Advanced Packaging And Manufacturing Technology Based On Adhesion Engineering

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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering

Author : Seonho Seok
Publisher : Springer
ISBN 13 : 3319778722
Total Pages : 119 pages
Book Rating : 4.3/5 (197 download)

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Book Synopsis Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering by : Seonho Seok

Download or read book Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering written by Seonho Seok and published by Springer. This book was released on 2018-04-27 with total page 119 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films – a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load–displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.

Materials for Advanced Packaging

Author : Daniel Lu
Publisher : Springer
ISBN 13 : 3319450980
Total Pages : 974 pages
Book Rating : 4.3/5 (194 download)

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Book Synopsis Materials for Advanced Packaging by : Daniel Lu

Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Semiconductor Advanced Packaging

Author : John H. Lau
Publisher : Springer Nature
ISBN 13 : 9811613761
Total Pages : 513 pages
Book Rating : 4.8/5 (116 download)

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Book Synopsis Semiconductor Advanced Packaging by : John H. Lau

Download or read book Semiconductor Advanced Packaging written by John H. Lau and published by Springer Nature. This book was released on 2021-05-17 with total page 513 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Advanced Manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging

Author :
Publisher : Emerald Group Publishing
ISBN 13 : 184663010X
Total Pages : 72 pages
Book Rating : 4.8/5 (466 download)

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Book Synopsis Advanced Manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging by :

Download or read book Advanced Manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging written by and published by Emerald Group Publishing. This book was released on 2006 with total page 72 pages. Available in PDF, EPUB and Kindle. Book excerpt: This issue of Soldering & Surface Mount Technology (SSMT) presents a number of papers from the 7th High Density Microsystems Design, Packaging and Failure Analysis (HDP'05) conference held in 2005 in the dynamic city of Shanghai, China. With over 100 high quality technical papers and presentation this annual conference brings together scholars and industrialists from Asia, Europe and the Americas to discuss the challenges and latest advances in high density packaging. This e-book contains six papers from the HDP conference, plus one additional contribution, which discuss the behaviour of key i.

Adhesive Bonding

Author : Robert D. Adams
Publisher : Woodhead Publishing
ISBN 13 : 0323851436
Total Pages : 828 pages
Book Rating : 4.3/5 (238 download)

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Book Synopsis Adhesive Bonding by : Robert D. Adams

Download or read book Adhesive Bonding written by Robert D. Adams and published by Woodhead Publishing. This book was released on 2021-07-02 with total page 828 pages. Available in PDF, EPUB and Kindle. Book excerpt: Adhesive Bonding: Science, Technology and Applications, Second Edition guides the reader through the fundamentals, mechanical properties and applications of adhesive bonding. This thoroughly revised and expanded new edition reflects the many advances that have occurred in recent years. Sections cover the fundamentals of adhesive bonding, explaining how adhesives and sealants work, and how to assess and treat surfaces, how adhesives perform under stress and the factors affecting fatigue and failure, stress analysis, environmental durability, non-destructive testing, impact behavior, fracture mechanics, fatigue, vibration damping, and applications in construction, automotive, marine, footwear, electrical engineering, aerospace, repair, electronics, biomedicine, and bonding of composites. With its distinguished editor and international team of contributors, this book is an essential resource for industrial engineers, R&D, and scientists working with adhesives and their industrial applications, as well as researchers and advanced students in adhesion, joining, polymer science, materials science and mechanical engineering. Offers detailed, methodical coverage of the fundamentals, mechanical properties and industrial applications of adhesive bonding Enables the successful preparation of adhesives for a broad range of important load-bearing applications in areas such as automotive and aerospace, construction, electronics and biomedicine Covers the latest advances in adhesive bonding, including improved repair techniques for metallic and composite structures, cohesive zone modeling, and disassembly and recycling

Electronic Packaging Science and Technology

Author : King-Ning Tu
Publisher : John Wiley & Sons
ISBN 13 : 111941833X
Total Pages : 336 pages
Book Rating : 4.1/5 (194 download)

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Book Synopsis Electronic Packaging Science and Technology by : King-Ning Tu

Download or read book Electronic Packaging Science and Technology written by King-Ning Tu and published by John Wiley & Sons. This book was released on 2021-12-14 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt: Must-have reference on electronic packaging technology! The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.

Modeling and Simulation for Microelectronic Packaging Assembly

Author : Shen Liu
Publisher : John Wiley & Sons
ISBN 13 : 0470827807
Total Pages : 586 pages
Book Rating : 4.4/5 (78 download)

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Book Synopsis Modeling and Simulation for Microelectronic Packaging Assembly by : Shen Liu

Download or read book Modeling and Simulation for Microelectronic Packaging Assembly written by Shen Liu and published by John Wiley & Sons. This book was released on 2011-05-17 with total page 586 pages. Available in PDF, EPUB and Kindle. Book excerpt: Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging

Encyclopedia of Packaging Materials, Processes, and Mechanics

Author : Avram Bar-Cohen
Publisher : World Scientific
ISBN 13 : 9811209634
Total Pages : 1079 pages
Book Rating : 4.8/5 (112 download)

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Book Synopsis Encyclopedia of Packaging Materials, Processes, and Mechanics by : Avram Bar-Cohen

Download or read book Encyclopedia of Packaging Materials, Processes, and Mechanics written by Avram Bar-Cohen and published by World Scientific. This book was released on 2019 with total page 1079 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories. The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging "learning curve," the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications"--Publisher's website

Transducers ’01 Eurosensors XV

Author : Ernst Obermeier
Publisher : Springer
ISBN 13 : 3642594972
Total Pages : 1763 pages
Book Rating : 4.6/5 (425 download)

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Book Synopsis Transducers ’01 Eurosensors XV by : Ernst Obermeier

Download or read book Transducers ’01 Eurosensors XV written by Ernst Obermeier and published by Springer. This book was released on 2016-05-12 with total page 1763 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Conference is the premier international meeting for the presentation of original work addressing all aspects of the theory, design, fabrication, assembly, packaging, testing and application of solid-state sensors, actuators, MEMS, and microsystems.

Direct Copper Interconnection for Advanced Semiconductor Technology

Author : Dongkai Shangguan
Publisher : CRC Press
ISBN 13 : 1040028691
Total Pages : 549 pages
Book Rating : 4.0/5 (4 download)

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Book Synopsis Direct Copper Interconnection for Advanced Semiconductor Technology by : Dongkai Shangguan

Download or read book Direct Copper Interconnection for Advanced Semiconductor Technology written by Dongkai Shangguan and published by CRC Press. This book was released on 2024-06-28 with total page 549 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.

Electronic Packaging

Author : John H. Lau
Publisher : McGraw-Hill Professional Publishing
ISBN 13 : 9780070371354
Total Pages : 0 pages
Book Rating : 4.3/5 (713 download)

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Book Synopsis Electronic Packaging by : John H. Lau

Download or read book Electronic Packaging written by John H. Lau and published by McGraw-Hill Professional Publishing. This book was released on 1998 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Here is the ultimate electronic packaging resource, in which luminaries from the four intertwined disciplines of packaging present a one-stop guide to the state of the art. An absolute necessity for anyone working in the field, this "how-to" reference covers all the newest technologies, including BGA, Flip Chip, and CSP.

Polymers in Organic Electronics

Author : Sulaiman Khalifeh
Publisher : Elsevier
ISBN 13 : 192788568X
Total Pages : 617 pages
Book Rating : 4.9/5 (278 download)

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Book Synopsis Polymers in Organic Electronics by : Sulaiman Khalifeh

Download or read book Polymers in Organic Electronics written by Sulaiman Khalifeh and published by Elsevier. This book was released on 2020-04-01 with total page 617 pages. Available in PDF, EPUB and Kindle. Book excerpt: Polymers in Organic Electronics: Polymer Selection for Electronic, Mechatronic, and Optoelectronic Systems provides readers with vital data, guidelines, and techniques for optimally designing organic electronic systems using novel polymers. The book classifies polymer families, types, complexes, composites, nanocomposites, compounds, and small molecules while also providing an introduction to the fundamental principles of polymers and electronics. Features information on concepts and optimized types of electronics and a classification system of electronic polymers, including piezoelectric and pyroelectric, optoelectronic, mechatronic, organic electronic complexes, and more. The book is designed to help readers select the optimized material for structuring their organic electronic system.Chapters discuss the most common properties of electronic polymers, methods of optimization, and polymeric-structured printed circuit boards. The polymeric structures of optoelectronics and photonics are covered and the book concludes with a chapter emphasizing the importance of polymeric structures for packaging of electronic devices. Provides key identifying details on a range of polymers, micro-polymers, nano-polymers, resins, hydrocarbons, and oligomers Covers the most common electrical, electronic, and optical properties of electronic polymers Describes the underlying theories on the mechanics of polymer conductivity Discusses polymeric structured printed circuit boards, including their rapid prototyping and optimizing their polymeric structures Shows optimization methods for both polymeric structures of organic active electronic components and organic passive electronic components

Adhesion in Microelectronics

Author : K. L. Mittal
Publisher : John Wiley & Sons
ISBN 13 : 1118831349
Total Pages : 293 pages
Book Rating : 4.1/5 (188 download)

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Book Synopsis Adhesion in Microelectronics by : K. L. Mittal

Download or read book Adhesion in Microelectronics written by K. L. Mittal and published by John Wiley & Sons. This book was released on 2014-08-25 with total page 293 pages. Available in PDF, EPUB and Kindle. Book excerpt: This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings

Advanced Wirebond Interconnection Technology

Author : Shankara K. Prasad
Publisher : Springer Science & Business Media
ISBN 13 : 1402077637
Total Pages : 694 pages
Book Rating : 4.4/5 (2 download)

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Book Synopsis Advanced Wirebond Interconnection Technology by : Shankara K. Prasad

Download or read book Advanced Wirebond Interconnection Technology written by Shankara K. Prasad and published by Springer Science & Business Media. This book was released on 2006-05-10 with total page 694 pages. Available in PDF, EPUB and Kindle. Book excerpt: From the reviews: "This book is intended for an assembly production house setting, appropriate for management, designers, chief operators, as well as wirebond production engineers. Operational issues such as specifying and optimizing wire and automatic bonders for a product line are included. The book is very good with "visual" explanations for quick grasping of the issues. In addition, the fundamental metallurgical or mechanical root causes behind material and process choices are presented. The book has a clear prose style and a very readable font and page layout. The figures, although effective, are simply low resolution screen prints from a personal computer and thus have aliasing and fuzziness. This book has excellent overall tutorial and enough description of wire and bonding equipment so the reader could specify and negotiate correctly for with suppliers. The majority of the book dwells on establishing the bonding process for a particular product; determining the "window" of adjustments. The book ends with discussions on establishing quality metrics and reliability assurance tests. Each chapter of the book includes enough tutorial information to allow it to alone with little need to page backwards. A short but good reference section is at the end. If you have not read a wirebonding book, or the one you read 10 years ago was borrowed and never returned, now is the time to buy this book." ( CMPT Newsletter, June 2005)

Engineering and Structural Adhesives

Author : D. J. Dunn
Publisher : iSmithers Rapra Publishing
ISBN 13 : 9781859574362
Total Pages : 152 pages
Book Rating : 4.5/5 (743 download)

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Book Synopsis Engineering and Structural Adhesives by : D. J. Dunn

Download or read book Engineering and Structural Adhesives written by D. J. Dunn and published by iSmithers Rapra Publishing. This book was released on 2004 with total page 152 pages. Available in PDF, EPUB and Kindle. Book excerpt: This review discusses the types of engineering adhesives in use, properties, advantages and disadvantages, and applications. It is very clearly written, well referenced and provides an excellent overview of a rapidly developing field. The author is an expert with many years of experience in adhesive research and development. The review is accompanied by around 400 abstracts from papers and books in the Polymer Library, to facilitate further reading on this subject.

Rapid Cure Composites

Author : Nishar Hameed
Publisher : Elsevier
ISBN 13 : 0323985351
Total Pages : 301 pages
Book Rating : 4.3/5 (239 download)

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Book Synopsis Rapid Cure Composites by : Nishar Hameed

Download or read book Rapid Cure Composites written by Nishar Hameed and published by Elsevier. This book was released on 2023-05-17 with total page 301 pages. Available in PDF, EPUB and Kindle. Book excerpt: Rapid Cure Composites: Materials, Processing and Manufacturing presents up-to-date information on the design criteria to formulate matrix systems for rapid curing. Emphasis is placed on the role different materials [resin compound and fiber reinforcement] play in developing fast curing composites, assessment of current and novel manufacturing techniques for adapting fast curing processes, the comparison between conventional curing and rapid curing, and different applications in various industrial sectors [e.g., aerospace, automotive, renewables and marine]. The book will be an essential reference resource for academic and industrial researchers working in the field of composite materials, processing and manufacturing organizations, materials scientists, and more. Polymer composites are widely used in several industries, including aerospace, automobile, spray and coatings, and electronics due to their lightweight and superior mechanical properties. However, one of the dominant hurdles towards their growth in commercial industries is the long curing cycle and slow production. Comprehensively addresses the scientific and technological development of rapid cured epoxy composites Covers, in detail, the chemistry, processing, structure and performance of rapid cured epoxy composites Provides detailed comparisons of how/why rapid cure composites are different to conventional composites Discusses the challenges of the existing technology and future trends

Advanced Packaging

Author :
Publisher :
ISBN 13 :
Total Pages : 48 pages
Book Rating : 4./5 ( download)

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Book Synopsis Advanced Packaging by :

Download or read book Advanced Packaging written by and published by . This book was released on 2007-05 with total page 48 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.