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Author :
Publisher :
ISBN 13 : 9781728168265
Total Pages : pages
Book Rating : 4.1/5 (682 download)
Download or read book 2020 21st International Conference on Electronic Packaging Technology (ICEPT). written by and published by . This book was released on 2020 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : IEEE Staff
Publisher :
ISBN 13 : 9781728168272
Total Pages : pages
Book Rating : 4.1/5 (682 download)
Download or read book 2020 21st International Conference on Electronic Packaging Technology (ICEPT) written by IEEE Staff and published by . This book was released on 2020-08-12 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: ICEPT 2020 is a four day event, featuring technical sessions, invited talks, professional development courses, exhibition, and social networking activities It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China
Author : Mohd Arif Anuar Mohd Salleh
Publisher : Springer Nature
ISBN 13 : 9811992673
Total Pages : 873 pages
Book Rating : 4.8/5 (119 download)
Download or read book Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium written by Mohd Arif Anuar Mohd Salleh and published by Springer Nature. This book was released on 2023-07-02 with total page 873 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.
Author : Sanjay Yadav
Publisher : Springer Nature
ISBN 13 : 9811901082
Total Pages : 574 pages
Book Rating : 4.8/5 (119 download)
Download or read book Proceedings of Second International Conference in Mechanical and Energy Technology written by Sanjay Yadav and published by Springer Nature. This book was released on 2022-06-26 with total page 574 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents selected peer-reviewed papers from the International Conference on Mechanical and Energy Technologies, which was held on October 28–29, 2021, at Galgotias College of Engineering and Technology, Greater Noida, India. The book reports on the latest developments in the field of mechanical and energy technology in contributions prepared by experts from academia and industry. The broad range of topics covered includes aerodynamics and fluid mechanics, artificial intelligence, nonmaterial and nonmanufacturing technologies, rapid manufacturing technologies and prototyping, remanufacturing, renewable energies technologies, metrology and computer-aided inspection, etc. Accordingly, the book offers a valuable resource for researchers in various fields, especially mechanical and industrial engineering, and energy technologies.
Author : Kaigui Xie
Publisher : Springer Nature
ISBN 13 : 9819904080
Total Pages : 1314 pages
Book Rating : 4.8/5 (199 download)
Download or read book The Proceedings of the 17th Annual Conference of China Electrotechnical Society written by Kaigui Xie and published by Springer Nature. This book was released on 2023-03-30 with total page 1314 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gathers outstanding papers presented at the 17th Annual Conference of China Electrotechnical Society, organized by China Electrotechnical Society (CES), held in Beijing, China, from September 17 to 18, 2022. It covers topics such as electrical technology, power systems, electromagnetic emission technology, and electrical equipment. It introduces the innovative solutions that combine ideas from multiple disciplines. The book is very much helpful and useful for the researchers, engineers, practitioners, research students, and interested readers.
Author : Baoyan Duan
Publisher : Springer Nature
ISBN 13 : 9811913099
Total Pages : 2195 pages
Book Rating : 4.8/5 (119 download)
Download or read book Proceedings of the Eighth Asia International Symposium on Mechatronics written by Baoyan Duan and published by Springer Nature. This book was released on 2022-07-12 with total page 2195 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book presents high-quality papers from the Eighth Asia International Symposium on Mechatronics (AISM 2021). It discusses the latest technological trends and advances in electromechanical coupling and environmental adaptability design of electronic equipment, sensing and measurement, mechatronics in manufacturing and automations, energy harvesting & storage, robotics, automation and control systems. It includes papers based on original theoretical, practical and experimental simulations, development, applications, measurements, and testing. The applications and solutions discussed in the book provide excellent reference material for future product development.
Author : Qingxin Yang
Publisher : Springer Nature
ISBN 13 : 9811915288
Total Pages : 1465 pages
Book Rating : 4.8/5 (119 download)
Download or read book The proceedings of the 16th Annual Conference of China Electrotechnical Society written by Qingxin Yang and published by Springer Nature. This book was released on 2022-04-17 with total page 1465 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gathers outstanding papers presented at the 16th Annual Conference of China Electrotechnical Society, organized by China Electrotechnical Society (CES), held in Beijing, China, from September 24 to 26, 2021. It covers topics such as electrical technology, power systems, electromagnetic emission technology, and electrical equipment. It introduces the innovative solutions that combine ideas from multiple disciplines. The book is very much helpful and useful for the researchers, engineers, practitioners, research students, and interested readers.
Author : Nagender Kumar Suryadevara
Publisher : Springer Nature
ISBN 13 : 3030988864
Total Pages : 452 pages
Book Rating : 4.0/5 (39 download)
Download or read book Sensing Technology written by Nagender Kumar Suryadevara and published by Springer Nature. This book was released on 2022-06-07 with total page 452 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gathers the latest advances, innovations, and applications in the field of sensing technology, as presented by international researchers and engineers at the 14th International Conference on Sensing Technology (ICST), held in Chennai, India on January 17-19, 2022. Contributions include a wide range of topics such as: vision sensing, sensor signal processing, sensors phenomena and modelling, sensor characterization, smart sensors and sensor fusion, electromagnetic, chemical and physical sensors, electronic nose technology, biosensors, nano sensors, wireless sensors and WSN, Internet of Things, optical sensors, sensor arrays, intelligent sensing, Internet-based and remote data acquisition. The contributions, which were selected by means of a rigorous international peer-review process, present a wealth of exciting ideas that will open novel research directions and foster multidisciplinary collaboration among different specialists.
Author : Shenglin Ma
Publisher : Elsevier
ISBN 13 : 0323996035
Total Pages : 294 pages
Book Rating : 4.3/5 (239 download)
Download or read book TSV 3D RF Integration written by Shenglin Ma and published by Elsevier. This book was released on 2022-04-27 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt: TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology. - Provides a detailed demonstration of the design and process development of HR-Si (High-Resistivity Silicon) interposer technology - Presents a series of implementation case studies that detail modeling and simulation, integration, qualification and testing methods - Offers a systematic and comparative literature review of HR-Si interposer technology by topic - Offers solutions to problems with TSV (through silicon via) interposer technology, including high frequency loss and cooling problems - Gives a systematic and accessible accounting on this leading technology
Author : V. Suma
Publisher : Springer Nature
ISBN 13 : 9811613958
Total Pages : 992 pages
Book Rating : 4.8/5 (116 download)
Download or read book Inventive Systems and Control written by V. Suma and published by Springer Nature. This book was released on 2021-06-07 with total page 992 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents selected papers from the 5th International Conference on Inventive Systems and Control (ICISC 2021), held on 7–8 January 2021 at JCT College of Engineering and Technology, Coimbatore, India. The book includes an analysis of the class of intelligent systems and control techniques that utilises various artificial intelligence technologies, where there are no mathematical models and systems available to make them remain controlled. Inspired by various existing intelligent techniques, the primary goal is to present the emerging innovative models to tackle the challenges faced by the existing computing and communication technologies. The proceedings of ICISC 2021 aim at presenting the state-of-the-art research developments, trends, and solutions for the challenges faced by the intelligent systems and control community with the real-world applications. The included research articles feature the novel and unpublished research works on intelligent system representation and control.
Author : Shanben Chen
Publisher : Springer Nature
ISBN 13 : 9819996295
Total Pages : 155 pages
Book Rating : 4.8/5 (199 download)
Download or read book Transactions on Intelligent Welding Manufacturing written by Shanben Chen and published by Springer Nature. This book was released on 2024-01-13 with total page 155 pages. Available in PDF, EPUB and Kindle. Book excerpt: The primary aim of this book is to provide researchers and engineers from both academic and industry with up-to-date coverage of new results in the field of robotic welding, intelligent systems and automation. The book is mainly based on papers selected from the 2022 International Conference on Robotic Welding, Intelligence and Automation (RWIA’2022) in Shanghai and Lanzhou, China. The articles show that the intelligentized welding manufacturing (IWM) is becoming an inevitable trend with the intelligentized robotic welding as the key technology. The volume is divided into four logical parts: Intelligent Techniques for Robotic Welding, Sensing of Arc Welding Processing, Modeling and Intelligent Control of Welding Processing, as well as Intelligent Control and its Applications in Engineering.
Author : Xingyi Huang
Publisher : John Wiley & Sons
ISBN 13 : 1119719607
Total Pages : 452 pages
Book Rating : 4.1/5 (197 download)
Download or read book Polymer Composites for Electrical Engineering written by Xingyi Huang and published by John Wiley & Sons. This book was released on 2021-11-01 with total page 452 pages. Available in PDF, EPUB and Kindle. Book excerpt: Explore the diverse electrical engineering application of polymer composite materials with this in-depth collection edited by leaders in the field Polymer Composites for Electrical Engineering delivers a comprehensive exploration of the fundamental principles, state-of-the-art research, and future challenges of polymer composites. Written from the perspective of electrical engineering applications, like electrical and thermal energy storage, high temperature applications, fire retardance, power cables, electric stress control, and others, the book covers all major application branches of these widely used materials. Rather than focus on polymer composite materials themselves, the distinguished editors have chosen to collect contributions from industry leaders in the area of real and practical electrical engineering applications of polymer composites. The books relevance will only increase as advanced polymer composites receive more attention and interest in the area of advanced electronic devices and electric power equipment. Unique amongst its peers, Polymer Composites for Electrical Engineering offers readers a collection of practical and insightful materials that will be of great interest to both academic and industrial audiences. Those resources include: A comprehensive discussion of glass fiber reinforced polymer composites for power equipment, including GIS, bushing, transformers, and more) Explorations of polymer composites for capacitors, outdoor insulation, electric stress control, power cable insulation, electrical and thermal energy storage, and high temperature applications A treatment of semi-conductive polymer composites for power cables In-depth analysis of fire-retardant polymer composites for electrical engineering An examination of polymer composite conductors Perfect for postgraduate students and researchers working in the fields of electrical, electronic, and polymer engineering, Polymer Composites for Electrical Engineering will also earn a place in the libraries of those working in the areas of composite materials, energy science and technology, and nanotechnology.
Author : C.-H. Chen
Publisher : IOS Press
ISBN 13 : 1643683535
Total Pages : 1170 pages
Book Rating : 4.6/5 (436 download)
Download or read book Applied Mathematics, Modeling and Computer Simulation written by C.-H. Chen and published by IOS Press. This book was released on 2022-12-20 with total page 1170 pages. Available in PDF, EPUB and Kindle. Book excerpt: Applied mathematics, together with modeling and computer simulation, is central to engineering and computer science and remains intrinsically important in all aspects of modern technology. This book presents the proceedings of AMMCS 2022, the 2nd International Conference on Applied Mathematics, Modeling and Computer Simulation, held in Wuhan, China, on 13 and 14 August 2022, with online presentations available for those not able to attend in person due to continuing pandemic restrictions. The conference served as an open forum for the sharing and spreading of the newest ideas and latest research findings among all those involved in any aspect of applied mathematics, modeling and computer simulation, and offered an ideal platform for bringing together researchers, practitioners, scholars, professors and engineers from all around the world to exchange the newest research results and stimulate scientific innovation. More than 150 participants were able to exchange knowledge and discuss the latest developments at the conference. The book contains 127 peer-reviewed papers, selected from more than 200 submissions and ranging from the theoretical and conceptual to the strongly pragmatic; all addressing industrial best practice. Topics covered included mathematical modeling and application, engineering applications and scientific computations, and simulation of intelligent systems. The book shares practical experiences and enlightening ideas and will be of interest to researchers and practitioners in applied mathematics, modeling and computer simulation everywhere.
Author : Akarsh Verma
Publisher : Elsevier
ISBN 13 : 0443190100
Total Pages : 557 pages
Book Rating : 4.4/5 (431 download)
Download or read book Dynamic Mechanical and Creep-Recovery Behavior of Polymer-Based Composites written by Akarsh Verma and published by Elsevier. This book was released on 2024-01-11 with total page 557 pages. Available in PDF, EPUB and Kindle. Book excerpt: Dynamic Mechanical and Creep-Recovery Behaviour of Polymer-Based Composites: Mechanical and Mathematical Modeling covers mathematical modelling, dynamic mechanical analysis, and the ways in which various factors impact the creep-recovery behaviour of polymer composites. The effects of polymer molecular weight, plasticizers, cross-linking agents, and chemical treatment of filler material are addressed and information on thermoplastic and thermosetting polymer-based composites is also covered, including their various applications and the advantages and disadvantages of their use in different settings. The final 2 chapters of the book cover mathematical modeling of creep-recovery behavior for polymer composites and software-based simulation of creep-recovery in polymer composites, respectively. Dynamic Mechanical and Creep-Recovery Behaviour of Polymer-Based Composites: Mechanical and Mathematical Modeling covers mathematical modelling, dynamic mechanical analysis, and the ways in which various factors impact the creep-recovery behaviour of polymer composites. The effects of polymer molecular weight, plasticizers, cross-linking agents, and chemical treatment of filler material are addressed and information on thermoplastic and thermosetting polymer-based composites is also covered, including their various applications and the advantages and disadvantages of their use in different settings. The final 2 chapters of the book cover mathematical modeling of creep-recovery behavior for polymer composites and software-based simulation of creep-recovery in polymer composites, respectively. - Analyzes the dynamic mechanical and creep-recovery behaviors of thermoplastic and thermosetting polymer composites in a variety of applications - Features diverse mechanical/mathematical models utilized to fit data collected from creep-recovery studies - Covers various factors that influence dynamic mechanical properties - Discusses the advantages and disadvantages of using these materials in different settings
Author : Celestine Iwendi
Publisher : Frontiers Media SA
ISBN 13 : 2832515754
Total Pages : 1365 pages
Book Rating : 4.8/5 (325 download)
Download or read book Big data analytics for smart healthcare applications written by Celestine Iwendi and published by Frontiers Media SA. This book was released on 2023-04-17 with total page 1365 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Willem Dirk van Driel
Publisher : Springer Nature
ISBN 13 : 3030815765
Total Pages : 552 pages
Book Rating : 4.0/5 (38 download)
Download or read book Reliability of Organic Compounds in Microelectronics and Optoelectronics written by Willem Dirk van Driel and published by Springer Nature. This book was released on 2022-01-31 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems.
Author : Chong Leong, Gan
Publisher : Springer Nature
ISBN 13 : 3031267087
Total Pages : 223 pages
Book Rating : 4.0/5 (312 download)
Download or read book Interconnect Reliability in Advanced Memory Device Packaging written by Chong Leong, Gan and published by Springer Nature. This book was released on 2023-05-30 with total page 223 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.
