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Author :
Publisher : The Electrochemical Society
ISBN 13 : 9781566774024
Total Pages : 404 pages
Book Rating : 4.7/5 (74 download)
Download or read book Semiconductor Wafer Bonding VII : Science, Technology, and Applications written by and published by The Electrochemical Society. This book was released on 2003 with total page 404 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Yoshio Nishi
Publisher : CRC Press
ISBN 13 : 1420017667
Total Pages : 1720 pages
Book Rating : 4.4/5 (2 download)
Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2017-12-19 with total page 1720 pages. Available in PDF, EPUB and Kindle. Book excerpt: Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Author : Tadahiro Ohmi
Publisher : CRC Press
ISBN 13 : 1420026860
Total Pages : 402 pages
Book Rating : 4.4/5 (2 download)
Download or read book Scientific Wet Process Technology for Innovative LSI/FPD Manufacturing written by Tadahiro Ohmi and published by CRC Press. This book was released on 2018-10-03 with total page 402 pages. Available in PDF, EPUB and Kindle. Book excerpt: As science pushes closer toward the atomic size scale, new challenges arise to slow the pace of the miniaturization that has transformed our society and fueled the information age. New technologies are necessary to surpass these obstacles and realize the tremendous growth predicted by Moore's law. Assembled from the works of pioneering researchers, Scientific Wet Process Technology for Innovative LSI/FPD Manufacturing presents new developments and technologies for producing the next generation of electronic circuits and displays. This book introduces radical-reaction-based semiconductor manufacturing technologies that overcome the limitations of the existing molecule-reaction-based technologies. It systematically details the procedures and underlying concepts involved in wet process technologies and applications. Following an introduction to semiconductor surface chemical electronics, expert contributors discuss the principles and technology of high-performance wet cleaning; etching technologies and processes; antistatic technology; wet vapor resist stripping technology; and process and safety technologies including waste reclamation, chemical composition control, and ultrapure water and liquid chemical supply systems and materials for fluctuation-free facilities. Currently, large production runs are needed to balance the costs of acquiring and tuning equipment for specialized operating conditions. Scientific Wet Process Technology for Innovative LSI/FPD Manufacturing explains the technologies and processes used to meet the demand for variety and low volumes that exists in today's digital electronics marketplace.
Author : Keisoku Jidō Seigyo Gakkai (Japan). Gakujutsu Kōenkai
Publisher :
ISBN 13 :
Total Pages : 654 pages
Book Rating : 4.E/5 ( download)
Download or read book SICE 2002 written by Keisoku Jidō Seigyo Gakkai (Japan). Gakujutsu Kōenkai and published by . This book was released on 2002 with total page 654 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Bernd O. Kolbesen
Publisher : The Electrochemical Society
ISBN 13 : 9781566773638
Total Pages : 380 pages
Book Rating : 4.7/5 (736 download)
Download or read book Crystalline Defects and Contamination written by Bernd O. Kolbesen and published by The Electrochemical Society. This book was released on 2001 with total page 380 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 800 pages
Book Rating : 4.:/5 (31 download)
Download or read book IEEE International Symposium on Industrial Electronics Proceedings written by and published by . This book was released on 2004 with total page 800 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : M. Datta
Publisher : CRC Press
ISBN 13 : 020347368X
Total Pages : 564 pages
Book Rating : 4.2/5 (34 download)
Download or read book Microelectronic Packaging written by M. Datta and published by CRC Press. This book was released on 2004-12-20 with total page 564 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.
Author : Charles J. Alpert
Publisher : CRC Press
ISBN 13 : 1420013483
Total Pages : 1024 pages
Book Rating : 4.4/5 (2 download)
Download or read book Handbook of Algorithms for Physical Design Automation written by Charles J. Alpert and published by CRC Press. This book was released on 2008-11-12 with total page 1024 pages. Available in PDF, EPUB and Kindle. Book excerpt: The physical design flow of any project depends upon the size of the design, the technology, the number of designers, the clock frequency, and the time to do the design. As technology advances and design-styles change, physical design flows are constantly reinvented as traditional phases are removed and new ones are added to accommodate changes in
Author :
Publisher :
ISBN 13 :
Total Pages : 636 pages
Book Rating : 4.3/5 (91 download)
Download or read book Publications in Engineering written by and published by . This book was released on 2002 with total page 636 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Ram Ekwal Sah
Publisher : The Electrochemical Society
ISBN 13 : 1566775523
Total Pages : 863 pages
Book Rating : 4.5/5 (667 download)
Download or read book Silicon Nitride, Silicon Dioxide, and Emerging Dielectrics 9 written by Ram Ekwal Sah and published by The Electrochemical Society. This book was released on 2007 with total page 863 pages. Available in PDF, EPUB and Kindle. Book excerpt: This issue of ECS Transactions contains the papers presented in the symposium on Silicon Nitride, Silicon Dioxide Thin Insulating Films, and Emerging Dielectics held May 6-11, 2007 in Chicago. Papers were presented on deposition, characterization and applications of the dielectrics including high- and low-k dielectrics, as well as interface states, device characterization, reliabiliy and modeling.
Author : Ming Yang
Publisher :
ISBN 13 :
Total Pages : 688 pages
Book Rating : 4.:/5 (37 download)
Download or read book Semiconductor Technology (ISTC 2001) written by Ming Yang and published by . This book was released on 2001 with total page 688 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : David Chinnery
Publisher : Springer Science & Business Media
ISBN 13 : 0306478234
Total Pages : 422 pages
Book Rating : 4.3/5 (64 download)
Download or read book Closing the Gap Between ASIC & Custom written by David Chinnery and published by Springer Science & Business Media. This book was released on 2007-05-08 with total page 422 pages. Available in PDF, EPUB and Kindle. Book excerpt: by Kurt Keutzer Those looking for a quick overview of the book should fast-forward to the Introduction in Chapter 1. What follows is a personal account of the creation of this book. The challenge from Earl Killian, formerly an architect of the MIPS processors and at that time Chief Architect at Tensilica, was to explain the significant performance gap between ASICs and custom circuits designed in the same process generation. The relevance of the challenge was amplified shortly thereafter by Andy Bechtolsheim, founder of Sun Microsystems and ubiquitous investor in the EDA industry. At a dinner talk at the 1999 International Symposium on Physical Design, Andy stated that the greatest near-term opportunity in CAD was to develop tools to bring the performance of ASIC circuits closer to that of custom designs. There seemed to be some synchronicity that two individuals so different in concern and character would be pre-occupied with the same problem. Intrigued by Earl and Andy’s comments, the game was afoot. Earl Killian and other veterans of microprocessor design were helpful with clues as to the sources of the performance discrepancy: layout, circuit design, clocking methodology, and dynamic logic. I soon realized that I needed help in tracking down clues. Only at a wonderful institution like the University of California at Berkeley could I so easily commandeer an ab- bodied graduate student like David Chinnery with a knowledge of architecture, circuits, computer-aided design and algorithms.
Author : M.R. Oliver
Publisher : Springer Science & Business Media
ISBN 13 : 3662062348
Total Pages : 432 pages
Book Rating : 4.6/5 (62 download)
Download or read book Chemical-Mechanical Planarization of Semiconductor Materials written by M.R. Oliver and published by Springer Science & Business Media. This book was released on 2013-03-14 with total page 432 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
Author : Karen Reinhardt
Publisher : William Andrew
ISBN 13 : 0815517734
Total Pages : 749 pages
Book Rating : 4.8/5 (155 download)
Download or read book Handbook of Silicon Wafer Cleaning Technology written by Karen Reinhardt and published by William Andrew. This book was released on 2008-12-10 with total page 749 pages. Available in PDF, EPUB and Kindle. Book excerpt: The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and the equipment are covered. A review of the current cleaning technologies is included. Also, advanced cleaning technologies that are under investigation for next generation processing are covered; including supercritical fluid, laser, and cryoaerosol cleaning techniques. Additionally theoretical aspects of the cleaning technologies and how these processes affect the wafer is discussed such as device damage and surface roughening will be discussed. The analysis of the wafers surface is outlined. A discussion of the new materials and the changes required for the surface conditioning process used for manufacturing is also included. - Focused on silicon wafer cleaning techniques including wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits - As this book covers the major technologies for removing contaminants, it is a reliable reference for anyone that manufactures integrated circuits, or supplies the semiconductor and microelectronics industries - Covers processes and equipment, as well as new materials and changes required for the surface conditioning process - Editors are two of the top names in the field and are both extensively published - Discusses next generation processing techniques including supercritical fluid, laser, and cryoaerosol
Author : G. S. Mathad
Publisher : The Electrochemical Society
ISBN 13 : 9781566773935
Total Pages : 438 pages
Book Rating : 4.7/5 (739 download)
Download or read book Thin Film Materials, Processes, and Reliability written by G. S. Mathad and published by The Electrochemical Society. This book was released on 2003 with total page 438 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Dong-Won Kim
Publisher : CRC Press
ISBN 13 : 1000936082
Total Pages : 238 pages
Book Rating : 4.0/5 (9 download)
Download or read book Making a Semiconductor Superpower written by Dong-Won Kim and published by CRC Press. This book was released on 2023-09-29 with total page 238 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides real stories about the South Korean semiconductor community. It explores the lives and careers of six influential semiconductor engineers who all studied at Korea Advanced Institute of Science and Technology (KAIST) under the mentorship of Dr. Kim Choong-Ki, the most influential semiconductor professor in South Korea during the last quarter of the twentieth century. Kim’s students became known as “Kim’s Mafia” because of the important positions they went on to hold in industry, government, and academia. This book will be of interest to semiconductor engineers and electronics engineers, historians of science and technology, and scholars and students of East Asian studies. “They were called ‘Kim’s Mafia.’ Kim Choong-Ki himself wouldn’t have put it that way. But it was true what semiconductor engineers in South Korea whispered about his former students: They were everywhere. ... Kim was the first professor in South Korea to systematically teach semiconductor engineering. From 1975, when the nation had barely begun producing its first transistors, to 2008, when he retired from teaching, Kim trained more than 100 students, effectively creating the first two generations of South Korean semiconductor experts.” (Source: IEEE Spectrum, October, 2022.)
Author : James Moyne
Publisher : CRC Press
ISBN 13 : 1420040669
Total Pages : 368 pages
Book Rating : 4.4/5 (2 download)
Download or read book Run-to-Run Control in Semiconductor Manufacturing written by James Moyne and published by CRC Press. This book was released on 2018-10-08 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt: Run-to-run (R2R) control is cutting-edge technology that allows modification of a product recipe between machine "runs," thereby minimizing process drift, shift, and variability-and with them, costs. Its effectiveness has been demonstrated in a variety of processes, such as vapor phase epitaxy, lithography, and chemical mechanical planarization. The only barrier to the semiconductor industry's widespread adoption of this highly effective process control is a lack of understanding of the technology. Run to Run Control in Semiconductor Manufacturing overcomes that barrier by offering in-depth analyses of R2R control.
