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Author :
Publisher :
ISBN 13 :
Total Pages : 480 pages
Book Rating : 4.3/5 (91 download)
Download or read book Advances in Thermal Modeling of Electronic Components and Systems written by and published by . This book was released on 1998 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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Publisher : ASM International
ISBN 13 : 9780871702852
Total Pages : 1234 pages
Book Rating : 4.7/5 (28 download)
Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author : Ralph Remsburg
Publisher : Springer Science & Business Media
ISBN 13 : 9780412122712
Total Pages : 632 pages
Book Rating : 4.1/5 (227 download)
Download or read book Advanced Thermal Design of Electronic Equipment written by Ralph Remsburg and published by Springer Science & Business Media. This book was released on 1998-02-28 with total page 632 pages. Available in PDF, EPUB and Kindle. Book excerpt: With today's high density, high performance electronic systems, packaging and more specifically thermal engineering has become the critical factor that limits on-time product introduction and reliability in the field. This book serves as a reference for engineers who must predict the thermal performance of a company's latest product as well as the technicians who must quickly solve the problem of an overheating chip in a product that is already on the shelves.
Author : Ralph Remsburg
Publisher : Springer Science & Business Media
ISBN 13 : 1441985093
Total Pages : 618 pages
Book Rating : 4.4/5 (419 download)
Download or read book Advanced Thermal Design of Electronic Equipment written by Ralph Remsburg and published by Springer Science & Business Media. This book was released on 2011-06-27 with total page 618 pages. Available in PDF, EPUB and Kindle. Book excerpt: The field of electronic packaging continues to grow at an amazing rate. To be successful in this field requires analytical skills, a foundation in mechanical engineering, and access to the latest developments in the electronics field. The emphasis for each project that the electronic packaging engineer faces changes from project to project, and from company to company, yet some constants should continue into the foreseeable future. One of these is the emphasis on ther mal design. Although just a few years ago thermal analysis of electronic equipment was an afterthought, it is becoming one of the primary aspects of many packaging jobs. It seems that the days of just adding a bigger fan to reduce the overheat ing problem are almost over. Replacing that thought is the up-front commitment to CFD (Computational Fluid Dynamics) software code, FEA (Finite Element Analysis) software, and the realization that the problem will only get worse. As the electronic circuit size is reduced, speed is increased. As the power of these systems increases and the volume allowed diminishes, heat flux or density (heat per unit area, W/m 2 or Btulh ft2) has spiraled. Much of the improvement in the reliability and packaging density of electronic circuits can be traced to advances in thermal design. While air cooling is still used extensively, advanced heat transfer techniques using exotic synthetic liquids are becoming more prominent, allowing still smaller systems to be manufactured. The appli cation of advanced thermal management techniques requires a background in fluid dynamics.
Author :
Publisher : CRC Press
ISBN 13 : 9781439876060
Total Pages : 2642 pages
Book Rating : 4.8/5 (76 download)
Download or read book The CRC Handbook of Mechanical Engineering, Second Edition written by and published by CRC Press. This book was released on 1998-03-24 with total page 2642 pages. Available in PDF, EPUB and Kindle. Book excerpt: During the past 20 years, the field of mechanical engineering has undergone enormous changes. These changes have been driven by many factors, including: the development of computer technology worldwide competition in industry improvements in the flow of information satellite communication real time monitoring increased energy efficiency robotics automatic control increased sensitivity to environmental impacts of human activities advances in design and manufacturing methods These developments have put more stress on mechanical engineering education, making it increasingly difficult to cover all the topics that a professional engineer will need in his or her career. As a result of these developments, there has been a growing need for a handbook that can serve the professional community by providing relevant background and current information in the field of mechanical engineering. The CRC Handbook of Mechanical Engineering serves the needs of the professional engineer as a resource of information into the next century.
Author : Richard C. Dorf
Publisher : CRC Press
ISBN 13 : 9781420049763
Total Pages : 2758 pages
Book Rating : 4.0/5 (497 download)
Download or read book The Electrical Engineering Handbook,Second Edition written by Richard C. Dorf and published by CRC Press. This book was released on 1997-09-26 with total page 2758 pages. Available in PDF, EPUB and Kindle. Book excerpt: In 1993, the first edition of The Electrical Engineering Handbook set a new standard for breadth and depth of coverage in an engineering reference work. Now, this classic has been substantially revised and updated to include the latest information on all the important topics in electrical engineering today. Every electrical engineer should have an opportunity to expand his expertise with this definitive guide. In a single volume, this handbook provides a complete reference to answer the questions encountered by practicing engineers in industry, government, or academia. This well-organized book is divided into 12 major sections that encompass the entire field of electrical engineering, including circuits, signal processing, electronics, electromagnetics, electrical effects and devices, and energy, and the emerging trends in the fields of communications, digital devices, computer engineering, systems, and biomedical engineering. A compendium of physical, chemical, material, and mathematical data completes this comprehensive resource. Every major topic is thoroughly covered and every important concept is defined, described, and illustrated. Conceptually challenging but carefully explained articles are equally valuable to the practicing engineer, researchers, and students. A distinguished advisory board and contributors including many of the leading authors, professors, and researchers in the field today assist noted author and professor Richard Dorf in offering complete coverage of this rapidly expanding field. No other single volume available today offers this combination of broad coverage and depth of exploration of the topics. The Electrical Engineering Handbook will be an invaluable resource for electrical engineers for years to come.
Author : Ralph Remsburg
Publisher : CRC Press
ISBN 13 : 1351835912
Total Pages : 440 pages
Book Rating : 4.3/5 (518 download)
Download or read book Thermal Design of Electronic Equipment written by Ralph Remsburg and published by CRC Press. This book was released on 2017-12-19 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt: In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
Author :
Publisher :
ISBN 13 :
Total Pages : 682 pages
Book Rating : 4.:/5 (31 download)
Download or read book Applied Mechanics Reviews written by and published by . This book was released on 1989 with total page 682 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Mike Golio
Publisher : CRC Press
ISBN 13 : 1439833230
Total Pages : 2208 pages
Book Rating : 4.4/5 (398 download)
Download or read book The RF and Microwave Handbook - 3 Volume Set written by Mike Golio and published by CRC Press. This book was released on 2018-10-08 with total page 2208 pages. Available in PDF, EPUB and Kindle. Book excerpt: By 1990 the wireless revolution had begun. In late 2000, Mike Golio gave the world a significant tool to use in this revolution: The RF and Microwave Handbook. Since then, wireless technology spread across the globe with unprecedented speed, fueled by 3G and 4G mobile technology and the proliferation of wireless LANs. Updated to reflect this tremendous growth, the second edition of this widely embraced, bestselling handbook divides its coverage conveniently into a set of three books, each focused on a particular aspect of the technology. Six new chapters cover WiMAX, broadband cable, bit error ratio (BER) testing, high-power PAs (power amplifiers), heterojunction bipolar transistors (HBTs), as well as an overview of microwave engineering. Over 100 contributors, with diverse backgrounds in academic, industrial, government, manufacturing, design, and research reflect the breadth and depth of the field. This eclectic mix of contributors ensures that the coverage balances fundamental technical issues with the important business and marketing constraints that define commercial RF and microwave engineering. Focused chapters filled with formulas, charts, graphs, diagrams, and tables make the information easy to locate and apply to practical cases. The new format, three tightly focused volumes, provides not only increased information but also ease of use. You can find the information you need quickly, without wading through material you don’t immediately need, giving you access to the caliber of data you have come to expect in a much more user-friendly format.
Author : R.R. Tummala
Publisher : Springer Science & Business Media
ISBN 13 : 1461540860
Total Pages : 742 pages
Book Rating : 4.4/5 (615 download)
Download or read book Microelectronics Packaging Handbook written by R.R. Tummala and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 742 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Author :
Publisher :
ISBN 13 :
Total Pages : 798 pages
Book Rating : 4.0/5 ( download)
Download or read book ITHERM written by and published by . This book was released on 2004 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : P.L. Dhar
Publisher : Academic Press
ISBN 13 : 0128094303
Total Pages : 618 pages
Book Rating : 4.1/5 (28 download)
Download or read book Thermal System Design and Simulation written by P.L. Dhar and published by Academic Press. This book was released on 2016-10-25 with total page 618 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal System Design and Simulation covers the fundamental analyses of thermal energy systems that enable users to effectively formulate their own simulation and optimal design procedures. This reference provides thorough guidance on how to formulate optimal design constraints and develop strategies to solve them with minimal computational effort. The book uniquely illustrates the methodology of combining information flow diagrams to simplify system simulation procedures needed in optimal design. It also includes a comprehensive presentation on dynamics of thermal systems and the control systems needed to ensure safe operation at varying loads. Designed to give readers the skills to develop their own customized software for simulating and designing thermal systems, this book is relevant for anyone interested in obtaining an advanced knowledge of thermal system analysis and design. - Contains detailed models of simulation for equipment in the most commonly used thermal engineering systems - Features illustrations for the methodology of using information flow diagrams to simplify system simulation procedures - Includes comprehensive global case studies of simulation and optimization of thermal systems
Author : Mike Golio
Publisher : CRC Press
ISBN 13 : 1420039970
Total Pages : 336 pages
Book Rating : 4.4/5 (2 download)
Download or read book RF and Microwave Semiconductor Device Handbook written by Mike Golio and published by CRC Press. This book was released on 2017-12-19 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt: Offering a single volume reference for high frequency semiconductor devices, this handbook covers basic material characteristics, system level concerns and constraints, simulation and modeling of devices, and packaging. Individual chapters detail the properties and characteristics of each semiconductor device type, including: Varactors, Schottky diodes, transit-time devices, BJTs, HBTs, MOSFETs, MESFETs, and HEMTs. Written by leading researchers in the field, the RF and Microwave Semiconductor Device Handbook provides an excellent starting point for programs involving development, technology comparison, or acquisition of RF and wireless semiconductor devices.
Author : Mike Golio
Publisher : CRC Press
ISBN 13 : 1420036769
Total Pages : 1377 pages
Book Rating : 4.4/5 (2 download)
Download or read book The RF and Microwave Handbook written by Mike Golio and published by CRC Press. This book was released on 2000-12-20 with total page 1377 pages. Available in PDF, EPUB and Kindle. Book excerpt: The recent shift in focus from defense and government work to commercial wireless efforts has caused the job of the typical microwave engineer to change dramatically. The modern microwave and RF engineer is expected to know customer expectations, market trends, manufacturing technologies, and factory models to a degree that is unprecedented in the
Author :
Publisher :
ISBN 13 :
Total Pages : 206 pages
Book Rating : 4.3/5 (91 download)
Download or read book Proceedings written by and published by . This book was released on 1995 with total page 206 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Jerry C. Whitaker
Publisher : CRC Press
ISBN 13 : 9780849383458
Total Pages : 2626 pages
Book Rating : 4.3/5 (834 download)
Download or read book The Electronics Handbook written by Jerry C. Whitaker and published by CRC Press. This book was released on 1996-12-23 with total page 2626 pages. Available in PDF, EPUB and Kindle. Book excerpt: The superb organization of The Electronics Handbook means that it is not only a comprehensive and fascinating reference, but also a pleasure to use. Some of these organizational features include:
Author : John H. Lau
Publisher : Springer Science & Business Media
ISBN 13 : 9780442014414
Total Pages : 584 pages
Book Rating : 4.0/5 (144 download)
Download or read book Chip On Board written by John H. Lau and published by Springer Science & Business Media. This book was released on 1994-06-30 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
