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Author :
Publisher :
ISBN 13 : 9781467360913
Total Pages : 300 pages
Book Rating : 4.3/5 (69 download)
Download or read book 2013 IEEE International Symposium on Advanced Packaging Materials (APM 2013) written by and published by . This book was released on 2013 with total page 300 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Kwang Y. Lee
Publisher : MDPI
ISBN 13 : 3039433601
Total Pages : 228 pages
Book Rating : 4.0/5 (394 download)
Download or read book Modelling, Simulation and Control of Thermal Energy Systems written by Kwang Y. Lee and published by MDPI. This book was released on 2020-11-03 with total page 228 pages. Available in PDF, EPUB and Kindle. Book excerpt: Faced with an ever-growing resource scarcity and environmental regulations, the last 30 years have witnessed the rapid development of various renewable power sources, such as wind, tidal, and solar power generation. The variable and uncertain nature of these resources is well-known, while the utilization of power electronic converters presents new challenges for the stability of the power grid. Consequently, various control and operational strategies have been proposed and implemented by the industry and research community, with a growing requirement for flexibility and load regulation placed on conventional thermal power generation. Against this background, the modelling and control of conventional thermal engines, such as those based on diesel and gasoline, are experiencing serious obstacles when facing increasing environmental concerns. Efficient control that can fulfill the requirements of high efficiency, low pollution, and long durability is an emerging requirement. The modelling, simulation, and control of thermal energy systems are key to providing innovative and effective solutions. Through applying detailed dynamic modelling, a thorough understanding of the thermal conversion mechanism(s) can be achieved, based on which advanced control strategies can be designed to improve the performance of the thermal energy system, both in economic and environmental terms. Simulation studies and test beds are also of great significance for these research activities prior to proceeding to field tests. This Special Issue will contribute a practical and comprehensive forum for exchanging novel research ideas or empirical practices that bridge the modelling, simulation, and control of thermal energy systems. Papers that analyze particular aspects of thermal energy systems, involving, for example, conventional power plants, innovative thermal power generation, various thermal engines, thermal energy storage, and fundamental heat transfer management, on the basis of one or more of the following topics, are invited in this Special Issue: • Power plant modelling, simulation, and control; • Thermal engines; • Thermal energy control in building energy systems; • Combined heat and power (CHP) generation; • Thermal energy storage systems; • Improving thermal comfort technologies; • Optimization of complex thermal systems; • Modelling and control of thermal networks; • Thermal management of fuel cell systems; • Thermal control of solar utilization; • Heat pump control; • Heat exchanger control.
Author : James E. Morris
Publisher : Springer
ISBN 13 : 3319903624
Total Pages : 1007 pages
Book Rating : 4.3/5 (199 download)
Download or read book Nanopackaging written by James E. Morris and published by Springer. This book was released on 2018-09-22 with total page 1007 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Author : Tupei Chen
Publisher : CRC Press
ISBN 13 : 1315357003
Total Pages : 732 pages
Book Rating : 4.3/5 (153 download)
Download or read book Semiconductor Nanocrystals and Metal Nanoparticles written by Tupei Chen and published by CRC Press. This book was released on 2016-10-14 with total page 732 pages. Available in PDF, EPUB and Kindle. Book excerpt: Semiconductor nanocrystals and metal nanoparticles are the building blocks of the next generation of electronic, optoelectronic, and photonic devices. Covering this rapidly developing and interdisciplinary field, the book examines in detail the physical properties and device applications of semiconductor nanocrystals and metal nanoparticles. It begins with a review of the synthesis and characterization of various semiconductor nanocrystals and metal nanoparticles and goes on to discuss in detail their optical, light emission, and electrical properties. It then illustrates some exciting applications of nanoelectronic devices (memristors and single-electron devices) and optoelectronic devices (UV detectors, quantum dot lasers, and solar cells), as well as other applications (gas sensors and metallic nanopastes for power electronics packaging). Focuses on a new class of materials that exhibit fascinating physical properties and have many exciting device applications. Presents an overview of synthesis strategies and characterization techniques for various semiconductor nanocrystal and metal nanoparticles. Examines in detail the optical/optoelectronic properties, light emission properties, and electrical properties of semiconductor nanocrystals and metal nanoparticles. Reviews applications in nanoelectronic devices, optoelectronic devices, and photonic devices.
Author : IEEE Electrical Insulation Society Staff
Publisher :
ISBN 13 : 9781467360937
Total Pages : pages
Book Rating : 4.3/5 (69 download)
Download or read book 2013 IEEE 15th International Symposium and Exhibition on Advanced Packaging Materials (APM) written by IEEE Electrical Insulation Society Staff and published by . This book was released on 2013-02-27 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Cher Ming Tan
Publisher : Woodhead Publishing
ISBN 13 : 012822407X
Total Pages : 190 pages
Book Rating : 4.1/5 (282 download)
Download or read book Reliability and Failure Analysis of High-Power LED Packaging written by Cher Ming Tan and published by Woodhead Publishing. This book was released on 2022-09-24 with total page 190 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide insights for readers regarding the possible failure mechanisms in high-power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to harsher stress conditions for high-power LEDs. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs. - Introduces the failure mechanisms of high-power LEDs under varying environmental conditions and methods of how to test, simulate, and predict them - Describes the chemistry underlying the material degradation and its impact on LEDs - Discusses future directions of new packaging materials for improved performance and reliability of high-power LEDs
Author : Aida Todri-Sanial
Publisher : Springer
ISBN 13 : 3319297465
Total Pages : 340 pages
Book Rating : 4.3/5 (192 download)
Download or read book Carbon Nanotubes for Interconnects written by Aida Todri-Sanial and published by Springer. This book was released on 2016-07-09 with total page 340 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
Author : Mohd Arif Anuar Mohd Salleh
Publisher : Springer Nature
ISBN 13 : 3030934411
Total Pages : 332 pages
Book Rating : 4.0/5 (39 download)
Download or read book Recent Progress in Lead-Free Solder Technology written by Mohd Arif Anuar Mohd Salleh and published by Springer Nature. This book was released on 2022-03-01 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.
Author : Turan Paksoy
Publisher : CRC Press
ISBN 13 : 1000245101
Total Pages : 369 pages
Book Rating : 4.0/5 (2 download)
Download or read book Logistics 4.0 written by Turan Paksoy and published by CRC Press. This book was released on 2020-12-17 with total page 369 pages. Available in PDF, EPUB and Kindle. Book excerpt: Industrial revolutions have impacted both, manufacturing and service. From the steam engine to digital automated production, the industrial revolutions have conduced significant changes in operations and supply chain management (SCM) processes. Swift changes in manufacturing and service systems have led to phenomenal improvements in productivity. The fast-paced environment brings new challenges and opportunities for the companies that are associated with the adaptation to the new concepts such as Internet of Things (IoT) and Cyber Physical Systems, artificial intelligence (AI), robotics, cyber security, data analytics, block chain and cloud technology. These emerging technologies facilitated and expedited the birth of Logistics 4.0. Industrial Revolution 4.0 initiatives in SCM has attracted stakeholders’ attentions due to it is ability to empower using a set of technologies together that helps to execute more efficient production and distribution systems. This initiative has been called Logistics 4.0 of the fourth Industrial Revolution in SCM due to its high potential. Connecting entities, machines, physical items and enterprise resources to each other by using sensors, devices and the internet along the supply chains are the main attributes of Logistics 4.0. IoT enables customers to make more suitable and valuable decisions due to the data-driven structure of the Industry 4.0 paradigm. Besides that, the system’s ability of gathering and analyzing information about the environment at any given time and adapting itself to the rapid changes add significant value to the SCM processes. In this peer-reviewed book, experts from all over the world, in the field present a conceptual framework for Logistics 4.0 and provide examples for usage of Industry 4.0 tools in SCM. This book is a work that will be beneficial for both practitioners and students and academicians, as it covers the theoretical framework, on the one hand, and includes examples of practice and real world.
Author : Daniel Lu
Publisher : Springer
ISBN 13 : 3319450980
Total Pages : 974 pages
Book Rating : 4.3/5 (194 download)
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Author : Yong Liu
Publisher : Springer Science & Business Media
ISBN 13 : 1461410533
Total Pages : 606 pages
Book Rating : 4.4/5 (614 download)
Download or read book Power Electronic Packaging written by Yong Liu and published by Springer Science & Business Media. This book was released on 2012-02-15 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Author : Bekkay Hajji
Publisher : Springer Nature
ISBN 13 : 9811562598
Total Pages : 858 pages
Book Rating : 4.8/5 (115 download)
Download or read book Proceedings of the 2nd International Conference on Electronic Engineering and Renewable Energy Systems written by Bekkay Hajji and published by Springer Nature. This book was released on 2020-08-14 with total page 858 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book includes papers presented at the Second International Conference on Electronic Engineering and Renewable Energy (ICEERE 2020), which focus on the application of artificial intelligence techniques, emerging technology and the Internet of things in electrical and renewable energy systems, including hybrid systems, micro-grids, networking, smart health applications, smart grid, mechatronics and electric vehicles. It particularly focuses on new renewable energy technologies for agricultural and rural areas to promote the development of the Euro-Mediterranean region. Given its scope, the book is of interest to graduate students, researchers and practicing engineers working in the fields of electronic engineering and renewable energy.
Author : Committee on 21st Century Manufacturing: The Role of the Manufacturing Extension Partnership Program of the National Institute of Standards and Technology
Publisher : National Academies Press
ISBN 13 : 9780309291170
Total Pages : 0 pages
Book Rating : 4.2/5 (911 download)
Download or read book 21st Century Manufacturing written by Committee on 21st Century Manufacturing: The Role of the Manufacturing Extension Partnership Program of the National Institute of Standards and Technology and published by National Academies Press. This book was released on 2013-10-11 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Manufacturing Extension Partnership (MEP) - a program of the U.S. Department of Commerce's National Institute of Standards and Technology - has sought for more than two decades to strengthen American manufacturing. It is a national network of affiliated manufacturing extension centers and field offices located throughout all fifty states and Puerto Rico. Funding for MEP Centers comes from a combination of federal, state, local and private resources. Centers work directly with manufacturing firms in their state or sub-state region. MEP Centers provide expertise, services and assistance directed toward improving growth, supply chain positioning, leveraging emerging technologies, improving manufacturing processes, work force training, and the application and implementation of information in client companies through direct assistance provided by Center staff and from partner organizations and third party consultants. 21st Century Manufacturing seeks to generate a better understanding of the operation, achievements, and challenges of the MEP program in its mission to support, strengthen, and grow U.S. manufacturing. This report identifies and reviews similar national programs from abroad in order to draw on foreign practices, funding levels, and accomplishments as a point of reference and discusses current needs and initiatives in light of the global focus on advanced manufacturing,
Author : John W. Balde
Publisher : Springer Science & Business Media
ISBN 13 : 9780792376767
Total Pages : 382 pages
Book Rating : 4.3/5 (767 download)
Download or read book Foldable Flex and Thinned Silicon Multichip Packaging Technology written by John W. Balde and published by Springer Science & Business Media. This book was released on 2003-01-31 with total page 382 pages. Available in PDF, EPUB and Kindle. Book excerpt: Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means. Much of the work in this field has not been widely disseminated other than by papers presented at conferences and workshops. This book is organized to report on the developments in this technology, but with special additional material and emphasis. The intent is to do more than report on present state of the art. It is intended as an advocacy book, pointing out the reasons for 3-D assemblies, the reasons for Silicon-in-a-Package multichip modules, and the commercial availability of the techniques. The contributing authors, all leaders in this technical field, explore the needs, reveal the state of development and production, and point to changes in technology that can bring this technology into wider use for more complex applications. It is an advocacy book in this respect - advocacy for the use of a technology that is already mature, and advocacy for exploring ways to make it even more capable for the future. It will also do more than discuss the present; it will point out the deficiencies of the constructions, the needed availability of good flex material, the use of newer flex materials, such as LCP, and the implications from the use of the Integrated Mesh Power Systems to enhance the capability for future designs. Lastly it will discuss the serious problem of heat removal if multiple microprocessors are included.
Author : Nitin Afzalpulkar
Publisher : Springer
ISBN 13 : 8132226380
Total Pages : 964 pages
Book Rating : 4.1/5 (322 download)
Download or read book Proceedings of the International Conference on Recent Cognizance in Wireless Communication & Image Processing written by Nitin Afzalpulkar and published by Springer. This book was released on 2016-04-28 with total page 964 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume comprises the proceedings of the International Conference on Recent Cognizance in Wireless Communication & Image Processing. It brings together content from academicians, researchers, and industry experts in areas of Wireless Communication and Image Processing. The volume provides a snapshot of current progress in computational creativity and a glimpse of future possibilities. The proceedings include two kinds of paper submissions: (i) regular papers addressing foundation issues, describing original research on creative systems development and modeling; and (ii) position papers describing work-in-progress or research directions for computational creativity. This work will be useful to professionals and researchers working in the core areas of wireless communications and image processing.
Author : Vasilis F. Pavlidis
Publisher : Newnes
ISBN 13 : 0124104843
Total Pages : 770 pages
Book Rating : 4.1/5 (241 download)
Download or read book Three-Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and published by Newnes. This book was released on 2017-07-04 with total page 770 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization
Author : National Academies of Sciences, Engineering, and Medicine
Publisher : National Academies Press
ISBN 13 : 0309473926
Total Pages : 243 pages
Book Rating : 4.3/5 (94 download)
Download or read book Science Breakthroughs to Advance Food and Agricultural Research by 2030 written by National Academies of Sciences, Engineering, and Medicine and published by National Academies Press. This book was released on 2019-04-21 with total page 243 pages. Available in PDF, EPUB and Kindle. Book excerpt: For nearly a century, scientific advances have fueled progress in U.S. agriculture to enable American producers to deliver safe and abundant food domestically and provide a trade surplus in bulk and high-value agricultural commodities and foods. Today, the U.S. food and agricultural enterprise faces formidable challenges that will test its long-term sustainability, competitiveness, and resilience. On its current path, future productivity in the U.S. agricultural system is likely to come with trade-offs. The success of agriculture is tied to natural systems, and these systems are showing signs of stress, even more so with the change in climate. More than a third of the food produced is unconsumed, an unacceptable loss of food and nutrients at a time of heightened global food demand. Increased food animal production to meet greater demand will generate more greenhouse gas emissions and excess animal waste. The U.S. food supply is generally secure, but is not immune to the costly and deadly shocks of continuing outbreaks of food-borne illness or to the constant threat of pests and pathogens to crops, livestock, and poultry. U.S. farmers and producers are at the front lines and will need more tools to manage the pressures they face. Science Breakthroughs to Advance Food and Agricultural Research by 2030 identifies innovative, emerging scientific advances for making the U.S. food and agricultural system more efficient, resilient, and sustainable. This report explores the availability of relatively new scientific developments across all disciplines that could accelerate progress toward these goals. It identifies the most promising scientific breakthroughs that could have the greatest positive impact on food and agriculture, and that are possible to achieve in the next decade (by 2030).
