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Author : IEEE Staff
Publisher :
ISBN 13 : 9781509068654
Total Pages : pages
Book Rating : 4.0/5 (686 download)
Download or read book 2009 IEEE Workshop on Signal Propagation on Interconnects written by IEEE Staff and published by . This book was released on 2009 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : IEEE Staff
Publisher :
ISBN 13 : 9781424444908
Total Pages : 139 pages
Book Rating : 4.4/5 (449 download)
Download or read book 2009 IEEE Workshop on Signal Propagation on Interconnects (Spi) written by IEEE Staff and published by . This book was released on 2009 with total page 139 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Workshop Program, 13th IEEE Workshop on Signal Propagation on Interconnects written by and published by . This book was released on 2009 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects written by and published by . This book was released on 2002 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : IEEE Components, Packaging and Manufacturing Technology Society. Technical Committee on Electrical Design, Modeling and Simulation
Publisher :
ISBN 13 : 9781424476114
Total Pages : pages
Book Rating : 4.4/5 (761 download)
Download or read book 2010 IEEE 14th Workshop on Signal Propagation on Interconnects written by IEEE Components, Packaging and Manufacturing Technology Society. Technical Committee on Electrical Design, Modeling and Simulation and published by . This book was released on 2010 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Hartmut Grabinski
Publisher : Springer Science & Business Media
ISBN 13 : 1475765126
Total Pages : 150 pages
Book Rating : 4.4/5 (757 download)
Download or read book Signal Propagation on Interconnects written by Hartmut Grabinski and published by Springer Science & Business Media. This book was released on 2013-11-11 with total page 150 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book comprises a selection of the most representative contributions to the 1st IEEE Workshop on Signal Propagation on Interconnects that was held at Travemunde, Germany, in May 1997. It represents, therefore, a survey of the actual problems currently concerning researchers and professionals in the field of signal propagation on interconnects. Signal Propagation on Interconnects contains chapters which cover a wide area of important research results dealing with simulation and measurement of noise and radiated emissions on boards, describing ground bounce effects as well as inductance calculations in multilayer packages. There is also reference and coverage of timing simulation techniques on chip as well as on board level. Signal Propagation on Interconnects is intended to give developers and researchers in the field of chip and package design a review of the state of the art regarding the influence of interconnect effects on the electrical performance of electronic circuits. In addition, the book illustrates ways to overcome performance problems related to the parasitic influences of interconnects. It is an invaluable text for circuit design engineers, developers and researchers in the field of signal integrity.
Author :
Publisher : IEEE Computer Society Press
ISBN 13 : 9780780384705
Total Pages : 218 pages
Book Rating : 4.3/5 (847 download)
Download or read book 8th IEEE Workshop on Signal Propagation on Interconnects written by and published by IEEE Computer Society Press. This book was released on 2004-01-01 with total page 218 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 : 9781509098835
Total Pages : 218 pages
Book Rating : 4.0/5 (988 download)
Download or read book 9th IEEE Workshop on Signal Propagation on Interconnects written by and published by . This book was released on 2005 with total page 218 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Signal Propagation on Interconnects, 2006. IEEE Workshop on written by and published by . This book was released on 2006 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : IEEE Workshop on Signal Propagation on Interconnects
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (115 download)
Download or read book 10th IEEE Workshop on Signal Propagation on Interconnects : May 09-12, 2006, "Dorint Sofitel Schweizerhof Berlin", Berlin, Germany : Proceedings written by IEEE Workshop on Signal Propagation on Interconnects and published by . This book was released on 2006 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Yash Agrawal
Publisher : Springer Nature
ISBN 13 : 9819944767
Total Pages : 286 pages
Book Rating : 4.8/5 (199 download)
Download or read book Interconnect Technologies for Integrated Circuits and Flexible Electronics written by Yash Agrawal and published by Springer Nature. This book was released on 2023-10-17 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.
Author :
Publisher :
ISBN 13 :
Total Pages : 192 pages
Book Rating : 4.:/5 (492 download)
Download or read book Signal Propagation on Interconnects written by and published by . This book was released on 2002 with total page 192 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Mikhail Baklanov
Publisher : John Wiley & Sons
ISBN 13 : 0470662549
Total Pages : 616 pages
Book Rating : 4.4/5 (76 download)
Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-04-02 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
Author : Manho Lee
Publisher : Springer
ISBN 13 : 9401790388
Total Pages : 286 pages
Book Rating : 4.4/5 (17 download)
Download or read book Electrical Design of Through Silicon Via written by Manho Lee and published by Springer. This book was released on 2014-05-11 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.
Author : Ian O'Connor
Publisher : Springer Science & Business Media
ISBN 13 : 1441961933
Total Pages : 286 pages
Book Rating : 4.4/5 (419 download)
Download or read book Integrated Optical Interconnect Architectures for Embedded Systems written by Ian O'Connor and published by Springer Science & Business Media. This book was released on 2012-11-07 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a broad overview of current research in optical interconnect technologies and architectures. Introductory chapters on high-performance computing and the associated issues in conventional interconnect architectures, and on the fundamental building blocks for integrated optical interconnect, provide the foundations for the bulk of the book which brings together leading experts in the field of optical interconnect architectures for data communication. Particular emphasis is given to the ways in which the photonic components are assembled into architectures to address the needs of data-intensive on-chip communication, and to the performance evaluation of such architectures for specific applications.
Author : Blaise Ravelo
Publisher : Springer Nature
ISBN 13 : 9811505527
Total Pages : 233 pages
Book Rating : 4.8/5 (115 download)
Download or read book Analytical Methodology of Tree Microstrip Interconnects Modelling For Signal Distribution written by Blaise Ravelo and published by Springer Nature. This book was released on 2019-11-21 with total page 233 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the modelling methodology of microstrip interconnects, discussing various structures of single-input multiple-output (SIMO) tree interconnects for signal integrity (SI) engineering. Further, it describes lumped and distributed transmission line elements based on single-input single-output (SIMO) models of symmetric and asymmetric trees, and investigates more complicated phenomenon, such as interbranch coupling. The modelling approaches are based on the analytical methods using the Z-, Y- and T-matrices. The established method enables the S-parameters and voltage transfer function of SIMO tree to be determined. Providing illustrative results with frequency and time domain analyses for each tree interconnect structure, the book is a valuable resource for researchers, engineers, and graduate students in fields of analogue, RF/microwave, digital and mixed circuit design, SI and manufacturing engineering.
Author :
Publisher : ASM International
ISBN 13 : 1615030921
Total Pages : 371 pages
Book Rating : 4.6/5 (15 download)
Download or read book ISTFA 2009 written by and published by ASM International. This book was released on 2009-01-01 with total page 371 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results.
