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3d Stacked Memory
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Download or read book 3D Stacked Memory written by and published by LexInnova Technologies, LLC. This book was released on 2015-04-01 with total page 24 pages. Available in PDF, EPUB and Kindle. Book excerpt: Our report on 3D stacked memory technology covers the Intellectual Property (Patent) landscape of this rapidly evolving technology and monitors its various sub-domains for licensing activity. We have analyzed the IP portfolios of SanDisk, Micron, Samsung, IBM and other major players to find the focus areas of their patenting efforts. Using our proprietary patent analytics tool, LexScore™, we identify the front runners in this technology domain with strong patent portfolio quality as well as a heavy patent filing activity. Using our proprietary Licensing Heat-map framework, we also predict licensing activity trend in various technology sub domains.
Book Synopsis High Performance Hybrid Memory Systems with 3D-stacked DRAM by : Evangelos Vasilakis
Download or read book High Performance Hybrid Memory Systems with 3D-stacked DRAM written by Evangelos Vasilakis and published by . This book was released on 2020 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis 3D Stacked Memories for Digital Signal Processors by :
Download or read book 3D Stacked Memories for Digital Signal Processors written by and published by . This book was released on 2013 with total page 97 pages. Available in PDF, EPUB and Kindle. Book excerpt: Recently, three-dimensional (3D) integration technology has enabled researchers to explore novel architectures. Due to the growing memory requirements of modern signal processing applications, it was thought that digital signal processors (DSPs) could benefit from 3D memory integration technology where high-density memories are placed below processing cores. Until recently, it was believed that this integration could lower memory latencies by 45% to 60%, which would improve performance. 3D memory integration technology also allowed a large increase in the main memory bus width by using small through silicon vias (TSVs) instead of off-chip metal wires. This increase in the bus width meant each main memory request could bring more data into the last-level on-chip memory and improve the performance of streaming applications whose memory access behavior exhibits a large amount of spatial locality. My dissertation provides a more accurate 3D main memory model that demonstrates that the latency reduction of going from conventional DDR2 DRAM to 3D memory technology is roughly 4% instead of the often quoted 45% to 60%. With this model, I re-evaluate the performance impact of 3D main memory on DSPs and find the benefits from the latency savings are small. I next analyze current 3D main memory with Wide I/O, which can lower main memory latencies by 15.9% and greatly increase the main memory bus width. I demonstrate that using 3D main memory with Wide I/O and increasing the main memory bus width from 64 bits to 4,096 bits can improve the average performance of signal processing applications by 9.7%, but also increases average energy consumption by 2.6%. For energy-constraint DSPs that are often found in mobile devices, this increase may be unacceptable. To mitigate this energy increase, I propose novel techniques to dynamically scale the main memory bus width of a DSP based on the program phases of an application. These bandwidth scaling algorithms increase the main memory bus width during memory intense phases to improve performance and lower the bus width during compute intensive phases to improve energy efficiency. These algorithms can improve average DSP performance by 6.6% while increasing average energy consumption by only 0.5%.
Book Synopsis Vertical 3D Memory Technologies by : Betty Prince
Download or read book Vertical 3D Memory Technologies written by Betty Prince and published by John Wiley & Sons. This book was released on 2014-08-13 with total page 466 pages. Available in PDF, EPUB and Kindle. Book excerpt: The large scale integration and planar scaling of individual system chips is reaching an expensive limit. If individual chips now, and later terrabyte memory blocks, memory macros, and processing cores, can be tightly linked in optimally designed and processed small footprint vertical stacks, then performance can be increased, power reduced and cost contained. This book reviews for the electronics industry engineer, professional and student the critical areas of development for 3D vertical memory chips including: gate-all-around and junction-less nanowire memories, stacked thin film and double gate memories, terrabit vertical channel and vertical gate stacked NAND flash, large scale stacking of Resistance RAM cross-point arrays, and 2.5D/3D stacking of memory and processor chips with through-silicon-via connections now and remote links later. Key features: Presents a review of the status and trends in 3-dimensional vertical memory chip technologies. Extensively reviews advanced vertical memory chip technology and development Explores technology process routes and 3D chip integration in a single reference
Book Synopsis 3D Stacked Chips by : Ibrahim (Abe) M. Elfadel
Download or read book 3D Stacked Chips written by Ibrahim (Abe) M. Elfadel and published by Springer. This book was released on 2016-05-11 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.
Book Synopsis Handbook of 3D Integration, Volume 4 by : Paul D. Franzon
Download or read book Handbook of 3D Integration, Volume 4 written by Paul D. Franzon and published by John Wiley & Sons. This book was released on 2019-01-25 with total page 582 pages. Available in PDF, EPUB and Kindle. Book excerpt: This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Book Synopsis Stacked-3D and Processing-in-memory Solutions for Data-intensive and Persistent Applications by : Akshay Krishna Ramanathan
Download or read book Stacked-3D and Processing-in-memory Solutions for Data-intensive and Persistent Applications written by Akshay Krishna Ramanathan and published by . This book was released on 2022 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the dominance of data-intensive workloads and applications, the current von-Neumann-based architectures suffer from memory bandwidth problems, popularly known as the "memory wall". In order to alleviate the problem of memory bandwidth, processing-in-memory (PiM) has gained a lot of attention in recent years. In the PiM architectures, the compute logics are moved closer to or within the memory where the data resides, enabling the PiM architectures to exploit the high internal bandwidth of the memories. This dissertation explores the opportunities provided by the recent advancements in-memory technologies to design highly efficient PiM architectures for mainly deep-learning, database, and persistence applications. The first work in this dissertation presents a novel 3D-SRAM circuit design using a Monolithic 3D Integration process (M3D) for realizing beyond-Boolean in-memory compare operation without any area overheads compared to the standard 6T-SRAM. We also showcase measurement results from the fabricated PiM macro with the same circuit design for performing massively parallel compare operation used in the database, machine learning, and scientific applications. The proposed PiM technique supports operations like data filtering, sorting, and index handling of sparse matrix-matrix multiplication (SpGEMM). The second work presents a Look-Up Table (LUT) based PiM technique for conventional SRAM memory technology (i.e., single layer) with the potential for running Neural Network inference tasks. We implement a bitline computing free technique to avoid frequent bitline accesses to the cache sub-arrays and thereby considerably reducing the memory access energy overhead. Our proposed LUT-based PiM methodology exploits substantial parallelism using look-up tables, which do not alter the memory structure/organization. This methodology showcases a PiM architecture for current memory technologies with minimal changes to the monolithic custom memory blocks. The third work deals with crash consistency for critical applications like financial trading, cyber threat analysis, IoT, etc. At present, non-volatile memory technologies promise the opportunity for maintaining persistent data in memory. However, providing crash consistency in such systems can be costly as any update to the persistent data has to reach the persistent hard drive in a specific order, imposing a high overhead. In this work, we propose an architecture design that employs a hybrid volatile, non-volatile memory cell employing M3D and Ferroelectric technology in the L1 data cache to guarantee crash consistency with almost no performance overhead. Memory technologies like high bandwidth memory (HBM), and solid-state drives (SSD) make use of parallel-3D integration process to stack memory layers in order to increase the density per mm2. The final work presents cost-effective potential N-layer logic designs realized by the same process. This work discusses the stricter rules and constraints enforced by the fabrication process when designing N-layer designs and then explores different adder designs.
Download or read book Monolithic 3D - In General written by and published by Iulia Tomut. This book was released on with total page 170 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis 3D Flash Memories by : Rino Micheloni
Download or read book 3D Flash Memories written by Rino Micheloni and published by Springer. This book was released on 2016-05-26 with total page 391 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book walks the reader through the next step in the evolution of NAND flash memory technology, namely the development of 3D flash memories, in which multiple layers of memory cells are grown within the same piece of silicon. It describes their working principles, device architectures, fabrication techniques and practical implementations, and highlights why 3D flash is a brand new technology. After reviewing market trends for both NAND and solid state drives (SSDs), the book digs into the details of the flash memory cell itself, covering both floating gate and emerging charge trap technologies. There is a plethora of different materials and vertical integration schemes out there. New memory cells, new materials, new architectures (3D Stacked, BiCS and P-BiCS, 3D FG, 3D VG, 3D advanced architectures); basically, each NAND manufacturer has its own solution. Chapter 3 to chapter 7 offer a broad overview of how 3D can materialize. The 3D wave is impacting emerging memories as well and chapter 8 covers 3D RRAM (resistive RAM) crosspoint arrays. Visualizing 3D structures can be a challenge for the human brain: this is way all these chapters contain a lot of bird’s-eye views and cross sections along the 3 axes. The second part of the book is devoted to other important aspects, such as advanced packaging technology (i.e. TSV in chapter 9) and error correction codes, which have been leveraged to improve flash reliability for decades. Chapter 10 describes the evolution from legacy BCH to the most recent LDPC codes, while chapter 11 deals with some of the most recent advancements in the ECC field. Last but not least, chapter 12 looks at 3D flash memories from a system perspective. Is 14nm the last step for planar cells? Can 100 layers be integrated within the same piece of silicon? Is 4 bit/cell possible with 3D? Will 3D be reliable enough for enterprise and datacenter applications? These are some of the questions that this book helps answering by providing insights into 3D flash memory design, process technology and applications.
Book Synopsis Modeling and Memory Management Unit of 3D-Stacked DRAM for 3D High Definition (HD) Video by :
Download or read book Modeling and Memory Management Unit of 3D-Stacked DRAM for 3D High Definition (HD) Video written by and published by . This book was released on 2013 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Die-stacking Architecture by : Yuan Xie
Download or read book Die-stacking Architecture written by Yuan Xie and published by Morgan & Claypool Publishers. This book was released on 2015-06-01 with total page 129 pages. Available in PDF, EPUB and Kindle. Book excerpt: The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.
Book Synopsis Innovations in the Memory System by : Rajeev Balasubramonian
Download or read book Innovations in the Memory System written by Rajeev Balasubramonian and published by Morgan & Claypool Publishers. This book was released on 2019-09-10 with total page 153 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is a tour through recent and prominent works regarding new DRAM chip designs and technologies, near data processing approaches, new memory channel architectures, techniques to tolerate the overheads of refresh and fault tolerance, security attacks and mitigations, and memory scheduling. The memory system will soon be a hub for future innovation. While conventional memory systems focused primarily on high density, other memory system metrics like energy, security, and reliability are grabbing modern research headlines. With processor performance stagnating, it is also time to consider new programming models that move some application computations into the memory system. This, in turn, will lead to feature-rich memory systems with new interfaces. The past decade has seen a number of memory system innovations that point to this future where the memory system will be much more than dense rows of unintelligent bits.
Book Synopsis Improving Performance of In-memory Key-value Stores Using a 3d-stacked Architecture by : Ivan Stalev
Download or read book Improving Performance of In-memory Key-value Stores Using a 3d-stacked Architecture written by Ivan Stalev and published by . This book was released on 2015 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Web services and cloud computing are rapidly growing as more users get online around the world and utilize the internet for a growing number of purposes. This puts more demand on in-memory key-value stores as web servers must handle a massive influx of user requests. Data centers will thus find it more challenging to meet their SLAs (Service Level Agreements), as the latency of the 90th percentile of requests may become quite unpredictable. To alleviate this growing concern, we utilize a stacked DRAM architecture as a LLC (last-level cache) that is modified to exploit some common power-law access patterns in user requests. More specifically, we observe that the majority of the memory traffic generated by a key-value store is due to requests for large values, even though large values account for a very small portion (typically around 5%) of overall requests. Thus, we choose to prioritize the cachelines that belong to large values in the stacked DRAM cache by allowing priority cachelines to only be evicted by other priority cachelines. Using this priority scheme, we are able to improve the 90th percentile request latency by as much as 42.4% over a standard stacked DRAM cache architecture.
Book Synopsis Static Random-access Memory Circuits with 3D Stacked Nanosheet Devices by : Anil Kumar Gundu
Download or read book Static Random-access Memory Circuits with 3D Stacked Nanosheet Devices written by Anil Kumar Gundu and published by . This book was released on 2022 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis 3D Integration of Resistive Switching Memory by : Qing Luo
Download or read book 3D Integration of Resistive Switching Memory written by Qing Luo and published by CRC Press. This book was released on 2023-04-13 with total page 107 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book offers a thorough exploration of the three-dimensional integration of resistive memory in all aspects, from the materials, devices, array-level issues, and integration structures to its applications. Resistive random-access memory (RRAM) is one of the most promising candidates for next-generation nonvolatile memory applications owing to its superior characteristics including simple structure, high switching speed, low power consumption, and compatibility with standard complementary metal oxide semiconductor (CMOS) process. To achieve large-scale, high-density integration of RRAM, the 3D cross array is undoubtedly the ideal choice. This book introduces the 3D integration technology of RRAM, and breaks it down into five parts: 1: Associative Problems in Crossbar array and 3D architectures; 2: Selector Devices and Self-Selective Cells; 3: Integration of 3D RRAM; 4: Reliability Issues in 3D RRAM; 5: Applications of 3D RRAM beyond Storage. The book aspires to provide a relevant reference for students, researchers, engineers, and professionals working with resistive random-access memory or those interested in 3D integration technology in general.
Book Synopsis Next Generation Compute-in-Memory Via Monolithically Integrated 3D-Stacked Complementary-FET with Conventional CMOS by :
Download or read book Next Generation Compute-in-Memory Via Monolithically Integrated 3D-Stacked Complementary-FET with Conventional CMOS written by and published by . This book was released on 2020 with total page 76 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis High-performance Memory Systems Using 3D IC Technology by : Aamir Zia
Download or read book High-performance Memory Systems Using 3D IC Technology written by Aamir Zia and published by . This book was released on 2009 with total page 258 pages. Available in PDF, EPUB and Kindle. Book excerpt:
