A Study On The Reliability Of Flip Chip Solder Joints

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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

Author : John H. Lau
Publisher : McGraw-Hill Professional Publishing
ISBN 13 :
Total Pages : 440 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies by : John H. Lau

Download or read book Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies written by John H. Lau and published by McGraw-Hill Professional Publishing. This book was released on 1997 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt: The explosive growth of high-density packaging has created a tremendous impact on the electronic assembly and manufacturing industry. Ball grid array (BGA), chip-scale package (CSP), and solder-bumped flip chip technologies are taking the lead in this advanced manufacturing process. Many major equipment makers and leading electronic companies are now gearing up for these emerging and advanced packaging technologies. For these technologies, solder is the electrical and mechanical "glue," and thus solder joint reliability is one of the most critical issues in the development of these technologies. This book is a one-stop guide to the state of the art of solder joint reliability problem-solving methods, or choose a creative, high-performance, robust, and cost-effective design and high-yield manufacturing process for their interconnect systems will be able to do so with this unique sourcebook. It meets the reference needs of design, material, process, equipment, manufacturing, quality control, product assurance, reliability, component, packaging, vendor, marketing, and system engineers, and technical managers working in electronic packaging and interconnection. This book is structured to provide readers with the necessary know-how for practical, on-the-job problem-solving guidance. The book covers the solder joint reliability of BGA, CSP, flip chip, and FPT assemblies completely, proceeding from the theoretical basics to applications. Specific areas covered include: Definition of reliability, life distribution, failure rate, mean time to failure, etc.; Some well-known life distributions; Accelerated testing; Parameter estimation of life distributions; Acceleration factors for solders;Solder mechanics: plasticity, creep, and constitutive equations; Design, material, and manufacturing processes of BGA, CSP, flip chip, and FTP; Failure analysis and root cause of failure for BGA, CSP, flip chip, and FPT solder joints; Design for reliability of BGA, CSP, flip chip and FPT solder joints; Solder joint reliability of CBGA, PBGA, DBGA, and TBGA assemblies under thermal fatigue, mechanical bending and twisting, and shock and vibration conditions; solder joint reliability of flip chip (e.g., high-temperature and eutectic solder bumped flip chips on ceramic and PCB) assemblies under thermal fatigue, mechanical pulling, shearing, bending and twisting, and shock and vibration conditions; Solder joint reliability of CSP (e.g., LG Semicon's, Mitsubishi's, Motorola's, Tessera's, NEC's, nitto Denko's and Toshiba's) assemblies under thermal fatigue and mechanical bending conditions; Solder joint reliability of PQFP and TSOP assemblies under thermal fatigue, mechanical bending and twisting, and vibration conditions.

Solder Joint Technology

Author : King-Ning Tu
Publisher : Springer Science & Business Media
ISBN 13 : 0387388923
Total Pages : 376 pages
Book Rating : 4.3/5 (873 download)

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Book Synopsis Solder Joint Technology by : King-Ning Tu

Download or read book Solder Joint Technology written by King-Ning Tu and published by Springer Science & Business Media. This book was released on 2007-07-27 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: The European Union’s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.

Solder Joint Reliability Assessment

Author : Mohd N. Tamin
Publisher : Springer Science & Business
ISBN 13 : 3319000926
Total Pages : 179 pages
Book Rating : 4.3/5 (19 download)

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Book Synopsis Solder Joint Reliability Assessment by : Mohd N. Tamin

Download or read book Solder Joint Reliability Assessment written by Mohd N. Tamin and published by Springer Science & Business. This book was released on 2014-04-26 with total page 179 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface and bulk solder joint failure, respectively. Applications of the deliberated methodology to selected problems in assessing reliability of solder joints are demonstrated. These industry-defined research-based problems include solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, JEDEC board-level drop test and mechanisms of solder joint fatigue. Emphasis is placed on accurate quantitative assessment of solder joint reliability through basic understanding of the mechanics of materials as interpreted from results of FE simulations. The FE simulation methodology is readily applicable to numerous other problems in mechanics of materials and structures.

Solder Joint Reliability

Author : John H. Lau
Publisher : Springer Science & Business Media
ISBN 13 : 1461539102
Total Pages : 649 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Solder Joint Reliability by : John H. Lau

Download or read book Solder Joint Reliability written by John H. Lau and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 649 pages. Available in PDF, EPUB and Kindle. Book excerpt: Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.

Materials for Advanced Packaging

Author : Daniel Lu
Publisher : Springer
ISBN 13 : 3319450980
Total Pages : 974 pages
Book Rating : 4.3/5 (194 download)

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Book Synopsis Materials for Advanced Packaging by : Daniel Lu

Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Introduction to Microsystem Packaging Technology

Author : Yufeng Jin
Publisher : CRC Press
ISBN 13 : 1351832972
Total Pages : 233 pages
Book Rating : 4.3/5 (518 download)

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Book Synopsis Introduction to Microsystem Packaging Technology by : Yufeng Jin

Download or read book Introduction to Microsystem Packaging Technology written by Yufeng Jin and published by CRC Press. This book was released on 2017-12-19 with total page 233 pages. Available in PDF, EPUB and Kindle. Book excerpt: The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.

Assembly and Reliability of Lead-Free Solder Joints

Author : John H. Lau
Publisher : Springer Nature
ISBN 13 : 9811539200
Total Pages : 545 pages
Book Rating : 4.8/5 (115 download)

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Book Synopsis Assembly and Reliability of Lead-Free Solder Joints by : John H. Lau

Download or read book Assembly and Reliability of Lead-Free Solder Joints written by John H. Lau and published by Springer Nature. This book was released on 2020-05-29 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.

Harsh Environment Electronics

Author : Ahmed Sharif
Publisher : John Wiley & Sons
ISBN 13 : 3527344195
Total Pages : 398 pages
Book Rating : 4.5/5 (273 download)

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Book Synopsis Harsh Environment Electronics by : Ahmed Sharif

Download or read book Harsh Environment Electronics written by Ahmed Sharif and published by John Wiley & Sons. This book was released on 2019-08-05 with total page 398 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.

Flip Chip Technologies

Author : John H. Lau
Publisher : McGraw-Hill Professional Publishing
ISBN 13 :
Total Pages : 600 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Flip Chip Technologies by : John H. Lau

Download or read book Flip Chip Technologies written by John H. Lau and published by McGraw-Hill Professional Publishing. This book was released on 1996 with total page 600 pages. Available in PDF, EPUB and Kindle. Book excerpt: A guide to flip chip technologies, for professionals in flip chip and MCM research and development, and for engineers and technical managers choosing design and manufacturing processes for electronic packaging and interconnect systems. Discusses economic, design, material, quality, and reliability issues of flip chip technologies, and details aspects of classical solder-bumped flip chip interconnect technologies; the next generations of flip chip technologies; and known-good-die testing for multiple module applications. Annotation copyright by Book News, Inc., Portland, OR

Advanced Flip Chip Packaging

Author : Ho-Ming Tong
Publisher : Springer Science & Business Media
ISBN 13 : 1441957685
Total Pages : 562 pages
Book Rating : 4.4/5 (419 download)

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Book Synopsis Advanced Flip Chip Packaging by : Ho-Ming Tong

Download or read book Advanced Flip Chip Packaging written by Ho-Ming Tong and published by Springer Science & Business Media. This book was released on 2013-03-20 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

Lead-Free Solder Interconnect Reliability

Author : Dongkai Shangguan
Publisher : ASM International
ISBN 13 : 161503093X
Total Pages : 292 pages
Book Rating : 4.6/5 (15 download)

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Book Synopsis Lead-Free Solder Interconnect Reliability by : Dongkai Shangguan

Download or read book Lead-Free Solder Interconnect Reliability written by Dongkai Shangguan and published by ASM International. This book was released on 2005 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Electronic Thin-Film Reliability

Author : King-Ning Tu
Publisher : Cambridge University Press
ISBN 13 : 1139492705
Total Pages : 413 pages
Book Rating : 4.1/5 (394 download)

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Book Synopsis Electronic Thin-Film Reliability by : King-Ning Tu

Download or read book Electronic Thin-Film Reliability written by King-Ning Tu and published by Cambridge University Press. This book was released on 2010-11-25 with total page 413 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners.

Design and Reliability of Solders and Solder Interconnections

Author : Rao K. Mahidhara
Publisher : Minerals, Metals, & Materials Society
ISBN 13 :
Total Pages : 468 pages
Book Rating : 4.X/5 (4 download)

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Book Synopsis Design and Reliability of Solders and Solder Interconnections by : Rao K. Mahidhara

Download or read book Design and Reliability of Solders and Solder Interconnections written by Rao K. Mahidhara and published by Minerals, Metals, & Materials Society. This book was released on 1997 with total page 468 pages. Available in PDF, EPUB and Kindle. Book excerpt: The reliability of solders and solder joints is an important factor in the durability and design of electronic packages. This volume addresses issues of reliability such as microstructural stability in service, creep, fatigue, creep/fatigue interactions, and thermomechanical fatigue of bulk solders and solder joints.

Lead-free Soldering Process Development and Reliability

Author : Jasbir Bath
Publisher : John Wiley & Sons
ISBN 13 : 1119482046
Total Pages : 515 pages
Book Rating : 4.1/5 (194 download)

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Book Synopsis Lead-free Soldering Process Development and Reliability by : Jasbir Bath

Download or read book Lead-free Soldering Process Development and Reliability written by Jasbir Bath and published by John Wiley & Sons. This book was released on 2020-06-12 with total page 515 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.

Lead-Free Electronic Solders

Author : KV Subramanian
Publisher : Springer Science & Business Media
ISBN 13 : 0387484337
Total Pages : 370 pages
Book Rating : 4.3/5 (874 download)

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Book Synopsis Lead-Free Electronic Solders by : KV Subramanian

Download or read book Lead-Free Electronic Solders written by KV Subramanian and published by Springer Science & Business Media. This book was released on 2007-06-28 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt: Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.

Area Array Interconnection Handbook

Author : Karl J. Puttlitz
Publisher : Springer Science & Business Media
ISBN 13 : 1461513898
Total Pages : 1250 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Area Array Interconnection Handbook by : Karl J. Puttlitz

Download or read book Area Array Interconnection Handbook written by Karl J. Puttlitz and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 1250 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.

MEMS and Nanotechnology, Volume 5

Author : Barton C. Prorok
Publisher : Springer
ISBN 13 : 3319224581
Total Pages : 113 pages
Book Rating : 4.3/5 (192 download)

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Book Synopsis MEMS and Nanotechnology, Volume 5 by : Barton C. Prorok

Download or read book MEMS and Nanotechnology, Volume 5 written by Barton C. Prorok and published by Springer. This book was released on 2015-10-30 with total page 113 pages. Available in PDF, EPUB and Kindle. Book excerpt: The 16thInternational Symposium on MEMS and Nanotechnology, Volume 5 of the Proceedings of the 2015SEM Annual Conference& Exposition on Experimental and Applied Mechanics, the fifth volume of nine from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including: Microscale and Microstructural Effects on Mechanical Behavior Dynamic Micro/Nanomechanics In-situ Techniques Mechanics of Graphene Indentation and Small Scale Testing MEMS