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Advanced Routing Of Electronic Modules
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Book Synopsis Advanced Routing of Electronic Modules by : Michael Pecht
Download or read book Advanced Routing of Electronic Modules written by Michael Pecht and published by CRC Press. This book was released on 1995-10-23 with total page 474 pages. Available in PDF, EPUB and Kindle. Book excerpt: The rapid growth of the electronic products market has created an increasing need for affordable, reliable, high-speed and high-density multi-layer printed circuit boards (PCBs). This book presents the technologies, algorithms, and methodologies for engineers and others developing the next generation of electronic products. A vision of the future in advanced electronics Advanced Routing of Electronic Modules provides both fundamental theory and advanced technologies for improving routing. Beginning chapters discuss approaches to approximate a minimum rectilinear Steiner tree from a minimum spanning tree and introduce ways to avoid obstacles for routing simple multi-terminal nets sequentially in a workspace. Timing delay, clock skew, and noise control requirements in signal integrity are described as well as computer-aided approaches to managing these requirements in high-speed PCB/MCM routing. Later chapters present the two-layer wiring problem, rip-up and reroute approaches, and parallel routing, including global routing, boundary crossing placement, and detailed maze routing in hardware acceleration. Data structures, data management, and algorithms for parallel routing in a multiple-processor hardware systems are also covered.
Book Synopsis Placement and Routing of Electronic Modules by : Michael Pecht
Download or read book Placement and Routing of Electronic Modules written by Michael Pecht and published by CRC Press. This book was released on 2020-08-26 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt: This practical guide presents and compares the fundamental theories and techniques of placement and routing and provides important new approaches to solving specific problems.;Focusing on highly reliable methods for good manufacturing capability, Placement and Routing of Electronic Modules: discusses the mathematical basis for placement and routing, including set, combinatorial and graph theories; explicates the definitions, structures and relationships of tree types and gives methods of finding minimum trees; furnishes useful techniques for placing and routing high-density modules; supplies ways to determine the work-space area needed for placement and routing; shows how to estimate the number of layers necessary to complete routing; explains via minimization to reduce work-space area, facilitate manufacture, and reduce the number of layers; demonstrates a variety of search strategies for paths connecting two nodes on a work space with obstacles; and much more. Containing over 300 illustrative examples, figures and tables that clarify concepts and enhance understanding, Placement and Routing of Electronic Modules should be a useful tool for electrical and electronics, mechanical, reliability, process, and manufacturing engineers; computer scientists; applied mathematicians; and graduate-level students in these disciplines.
Book Synopsis Guidebook for Managing Silicon Chip Reliability by : Michael Pecht
Download or read book Guidebook for Managing Silicon Chip Reliability written by Michael Pecht and published by CRC Press. This book was released on 2017-11-22 with total page 205 pages. Available in PDF, EPUB and Kindle. Book excerpt: Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future? Chapters discuss: failure sites, operational loads, and failure mechanism intrinsic device sensitivities electromigration hot carrier aging time dependent dielectric breakdown mechanical stress induced migration alpha particle sensitivity electrostatic discharge (ESD) and electrical overstress latch-up qualification screening guidelines for designing reliability Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.
Book Synopsis High Temperature Electronics by : F. Patrick McCluskey
Download or read book High Temperature Electronics written by F. Patrick McCluskey and published by CRC Press. This book was released on 1996-12-13 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Book Synopsis Handbook of Electronic Package Design by : Michael Pecht
Download or read book Handbook of Electronic Package Design written by Michael Pecht and published by CRC Press. This book was released on 2018-10-24 with total page 844 pages. Available in PDF, EPUB and Kindle. Book excerpt: Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Book Synopsis Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines by : Michael Pecht
Download or read book Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines written by Michael Pecht and published by John Wiley & Sons. This book was released on 1994-03-31 with total page 470 pages. Available in PDF, EPUB and Kindle. Book excerpt: Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals. Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to: * Define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost * Define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data * Identify potential failure modes, sites, mechanisms, and architecture-stress interactions--PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures * Characterize materials and processes by the key controllable factors, such as types and levels of defects, variations in material properties and dimensions, and the manufacturing and assembly processes involved * Use experiment, step-stress, and accelerated methods to ensure optimum design before production begins Detailed design guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. Detailed guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. of related interest... PHYSICAL ARCHITECTURE OF VLSI SYSTEMS --Allan D. Kraus, Robert Hannemann and Michael Pecht For the professional engineer involved in the design and manufacture of products containing electronic components, here is a comprehensive handbook to the theory and methods surrounding the assembly of microelectronic and electronic components. The book focuses on computers and consumer electronic products with internal subsystems that reflect mechanical design constraints, cost limitations, and aesthetic and ergonomic concerns. Taking a total system approach to packaging, the book systematically examines: basic chip and computer architecture; design and layout; interassembly and interconnections; cooling scheme; materials selection, including ceramics, glasses, and metals; stress, vibration, and acoustics; and manufacturing and assembly technology. 1994 (0-471-53299-1) pp. SOLDERING PROCESSES AND EQUIPMENT --Michael G. Pecht This comprehensive, fundamentals first handbook outlines the soldering methods and techniques used in the manufacture of microelectronic chips and electronic circuit boards. In a clear, easy-to-access format, the book discusses: soldering processes and classification; the material dynamics of heat soldering when assembling differing materials; wave and reflow soldering; controlling contamination during manufacturing cleanings; techniques for assuring reliability and quality control during manufacturing; rework, repair, and manual assembly; the modern assembly / repair station; and more. The book also provides clear guidelines on assembly techniques as well as an appendix of various solder equipment manufacturers. 1993 (0-471-59167-X) 312 pp.
Book Synopsis Microelectronic Manufacturing Yield, Reliability, and Failure Analysis by :
Download or read book Microelectronic Manufacturing Yield, Reliability, and Failure Analysis written by and published by . This book was released on 1997 with total page 218 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Advanced Router Architectures by : Axel K. Kloth
Download or read book Advanced Router Architectures written by Axel K. Kloth and published by CRC Press. This book was released on 2018-10-03 with total page 240 pages. Available in PDF, EPUB and Kindle. Book excerpt: Routers, switches, and transmission equipment form the backbone of the Internet, yet many users and service technicians do not understand how these nodes really work. Advanced Router Architectures addresses how components of advanced routers work together and how they are integrated with each other. This book provides the background behind why these building blocks perform certain functions, and how the function is implemented in general use. It offers an introduction to the subject matter that is intended to trigger deeper interest from the reader. The book explains, for example, why traffic management may be important in certain applications, what the traffic manager does, and how it connects to the rest of the router. The author also examines the implications of the introduction or omission of a traffic manager into an advanced router. The text offers a similar analysis for other router topics such as QOS and policy enforcement, security processing (including DoS/DDoS), and more. This book covers which mandatory and which optional building blocks can be found in an advanced router, and how these building blocks operate in conjunction to ensure that the Internet performs as expected.
Book Synopsis Photonics, Volume 3 by : David L. Andrews
Download or read book Photonics, Volume 3 written by David L. Andrews and published by John Wiley & Sons. This book was released on 2015-03-23 with total page 542 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discusses the basic physical principles underlying the technology instrumentation of photonics This volume discusses photonics technology and instrumentation. The topics discussed in this volume are: Communication Networks; Data Buffers; Defense and Security Applications; Detectors; Fiber Optics and Amplifiers; Green Photonics; Instrumentation and Metrology; Interferometers; Light-Harvesting Materials; Logic Devices; Optical Communications; Remote Sensing; Solar Energy; Solid-State Lighting; Wavelength Conversion Comprehensive and accessible coverage of the whole of modern photonics Emphasizes processes and applications that specifically exploit photon attributes of light Deals with the rapidly advancing area of modern optics Chapters are written by top scientists in their field Written for the graduate level student in physical sciences; Industrial and academic researchers in photonics, graduate students in the area; College lecturers, educators, policymakers, consultants, Scientific and technical libraries, government laboratories, NIH.
Book Synopsis The British National Bibliography by : Arthur James Wells
Download or read book The British National Bibliography written by Arthur James Wells and published by . This book was released on 1996 with total page 2024 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Handbook of Thick- and Thin-Film Hybrid Microelectronics by : Tapan Gupta
Download or read book Handbook of Thick- and Thin-Film Hybrid Microelectronics written by Tapan Gupta and published by Wiley-Interscience. This book was released on 2003-04-17 with total page 432 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the first handbook on the fabrication and design of hybrid microelectronic circuits. * Deals with all aspects of the technology, design, layout and processing of materials. * Fills the need for a comprehensive survey of a widely-used technology.
Book Synopsis Pilot Protective Relaying by : Elmore
Download or read book Pilot Protective Relaying written by Elmore and published by Routledge. This book was released on 2018-04-27 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt: This text concentrates on the fundamentals of protective relaying and aims to provide lasting information in intelligible language. It covers the relative qualities of modern transmission line systems, communications channels, three-terminal applications and program design for microprocessors, and also supplies an encyclopaedic bibliography listing professional papers useful to the relay engineer.
Book Synopsis Electrical Contacts by : Milenko Braunovic
Download or read book Electrical Contacts written by Milenko Braunovic and published by CRC Press. This book was released on 2017-12-19 with total page 640 pages. Available in PDF, EPUB and Kindle. Book excerpt: Various factors affect the performance of electrical contacts, including tribological, mechanical, electrical, and materials aspects. Although these behaviors have been studied for many years, they are not widely used or understood in practice. Combining approaches used across the globe, Electrical Contacts: Fundamentals, Applications, and Technology integrates advances in research and development in the tribological, material, and analytical aspects of electrical contacts with new data on electrical current transfer at the micro- and nanoscales. Taking an application-oriented approach, the authors illustrate how material characteristics, tribological behavior, and loading impact the degradation of contacts, formation of intermetallics, and overall reliability and performance. Coverage is divided broadly into three sections, with the first focused on mechanics, tribology, materials, current and heat transfer, and basic reliability issues of electrical contacts. The next section explores applications, such as power connections, electronic connections, and sliding contacts, while the final section presents the diagnostic and monitoring techniques used to investigate and measure phenomena occurring at electrical contact interfaces. Numerous references to current literature reflect the fact that this book is the most comprehensive survey in the field. Explore an impressive collection of data, theory, and practical applications in Electrical Contacts: Fundamentals, Applications, and Technology, a critical tool for anyone investigating or designing electrical equipment with improved performance and reliability in mind.
Download or read book Forthcoming Books written by Rose Arny and published by . This book was released on 1996-06 with total page 3088 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Electronic Packaging Materials and Their Properties by : Michael Pecht
Download or read book Electronic Packaging Materials and Their Properties written by Michael Pecht and published by CRC Press. This book was released on 2017-12-19 with total page 126 pages. Available in PDF, EPUB and Kindle. Book excerpt: Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
Book Synopsis Embedded Systems Design with 8051 Microcontrollers by : Zdravko Karakehayov
Download or read book Embedded Systems Design with 8051 Microcontrollers written by Zdravko Karakehayov and published by CRC Press. This book was released on 2018-10-08 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt: A presentation of developments in microcontroller technology, providing lucid instructions on its many and varied applications. It focuses on the popular eight-bit microcontroller, the 8051, and the 83C552. The text outlines a systematic methodology for small-scale, control-dominated embedded systems, and is accompanied by a disk of all the example problems included in the book.
Download or read book Proceedings written by and published by . This book was released on 1996 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt:
