2018 Ieee International Reliability Physics Symposium Irps

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ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis

Author : ASM International
Publisher : ASM International
ISBN 13 : 1627082735
Total Pages : 540 pages
Book Rating : 4.6/5 (27 download)

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Book Synopsis ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis by : ASM International

Download or read book ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis written by ASM International and published by ASM International. This book was released on 2019-12-01 with total page 540 pages. Available in PDF, EPUB and Kindle. Book excerpt: The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.

Wide Bandgap Semiconductors for Power Electronics

Author : Peter Wellmann
Publisher : John Wiley & Sons
ISBN 13 : 3527346716
Total Pages : 743 pages
Book Rating : 4.5/5 (273 download)

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Book Synopsis Wide Bandgap Semiconductors for Power Electronics by : Peter Wellmann

Download or read book Wide Bandgap Semiconductors for Power Electronics written by Peter Wellmann and published by John Wiley & Sons. This book was released on 2022-01-10 with total page 743 pages. Available in PDF, EPUB and Kindle. Book excerpt: Wide Bandgap Semiconductors for Power Electronic A guide to the field of wide bandgap semiconductor technology Wide Bandgap Semiconductors for Power Electronics is a comprehensive and authoritative guide to wide bandgap materials silicon carbide, gallium nitride, diamond and gallium(III) oxide. With contributions from an international panel of experts, the book offers detailed coverage of the growth of these materials, their characterization, and how they are used in a variety of power electronics devices such as transistors and diodes and in the areas of quantum information and hybrid electric vehicles. The book is filled with the most recent developments in the burgeoning field of wide bandgap semiconductor technology and includes information from cutting-edge semiconductor companies as well as material from leading universities and research institutions. By taking both scholarly and industrial perspectives, the book is designed to be a useful resource for scientists, academics, and corporate researchers and developers. This important book: Presents a review of wide bandgap materials and recent developments Links the high potential of wide bandgap semiconductors with the technological implementation capabilities Offers a unique combination of academic and industrial perspectives Meets the demand for a resource that addresses wide bandgap materials in a comprehensive manner Written for materials scientists, semiconductor physicists, electrical engineers, Wide Bandgap Semiconductors for Power Electronics provides a state of the art guide to the technology and application of SiC and related wide bandgap materials.

Direct Copper Interconnection for Advanced Semiconductor Technology

Author : Dongkai Shangguan
Publisher : CRC Press
ISBN 13 : 1040028640
Total Pages : 463 pages
Book Rating : 4.0/5 (4 download)

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Book Synopsis Direct Copper Interconnection for Advanced Semiconductor Technology by : Dongkai Shangguan

Download or read book Direct Copper Interconnection for Advanced Semiconductor Technology written by Dongkai Shangguan and published by CRC Press. This book was released on 2024-06-28 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.

Machine Vision and Augmented Intelligence—Theory and Applications

Author : Manish Kumar Bajpai
Publisher : Springer Nature
ISBN 13 : 9811650780
Total Pages : 681 pages
Book Rating : 4.8/5 (116 download)

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Book Synopsis Machine Vision and Augmented Intelligence—Theory and Applications by : Manish Kumar Bajpai

Download or read book Machine Vision and Augmented Intelligence—Theory and Applications written by Manish Kumar Bajpai and published by Springer Nature. This book was released on 2021-11-10 with total page 681 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book comprises the proceedings of the International Conference on Machine Vision and Augmented Intelligence (MAI 2021) held at IIIT, Jabalpur, in February 2021. The conference proceedings encapsulate the best deliberations held during the conference. The diversity of participants in the event from academia, industry, and research reflects in the articles appearing in the volume. The book theme encompasses all industrial and non-industrial applications in which a combination of hardware and software provides operational guidance to devices in the execution of their functions based on the capture and processing of images. This book covers a wide range of topics such as modeling of disease transformation, epidemic forecast, COVID-19, image processing and computer vision, augmented intelligence, soft computing, deep learning, image reconstruction, artificial intelligence in healthcare, brain-computer interface, cybersecurity, and social network analysis, natural language processing, etc.

Miniaturized Transistors

Author : Lado Filipovic
Publisher : MDPI
ISBN 13 : 3039210106
Total Pages : 202 pages
Book Rating : 4.0/5 (392 download)

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Book Synopsis Miniaturized Transistors by : Lado Filipovic

Download or read book Miniaturized Transistors written by Lado Filipovic and published by MDPI. This book was released on 2019-06-24 with total page 202 pages. Available in PDF, EPUB and Kindle. Book excerpt: What is the future of CMOS? Sustaining increased transistor densities along the path of Moore's Law has become increasingly challenging with limited power budgets, interconnect bandwidths, and fabrication capabilities. In the last decade alone, transistors have undergone significant design makeovers; from planar transistors of ten years ago, technological advancements have accelerated to today's FinFETs, which hardly resemble their bulky ancestors. FinFETs could potentially take us to the 5-nm node, but what comes after it? From gate-all-around devices to single electron transistors and two-dimensional semiconductors, a torrent of research is being carried out in order to design the next transistor generation, engineer the optimal materials, improve the fabrication technology, and properly model future devices. We invite insight from investigators and scientists in the field to showcase their work in this Special Issue with research papers, short communications, and review articles that focus on trends in micro- and nanotechnology from fundamental research to applications.

Reliability and Physics-of-Healthy in Mechatronics

Author : Abdelkhalak El Hami
Publisher : John Wiley & Sons
ISBN 13 : 1786308819
Total Pages : 324 pages
Book Rating : 4.7/5 (863 download)

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Book Synopsis Reliability and Physics-of-Healthy in Mechatronics by : Abdelkhalak El Hami

Download or read book Reliability and Physics-of-Healthy in Mechatronics written by Abdelkhalak El Hami and published by John Wiley & Sons. This book was released on 2023-01-12 with total page 324 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book illustrates simply, but with many details, the state of the art of reliability science, exploring clear reliability disciplines and applications through concrete examples from their industries and from real life, based on industrial experiences. Many experts believe that reliability is not only a matter of statistics but is a multidisciplinary scientific topic, involving materials, tests, simulations, quality tools, manufacturing, electronics, mechatronics, environmental engineering and Big Data, among others. For a complex mechatronic system, failure risks have to be identified at an early stage of the design. In the automotive and aeronautic industries, fatigue simulation is used both widely and efficiently. Problems arise from the variability of inputs such as fatigue parameters and life curves. This book aims to discuss probabilistic fatigue and reliability simulation. To do this, Reliability and Physics-of-Healthy in Mechatronics provides a study on some concepts of a predictive reliability model of microelectronics, with examples from the automotive, aeronautic and space industries, based on entropy and Physics-of-Healthy

Nitride Semiconductor Technology

Author : Fabrizio Roccaforte
Publisher : John Wiley & Sons
ISBN 13 : 3527825274
Total Pages : 464 pages
Book Rating : 4.5/5 (278 download)

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Book Synopsis Nitride Semiconductor Technology by : Fabrizio Roccaforte

Download or read book Nitride Semiconductor Technology written by Fabrizio Roccaforte and published by John Wiley & Sons. This book was released on 2020-07-30 with total page 464 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book "Nitride Semiconductor Technology" provides an overview of nitride semiconductors and their uses in optoelectronics and power electronics devices. It explains the physical properties of those materials as well as their growth methods. Their applications in high electron mobility transistors, vertical power devices, LEDs, laser diodes, and vertical-cavity surface-emitting lasers are discussed in detail. The book further examines reliability issues in these materials and puts forward perspectives of integrating them with 2D materials for novel high-frequency and high-power devices. In summary, it covers nitride semiconductor technology from materials to devices and provides the basis for further research.

Processing-in-Memory for AI

Author : Joo-Young Kim
Publisher : Springer Nature
ISBN 13 : 3030987817
Total Pages : 168 pages
Book Rating : 4.0/5 (39 download)

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Book Synopsis Processing-in-Memory for AI by : Joo-Young Kim

Download or read book Processing-in-Memory for AI written by Joo-Young Kim and published by Springer Nature. This book was released on 2022-07-09 with total page 168 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive introduction to processing-in-memory (PIM) technology, from its architectures to circuits implementations on multiple memory types and describes how it can be a viable computer architecture in the era of AI and big data. The authors summarize the challenges of AI hardware systems, processing-in-memory (PIM) constraints and approaches to derive system-level requirements for a practical and feasible PIM solution. The presentation focuses on feasible PIM solutions that can be implemented and used in real systems, including architectures, circuits, and implementation cases for each major memory type (SRAM, DRAM, and ReRAM).

2018 IEEE International Reliability Physics Symposium (IRPS)

Author : IEEE Staff
Publisher :
ISBN 13 : 9781538654804
Total Pages : pages
Book Rating : 4.6/5 (548 download)

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Book Synopsis 2018 IEEE International Reliability Physics Symposium (IRPS) by : IEEE Staff

Download or read book 2018 IEEE International Reliability Physics Symposium (IRPS) written by IEEE Staff and published by . This book was released on 2018-03-11 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability issues associated with semiconductors, foundries, IoT and other areas

Reliability of Organic Compounds in Microelectronics and Optoelectronics

Author : Willem Dirk van Driel
Publisher : Springer Nature
ISBN 13 : 3030815765
Total Pages : 552 pages
Book Rating : 4.0/5 (38 download)

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Book Synopsis Reliability of Organic Compounds in Microelectronics and Optoelectronics by : Willem Dirk van Driel

Download or read book Reliability of Organic Compounds in Microelectronics and Optoelectronics written by Willem Dirk van Driel and published by Springer Nature. This book was released on 2022-01-31 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems.

Electromigration in Metals

Author : Paul S. Ho
Publisher : Cambridge University Press
ISBN 13 : 1009287796
Total Pages : pages
Book Rating : 4.0/5 (92 download)

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Book Synopsis Electromigration in Metals by : Paul S. Ho

Download or read book Electromigration in Metals written by Paul S. Ho and published by Cambridge University Press. This book was released on 2022-05-12 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers.

Emerging Materials

Author : Laxman Raju Thoutam
Publisher : Springer Nature
ISBN 13 : 9811913129
Total Pages : 472 pages
Book Rating : 4.8/5 (119 download)

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Book Synopsis Emerging Materials by : Laxman Raju Thoutam

Download or read book Emerging Materials written by Laxman Raju Thoutam and published by Springer Nature. This book was released on 2022-05-13 with total page 472 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book serves as a quick guide on the latest material systems including their synthesis, fabrication and characterization techniques. It discusses recent developments in different material systems and discusses their novel applications in various branches of science and engineering. The book briefs latest computational tools and techniques that are used to discover new material systems. The book also briefs applications of new emerging materials in various fields including, healthcare, sensors, opto-electronics, high power devices and nano-electronics. This book helps to create a synergy between computational and experimental research methods to better understand a particular material system.

Interconnect Reliability in Advanced Memory Device Packaging

Author : Chong Leong, Gan
Publisher : Springer Nature
ISBN 13 : 3031267087
Total Pages : 223 pages
Book Rating : 4.0/5 (312 download)

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Book Synopsis Interconnect Reliability in Advanced Memory Device Packaging by : Chong Leong, Gan

Download or read book Interconnect Reliability in Advanced Memory Device Packaging written by Chong Leong, Gan and published by Springer Nature. This book was released on 2023-05-30 with total page 223 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.

Harnessing the Internet of Everything (IoE) for Accelerated Innovation Opportunities

Author : Cardoso, Pedro J.S.
Publisher : IGI Global
ISBN 13 : 152257333X
Total Pages : 405 pages
Book Rating : 4.5/5 (225 download)

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Book Synopsis Harnessing the Internet of Everything (IoE) for Accelerated Innovation Opportunities by : Cardoso, Pedro J.S.

Download or read book Harnessing the Internet of Everything (IoE) for Accelerated Innovation Opportunities written by Cardoso, Pedro J.S. and published by IGI Global. This book was released on 2019-02-15 with total page 405 pages. Available in PDF, EPUB and Kindle. Book excerpt: As innovators continue to explore and create new developments within the fields of artificial intelligence and computer science, subfields such as machine learning and the internet of things (IoT) have emerged. Now, the internet of everything (IoE), foreseen as a cohesive and intelligent connection of people, processes, data, and things, is theorized to make internet connections more valuable by converting information into wise actions that create unprecedented capabilities, richer experiences, and economic opportunities to all players in the market. Harnessing the Internet of Everything (IoE) for Accelerated Innovation Opportunities discusses the theoretical, design, evaluation, implementation, and use of innovative technologies within the fields of IoE, machine learning, and IoT. Featuring research on topics such as low-power electronics, mobile technology, and artificial intelligence, this book is ideally designed for computer engineers, software developers, investigators, advanced-level students, professors, and professionals seeking coverage on the various contemporary theories, technologies, and tools in IoE engineering.

Bio-Inspired Information Pathways

Author : Martin Ziegler
Publisher : Springer Nature
ISBN 13 : 3031367057
Total Pages : 439 pages
Book Rating : 4.0/5 (313 download)

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Book Synopsis Bio-Inspired Information Pathways by : Martin Ziegler

Download or read book Bio-Inspired Information Pathways written by Martin Ziegler and published by Springer Nature. This book was released on with total page 439 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Technologies and Application of Engineering Materials

Author : Juraj Marek
Publisher : Trans Tech Publications Ltd
ISBN 13 : 3036413227
Total Pages : 164 pages
Book Rating : 4.0/5 (364 download)

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Book Synopsis Technologies and Application of Engineering Materials by : Juraj Marek

Download or read book Technologies and Application of Engineering Materials written by Juraj Marek and published by Trans Tech Publications Ltd. This book was released on 2023-06-05 with total page 164 pages. Available in PDF, EPUB and Kindle. Book excerpt: Special topic volume with invited peer-reviewed papers only

Design Rules in a Semiconductor Foundry

Author : Eitan N. Shauly
Publisher : CRC Press
ISBN 13 : 1000631354
Total Pages : 831 pages
Book Rating : 4.0/5 (6 download)

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Book Synopsis Design Rules in a Semiconductor Foundry by : Eitan N. Shauly

Download or read book Design Rules in a Semiconductor Foundry written by Eitan N. Shauly and published by CRC Press. This book was released on 2022-11-30 with total page 831 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nowadays over 50% of integrated circuits are fabricated at wafer foundries. This book presents a foundry-integrated perspective of the field and is a comprehensive and up-to-date manual designed to serve process, device, layout, and design engineers. It comprises chapters carefully selected to cover topics relevant for them to deal with their work. The book provides an insight into the different types of design rules (DRs) and considerations for setting new DRs. It discusses isolation, gate patterning, S/D contacts, metal lines, MOL, air gaps, and so on. It explains in detail the layout rules needed to support advanced planarization processes, different types of dummies, and related utilities as well as presents a large set of guidelines and layout-aware modeling for RF CMOS and analog modules. It also discusses the layout DRs for different mobility enhancement techniques and their related modeling, listing many of the dedicated rules for static random-access memory (SRAM), embedded polyfuse (ePF), and LogicNVM. The book also provides the setting and calibration of the process parameters set and describes the 28~20 nm planar MOSFET process flow for low-power and high-performance mobile applications in a step-by-step manner. It includes FEOL and BEOL physical and environmental tests for qualifications together with automotive qualification and design for automotive (DfA). Written for the professionals, the book belongs to the bookshelf of microelectronic discipline experts.