Read Books Online and Download eBooks, EPub, PDF, Mobi, Kindle, Text Full Free.
Download 2009 Ieee Workshop On Signal Propagation On Interconnects Spi full books in PDF, epub, and Kindle. Read online 2009 Ieee Workshop On Signal Propagation On Interconnects Spi ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!
Author : IEEE Staff
Publisher :
ISBN 13 : 9781509068654
Total Pages : pages
Book Rating : 4.0/5 (686 download)
Download or read book 2009 IEEE Workshop on Signal Propagation on Interconnects written by IEEE Staff and published by . This book was released on 2009 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects written by and published by . This book was released on 2002 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Renato Rimolo-Donadio
Publisher : Logos Verlag Berlin GmbH
ISBN 13 : 3832527761
Total Pages : 226 pages
Book Rating : 4.8/5 (325 download)
Download or read book Development, Validation, and Application of Semi-Analytical Interconnect Models for Efficient Simulation of Multilayer Substrates written by Renato Rimolo-Donadio and published by Logos Verlag Berlin GmbH. This book was released on 2011 with total page 226 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thesis deals with the development of semi-analytical models for the electrical behavior of vias and traces in chip packages and printed circuit boards. A framework for automated simulation of multilayer structures is also proposed. The validation and evaluation of the models are thoroughly addressed with several test structures and application studies. It is shown that the models can provide good results up to 40 GHz, whereas the numerical efficiency is at least two orders of magnitude higher in comparison to general-purpose numerical methods.
Author : Manho Lee
Publisher : Springer
ISBN 13 : 9401790388
Total Pages : 286 pages
Book Rating : 4.4/5 (17 download)
Download or read book Electrical Design of Through Silicon Via written by Manho Lee and published by Springer. This book was released on 2014-05-11 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.
Author : Mikhail Baklanov
Publisher : John Wiley & Sons
ISBN 13 : 0470662549
Total Pages : 616 pages
Book Rating : 4.4/5 (76 download)
Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-04-02 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
Author : Stefano Grivet-Talocia
Publisher : John Wiley & Sons
ISBN 13 : 1119140951
Total Pages : 912 pages
Book Rating : 4.1/5 (191 download)
Download or read book Passive Macromodeling written by Stefano Grivet-Talocia and published by John Wiley & Sons. This book was released on 2015-10-30 with total page 912 pages. Available in PDF, EPUB and Kindle. Book excerpt: Offers an overview of state of the art passive macromodeling techniques with an emphasis on black-box approaches This book offers coverage of developments in linear macromodeling, with a focus on effective, proven methods. After starting with a definition of the fundamental properties that must characterize models of physical systems, the authors discuss several prominent passive macromodeling algorithms for lumped and distributed systems and compare them under accuracy, efficiency, and robustness standpoints. The book includes chapters with standard background material (such as linear time-invariant circuits and systems, basic discretization of field equations, state-space systems), as well as appendices collecting basic facts from linear algebra, optimization templates, and signals and transforms. The text also covers more technical and advanced topics, intended for the specialist, which may be skipped at first reading. Provides coverage of black-box passive macromodeling, an approach developed by the authors Elaborates on main concepts and results in a mathematically precise way using easy-to-understand language Illustrates macromodeling concepts through dedicated examples Includes a comprehensive set of end-of-chapter problems and exercises Passive Macromodeling: Theory and Applications serves as a reference for senior or graduate level courses in electrical engineering programs, and to engineers in the fields of numerical modeling, simulation, design, and optimization of electrical/electronic systems. Stefano Grivet-Talocia, PhD, is an Associate Professor of Circuit Theory at the Politecnico di Torino in Turin, Italy, and President of IdemWorks. Dr. Grivet-Talocia is author of over 150 technical papers published in international journals and conference proceedings. He invented several algorithms in the area of passive macromodeling, making them available through IdemWorks. Bjørn Gustavsen, PhD, is a Chief Research Scientist in Energy Systems at SINTEF Energy Research in Trondheim, Norway. More than ten years ago, Dr. Gustavsen developed the original version of the vector fitting method with Prof. Semlyen at the University of Toronto. The vector fitting method is one of the most widespread approaches for model extraction. Dr. Gustavsen is also an IEEE fellow.
Author : Madhavan Swaminathan
Publisher : World Scientific
ISBN 13 : 9814508608
Total Pages : 379 pages
Book Rating : 4.8/5 (145 download)
Download or read book Design and Modeling for 3D ICs and Interposers written by Madhavan Swaminathan and published by World Scientific. This book was released on 2013-11-05 with total page 379 pages. Available in PDF, EPUB and Kindle. Book excerpt: 3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.
Author : Ian O'Connor
Publisher : Springer Science & Business Media
ISBN 13 : 1441961933
Total Pages : 286 pages
Book Rating : 4.4/5 (419 download)
Download or read book Integrated Optical Interconnect Architectures for Embedded Systems written by Ian O'Connor and published by Springer Science & Business Media. This book was released on 2012-11-07 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a broad overview of current research in optical interconnect technologies and architectures. Introductory chapters on high-performance computing and the associated issues in conventional interconnect architectures, and on the fundamental building blocks for integrated optical interconnect, provide the foundations for the bulk of the book which brings together leading experts in the field of optical interconnect architectures for data communication. Particular emphasis is given to the ways in which the photonic components are assembled into architectures to address the needs of data-intensive on-chip communication, and to the performance evaluation of such architectures for specific applications.
Author : Blaise Ravelo
Publisher : Springer Nature
ISBN 13 : 9811505527
Total Pages : 233 pages
Book Rating : 4.8/5 (115 download)
Download or read book Analytical Methodology of Tree Microstrip Interconnects Modelling For Signal Distribution written by Blaise Ravelo and published by Springer Nature. This book was released on 2019-11-21 with total page 233 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the modelling methodology of microstrip interconnects, discussing various structures of single-input multiple-output (SIMO) tree interconnects for signal integrity (SI) engineering. Further, it describes lumped and distributed transmission line elements based on single-input single-output (SIMO) models of symmetric and asymmetric trees, and investigates more complicated phenomenon, such as interbranch coupling. The modelling approaches are based on the analytical methods using the Z-, Y- and T-matrices. The established method enables the S-parameters and voltage transfer function of SIMO tree to be determined. Providing illustrative results with frequency and time domain analyses for each tree interconnect structure, the book is a valuable resource for researchers, engineers, and graduate students in fields of analogue, RF/microwave, digital and mixed circuit design, SI and manufacturing engineering.
Author : IEEE Workshop on Signal Propagation on Interconnects
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (115 download)
Download or read book 10th IEEE Workshop on Signal Propagation on Interconnects : May 09-12, 2006, "Dorint Sofitel Schweizerhof Berlin", Berlin, Germany : Proceedings written by IEEE Workshop on Signal Propagation on Interconnects and published by . This book was released on 2006 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Brajesh Kumar Kaushik
Publisher : Springer
ISBN 13 : 8132220471
Total Pages : 94 pages
Book Rating : 4.1/5 (322 download)
Download or read book Carbon Nanotube Based VLSI Interconnects written by Brajesh Kumar Kaushik and published by Springer. This book was released on 2014-11-01 with total page 94 pages. Available in PDF, EPUB and Kindle. Book excerpt: The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.
Author : Antonio Orlandi
Publisher : John Wiley & Sons
ISBN 13 : 1119281520
Total Pages : 236 pages
Book Rating : 4.1/5 (192 download)
Download or read book Electromagnetic Bandgap (EBG) Structures written by Antonio Orlandi and published by John Wiley & Sons. This book was released on 2017-06-19 with total page 236 pages. Available in PDF, EPUB and Kindle. Book excerpt: An essential guide to the background, design, and application of common-mode filtering structures in modern high-speed differential communication links Written by a team of experts in the field, Electromagnetic Bandgap (EBG) Structures explores the practical electromagnetic bandgap based common mode filters for power integrity applications and covers the theoretical and practical design approaches for common mode filtering in high-speed printed circuit boards, especially for boards in high data-rate systems. The authors describe the classic applications of electromagnetic bandgap (EBG) structures and the phenomena of common mode generation in high speed digital boards. The text also explores the fundamental electromagnetic mechanisms of the functioning of planar EBGs and considers the impact of planar EBGs on the digital signal propagation of single ended and differential interconnects routed on top or between EBGs. The authors examine the concept, design, and modeling of EBG common mode filters in their two forms: on-board and removable. They also provide several comparisons between measurement and electromagnetic simulations that validate the proposed EBG filters' design approach. This important resource: • Presents information on planar EBG based common mode filters for high speed differential digital systems • Provides systematic analysis of the fundamental mechanisms of planar EBG structures • Offers detailed design methodology to create EBG filters without the need for repeated full-wave electromagnetic analysis • Demonstrates techniques for use in practical real-world designs Electromagnetic Bandgap (EBG) Structures: Common Mode Filters for High Speed Digital Systems offers an introduction to the background, design, and application of common-mode filtering structures in modern high-speed differential communication links, a critical issue in high-speed and high-performance systems.
Author : Aida Todri-Sanial
Publisher : CRC Press
ISBN 13 : 1351830198
Total Pages : 409 pages
Book Rating : 4.3/5 (518 download)
Download or read book Physical Design for 3D Integrated Circuits written by Aida Todri-Sanial and published by CRC Press. This book was released on 2017-12-19 with total page 409 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Author : Slawomir Koziel
Publisher : Springer
ISBN 13 : 3319275178
Total Pages : 405 pages
Book Rating : 4.3/5 (192 download)
Download or read book Simulation-Driven Modeling and Optimization written by Slawomir Koziel and published by Springer. This book was released on 2016-02-12 with total page 405 pages. Available in PDF, EPUB and Kindle. Book excerpt: This edited volume is devoted to the now-ubiquitous use of computational models across most disciplines of engineering and science, led by a trio of world-renowned researchers in the field. Focused on recent advances of modeling and optimization techniques aimed at handling computationally-expensive engineering problems involving simulation models, this book will be an invaluable resource for specialists (engineers, researchers, graduate students) working in areas as diverse as electrical engineering, mechanical and structural engineering, civil engineering, industrial engineering, hydrodynamics, aerospace engineering, microwave and antenna engineering, ocean science and climate modeling, and the automotive industry, where design processes are heavily based on CPU-heavy computer simulations. Various techniques, such as knowledge-based optimization, adjoint sensitivity techniques, and fast replacement models (to name just a few) are explored in-depth along with an array of the latest techniques to optimize the efficiency of the simulation-driven design process. High-fidelity simulation models allow for accurate evaluations of the devices and systems, which is critical in the design process, especially to avoid costly prototyping stages. Despite this and other advantages, the use of simulation tools in the design process is quite challenging due to associated high computational cost. The steady increase of available computational resources does not always translate into the shortening of the design cycle because of the growing demand for higher accuracy and necessity to simulate larger and more complex systems. For this reason, automated simulation-driven design—while highly desirable—is difficult when using conventional numerical optimization routines which normally require a large number of system simulations, each one already expensive.
Author : IEEE Components, Packaging and Manufacturing Technology Society. Technical Committee on Electrical Design, Modeling and Simulation
Publisher :
ISBN 13 : 9781424476114
Total Pages : pages
Book Rating : 4.4/5 (761 download)
Download or read book 2010 IEEE 14th Workshop on Signal Propagation on Interconnects written by IEEE Components, Packaging and Manufacturing Technology Society. Technical Committee on Electrical Design, Modeling and Simulation and published by . This book was released on 2010 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Glauco Fontgalland
Publisher : Amplla Editora
ISBN 13 : 655381063X
Total Pages : 256 pages
Book Rating : 4.5/5 (538 download)
Download or read book Smart Systems written by Glauco Fontgalland and published by Amplla Editora. This book was released on 2022-09-11 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book aims to highlight the strength and state-of-art of some techniques and methods applied to intelligent systems. Rather to cover the variety of techniques and methods available in the literature, which is out of scope of this book, it focuses on those consolidated and applied and on those with high potential of implementation to smart systems. This book has fourteen chapters covering abroad range of topics in communications. The first three chapters are devoted to state-of-art and review papers on planar filters, unmanned aerial vehicles (UAV), negative group delay, nanoclusters, and tunable lights, while the remain chapters cover specific topics such as smart monitoring, V2I, high-speed links, RF and Optical sensors, composite material, metamaterial, energy harvesting, radar, SWIPT, and electromagnetic sources.
Download or read book Signal Propagation on Interconnects, 2006. IEEE Workshop on written by and published by . This book was released on 2006 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
