can be achieved through 3D integrations . Generally speaking, 3D integration consists of 3D IC packaging, 3D IC integration, and 3D Si integration. They are different and mostly the TSV (through-silicon via) separates 3D IC packaging from 3D IC/Si integrations since the latter two uses TSVs, but 3D IC packaging does not. TSV (with a new concept that every chip or interposer could have two surfaces with circuits) is the heart of 3D IC/Si integrations. Continued technology scaling together with the integration of disparate technologies in a single chip means that device performance continues to outstrip interconnect and packaging capabilities, and hence there exist many difficult engineering challenges, most notably in power management, noise isolation, and intra and inter-chip communication. 3D Si integration is the right way to go and compete with Moore's law (more than Moore versus more Moore). However, it is still a long way to go. In this book, Fengyuan SUN proposes new substrate network extraction techniques. Using this latter, the substrate coupling and loss in IC's can be analyzed. He implements some Green/TLM (Transmission Line Matrix) algorithms in MATLAB. It permits to extract impedances between any number of embedded contacts or/and TSVS. He does investigate models of high aspect ratio TSV, on both analytical and numerical methods electromagnetic simulations. This model enables to extract substrate and TSV impedance, S parameters and parasitic elements, considering the variable resistivity of the substrate. It is full compatible with SPICE-like solvers and should allow an investigation in depth of TSV impact on circuit performance.
Book Synopsis Analyse Et Caractérisation Des Couplages Substrat Et de la Connectique Dans Les Circuits 3D by : Fengyuan Sun
Download or read book Analyse Et Caractérisation Des Couplages Substrat Et de la Connectique Dans Les Circuits 3D written by Fengyuan Sun and published by . This book was released on 2014 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: The 3D integration is the most promising technological solution to track the level of integration dictated by Moore's Law (see more than Moore, Moore versus more). It leads to important research for a dozen years. It can superimpose different circuits and components in one box. Its main advantage is to allow a combination of heterogeneous and highly specialized technologies for the establishment of a complete system, while maintaining a high level of performance with very short connections between the different circuits. The objective of this work is to provide consistent modeling via crossing, and / or contacts in the substrate, with various degrees of finesse / precision to allow the high-level designer to manage and especially to optimize the partitioning between the different strata. This modelization involves the development of multiple views at different levels of abstraction: the physical model to "high level" model. This would allow to address various issues faced in the design process: - The physical model using an electromagnetic simulation based on 2D or 3D ( finite element solver ) is used to optimize the via (materials, dimensions etc..) It determines the electrical performance of the via, including high frequency. Electromagnetic simulations also quantify the coupling between adjacent via. - The analytical compact of via their coupling model, based on a description of transmission line or Green cores is used for the simulations at the block level and Spice type simulations. Analytical models are often validated against measurements and / or physical models.
Book Synopsis Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement by : Yue Ma
Download or read book Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement written by Yue Ma and published by CRC Press. This book was released on 2019-03-08 with total page 226 pages. Available in PDF, EPUB and Kindle. Book excerpt: As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.
Book Synopsis Caractérisation et modélisation électrique des phénomènes de couplage par les substrats de silicium dans les empilements 3D de circuits intègrés by : Elie Eid
Download or read book Caractérisation et modélisation électrique des phénomènes de couplage par les substrats de silicium dans les empilements 3D de circuits intègrés written by Elie Eid and published by . This book was released on 2012 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Afin d'améliorer les performances électriques dans les circuits intégrés en 3D, une large modélisation électromagnétique et une caractérisation haute fréquence sont requises. Cela a pour but de quantifier et prédire les phénomènes de couplage par le substrat qui peuvent survenir dans ces circuits intégrés. Ces couplages sont principalement dus aux nombreuses interconnexions verticales par unité de volume qui traversent le silicium et que l'on nomme « Through Silicon Vias » (TSV).L'objectif de cette thèse est de proposer des règles d'optimisation des performances, à savoir la minimisation des effets de couplage par les substrats en RF. Pour cela, différentes configurations de structures de test utilisées pour analyser le couplage sont caractérisées.Les caractérisations sont effectuées sur un très large spectre de fréquence. Les paramètres d'analyse sont les épaisseurs du substrat, les architectures des vias traversant (diamètres, densités, types de barrières), ainsi que la nature des matériaux utilisés. Des modèles électriques permettant de prédire les phénomènes de couplage sont extraits. Différents outils pour l'analyse de ces effets, sont développés dans notre laboratoire. Parallèlement un important travail de modélisation 3D est mené de façon à confronter mesure et simulation et valider nos résultats. Des stratégies d'optimisation pour réduire ces phénomènes dans les circuits 3D ont été proposées, ce qui a permis de fournir de riches informations aux designers.
Book Synopsis The Science of metals by : Zay Jeffries
Download or read book The Science of metals written by Zay Jeffries and published by . This book was released on 1924 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Acta electronica written by and published by . This book was released on 1984 with total page 300 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Neuromuscular Function and Disease by :
Download or read book Neuromuscular Function and Disease written by and published by . This book was released on 2002 with total page 1038 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Scientific Canadian Mechanics' Magazine and Patent Office Record by : Canada. Patent Office
Download or read book Scientific Canadian Mechanics' Magazine and Patent Office Record written by Canada. Patent Office and published by . This book was released on 1966-03 with total page 1070 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Nerve and Muscle written by R. D. Keynes and published by Cambridge University Press. This book was released on 2001-03-15 with total page 196 pages. Available in PDF, EPUB and Kindle. Book excerpt: Essential textbook for all undergraduate students of neurobiology, physiology, cell biology and preclinical medicine.
Book Synopsis River Variability and Complexity by : Stanley A. Schumm
Download or read book River Variability and Complexity written by Stanley A. Schumm and published by Cambridge University Press. This book was released on 2007-08-27 with total page 234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Rivers differ among themselves and through time. An individual river can vary significantly downstream, changing its dimensions and pattern dramatically over a short distance. If hydrology and hydraulics were the primary controls on the morphology and behaviour of large rivers, we would expect long reaches of rivers to maintain characteristic and relatively uniform morphologies. In fact, this is not the case - the variability of large rivers indicates that other important factors are involved. River Variability and Complexity presents an interesting approach to the understanding of river variability. It provides examples of river variability and explains the reasons for them, including fluvial response to human activities. Understanding the mechanisms of variability is important for geomorphologists, geologists, river engineers and sedimentologists as they attempt to interpret ancient fluvial deposits or anticipate river behaviour at different locations and through time. This book provides an excellent background for graduates, researchers and professionals.
Book Synopsis Physical Geography by : Richard J. Chorley
Download or read book Physical Geography written by Richard J. Chorley and published by Prentice Hall. This book was released on 1971 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Formal Methods Applied to Complex Systems by : Jean-Louis Boulanger
Download or read book Formal Methods Applied to Complex Systems written by Jean-Louis Boulanger and published by John Wiley & Sons. This book was released on 2014-07-22 with total page 342 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents real-world examples of formal techniques in an industrial context. It covers formal methods such as SCADE and/or the B Method, in various fields such as railways, aeronautics, and the automotive industry. The purpose of this book is to present a summary of experience on the use of “formal methods” (based on formal techniques such as proof, abstract interpretation and model-checking) in industrial examples of complex systems, based on the experience of people currently involved in the creation and assessment of safety critical system software. The involvement of people from within the industry allows the authors to avoid the usual confidentiality problems which can arise and thus enables them to supply new useful information (photos, architecture plans, real examples, etc.).
Book Synopsis Logica Universalis by : Jean-Yves Beziau
Download or read book Logica Universalis written by Jean-Yves Beziau and published by Springer Science & Business Media. This book was released on 2007-08-08 with total page 247 pages. Available in PDF, EPUB and Kindle. Book excerpt: Universal Logic is not a new logic, but a general theory of logics, considered as mathematical structures. The name was introduced about ten years ago, but the subject is as old as the beginning of modern logic. It was revived after the flowering of thousands of new logics during the last thirty years: there was a need for a systematic theory of logics to put some order in this chaotic multiplicity. The present book contains recent works on universal logic by first-class researchers from all around the world. The book is full of new and challenging ideas that will guide the future of this exciting subject. It will be of interest for people who want to better understand what logic is. It will help those who are lost in the jungle of heterogeneous logical systems to find a way. Tools and concepts are provided here for those who want to study classes of already existing logics or want to design and build new ones.
Book Synopsis An Introduction to Molecular Neurobiology by : Zach W. Hall
Download or read book An Introduction to Molecular Neurobiology written by Zach W. Hall and published by Sinauer Associates, Incorporated. This book was released on 1992 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt: An introduction to Molecular Neurobiology, is a textbook of contemporary cellular and molecular neurobiology written for advanced undergraduates, graduate students, and practising neurobiologists. This book describes the behaviour and properties of neurons and glia and how these arise from the molecules that constitute them. Major sections focus on the signals that neurons use and how they are produced, the molecular and cellular organization of neurons and glia, neuronal differentiation, synaptic plasticity, and the molecular basis of neuronal diseases. Each chapter is written by an expert in the field and gives an up-to-date account of major questions, experimental approaches, the present state of knowledge, and future directions. Boxes provide historical, technical, or biographical notes, and expand on points of particular interest to contemporary research. The book has been carefully edited to give uniformity of style and coverage, and is illustrated in two colours.
Book Synopsis Peripheral Nerve Lesions by : Marco Mumenthaler
Download or read book Peripheral Nerve Lesions written by Marco Mumenthaler and published by . This book was released on 1991 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Clast Lithological Analysis by : D. R. Bridgland
Download or read book Clast Lithological Analysis written by D. R. Bridgland and published by . This book was released on 1986 with total page 228 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Networks written by Mark Newman and published by OUP Oxford. This book was released on 2010-03-25 with total page 789 pages. Available in PDF, EPUB and Kindle. Book excerpt: The scientific study of networks, including computer networks, social networks, and biological networks, has received an enormous amount of interest in the last few years. The rise of the Internet and the wide availability of inexpensive computers have made it possible to gather and analyze network data on a large scale, and the development of a variety of new theoretical tools has allowed us to extract new knowledge from many different kinds of networks. The study of networks is broadly interdisciplinary and important developments have occurred in many fields, including mathematics, physics, computer and information sciences, biology, and the social sciences. This book brings together for the first time the most important breakthroughs in each of these fields and presents them in a coherent fashion, highlighting the strong interconnections between work in different areas. Subjects covered include the measurement and structure of networks in many branches of science, methods for analyzing network data, including methods developed in physics, statistics, and sociology, the fundamentals of graph theory, computer algorithms, and spectral methods, mathematical models of networks, including random graph models and generative models, and theories of dynamical processes taking place on networks.
