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5th Electronics Packaging Technology Conference
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Book Synopsis Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) by : Thiam Beng Lim
Download or read book Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) written by Thiam Beng Lim and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2000 with total page 492 pages. Available in PDF, EPUB and Kindle. Book excerpt: Topics covered by this title include: packaging materials; packaging trends; thermal design and modelling; solder joint metallurgy; process and reliability modelling; thermal characterization; materials characterization techniques; and assembly/manufacturing technologies.
Book Synopsis Proceedings of the Technical Conference by :
Download or read book Proceedings of the Technical Conference written by and published by . This book was released on 1985 with total page 656 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis 5th Electronics Packaging Technology Conference by : Mahadevan K. Iyer
Download or read book 5th Electronics Packaging Technology Conference written by Mahadevan K. Iyer and published by IEEE Computer Society Press. This book was released on 2003 with total page 854 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Electronics Packaging Technology Conference by :
Download or read book Electronics Packaging Technology Conference written by and published by . This book was released on 2003 with total page 825 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003) by :
Download or read book Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003) written by and published by . This book was released on 2004 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) by :
Download or read book 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) written by and published by . This book was released on with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Icept2003 written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2003-10 with total page 517 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis 5th Annual International Electronics Packaging Conference by :
Download or read book 5th Annual International Electronics Packaging Conference written by and published by . This book was released on 1985 with total page 627 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis ICEPT 2003 by : International Conference on Electronic Packaging Technology
Download or read book ICEPT 2003 written by International Conference on Electronic Packaging Technology and published by . This book was released on 2003 with total page 517 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings of 2nd Electronics Packaging Technology Conference by : Electronic Packaging Technology Conference (2nd : 1998 : Singapore)
Download or read book Proceedings of 2nd Electronics Packaging Technology Conference written by Electronic Packaging Technology Conference (2nd : 1998 : Singapore) and published by . This book was released on 1998 with total page 361 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC). by :
Download or read book 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC). written by and published by . This book was released on 2018 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) by : Electronics Packaging and Technology Conference
Download or read book 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) written by Electronics Packaging and Technology Conference and published by . This book was released on 2015 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Annotation Advanced Packaging, TSV Wafer Level Packaging, Interconnection Technologies, Emerging Technologies, Materials and Processes, Electrical Modeling and Simulations Mechanical Modeling and Simulations Thermal Characterization & Cooling Solutions, Quality & Reliability, Wafer Package Testing & Characterization.
Book Synopsis Microjoining and Nanojoining by : Y N Zhou
Download or read book Microjoining and Nanojoining written by Y N Zhou and published by Elsevier. This book was released on 2008-03-27 with total page 835 pages. Available in PDF, EPUB and Kindle. Book excerpt: Many important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufacturing many electronic, precision and medical products.Part one reviews the basics of microjoining, including solid-state bonding and fusion microwelding. Part two covers microjoining and nanojoining processes, such as bonding mechanisms and metallurgy, process development and optimization, thermal stresses and distortion, positioning and fixturing, sensing, and numerical modelling. Part three discusses microjoining of materials such as plastics, ceramics, metals and advanced materials such as shape memory alloys and nanomaterials. The book also discusses applications of microjoining such as joining superconductors, the manufacture of medical devices and the sealing of solid oxide fuel cells.This book provides a comprehensive overview of the fundamental aspects of microjoining processes and techniques. It is a valuable reference for production engineers, designers and researchers using or studying microjoining technologies in such industries as microelectronics and biomedical engineering. - Reviews the basics of nanojoining including solid-state bonding and fusion microwelding - Covers microjoining and nanojoining processes such as bonding mechanisms and metallurgy, sensing and numerical modelling - Examines applications of microjoining such as the manufacturing of medical devices, and the sealing of solid oxide fuel cells
Book Synopsis Electrically Conductive Adhesives by : Rajesh Gomatam
Download or read book Electrically Conductive Adhesives written by Rajesh Gomatam and published by BRILL. This book was released on 2008-12-23 with total page 434 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is based on two Special Issues of the Journal of Adhesion Science and Technology (JAST vol. 22, no. 8-9 and vol. 22, no. 14) dedicated to the logic of electrically conductive adhesives. The contains a total of 21 papers (reflecting overviews and original research).
Book Synopsis TSV 3D RF Integration by : Shenglin Ma
Download or read book TSV 3D RF Integration written by Shenglin Ma and published by Elsevier. This book was released on 2022-04-27 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt: TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology. - Provides a detailed demonstration of the design and process development of HR-Si (High-Resistivity Silicon) interposer technology - Presents a series of implementation case studies that detail modeling and simulation, integration, qualification and testing methods - Offers a systematic and comparative literature review of HR-Si interposer technology by topic - Offers solutions to problems with TSV (through silicon via) interposer technology, including high frequency loss and cooling problems - Gives a systematic and accessible accounting on this leading technology
Book Synopsis 2015 Ieee 17Th Electronics Packaging and Technology Conference (Eptc) by : IEEE Staff
Download or read book 2015 Ieee 17Th Electronics Packaging and Technology Conference (Eptc) written by IEEE Staff and published by . This book was released on 2015-12-02 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Packaging, TSV Wafer Level Packaging, Interconnection Technologies, Emerging Technologies, Materials and Processes, Electrical Modeling and Simulations Mechanical Modeling and Simulations Thermal Characterization & Cooling Solutions, Quality & Reliability, Wafer Package Testing & Characterization
Book Synopsis Integrated Interconnect Technologies for 3D Nanoelectronic Systems by : Muhannad S. Bakir
Download or read book Integrated Interconnect Technologies for 3D Nanoelectronic Systems written by Muhannad S. Bakir and published by Artech House. This book was released on 2008-11-30 with total page 551 pages. Available in PDF, EPUB and Kindle. Book excerpt: This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
