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Book Synopsis Semiconductor Thermal Measurement and Management Symposium, 2000. Sixteenth Annual IEEE by :
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Book Synopsis Annual IEEE Semiconductor Thermal Measurement and Management Symposium by :
Download or read book Annual IEEE Semiconductor Thermal Measurement and Management Symposium written by and published by . This book was released on 2005 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis 2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). by :
Download or read book 2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). written by and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis 2014 IEEE/CPMT 30th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM 2014) by :
Download or read book 2014 IEEE/CPMT 30th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM 2014) written by and published by . This book was released on 2014 with total page 251 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Semiconductor Thermal Measurement and Management Symposium, 2007. SEMI-THERM 2007. Twenty Third Annual IEEE. by :
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Book Synopsis 2014 IEEE/CPMT 30th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM 2014) by :
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Book Synopsis Thermal and Power Management of Integrated Circuits by : Arman Vassighi
Download or read book Thermal and Power Management of Integrated Circuits written by Arman Vassighi and published by Springer Science & Business Media. This book was released on 2006-06-01 with total page 188 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.
Book Synopsis Semiconductor Thermal Measurement and Management Symposium, 2010. SEMI-THERM 2010. 26th Annual IEEE. by :
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Download or read book Thirty-Fourth Annual Semiconductor Thermal Measurement and Management Symposium written by and published by . This book was released on 2018 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Semiconductor thermal management and modeling.
Book Synopsis Thirty-third Annual Semiconductor Thermal Measurement and Management Symposium by : Paul Wesling
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Book Synopsis "2021 37th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)". by :
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Book Synopsis Advanced Liquid Metal Cooling For Chip, Device And System by : Jing Liu
Download or read book Advanced Liquid Metal Cooling For Chip, Device And System written by Jing Liu and published by World Scientific. This book was released on 2022-04-08 with total page 961 pages. Available in PDF, EPUB and Kindle. Book excerpt: This compendium summarizes the core principles and practical applications of a brand-new advanced chip cooling category — liquid metal cooling. It illustrates the science and art of room temperature liquid metal enabled cooling for chip, device and system. The concise volume features unique scientific and practical merits, and clarified intriguing liquid metal coolant or medium behaviors in making new generation powerful cooling system.With both uniquely important fundamental and practical values, this useful reference text benefits researchers to set up their foundation and then find new ways of making advanced cooling system to fulfil the increasingly urgent needs in modern highly integrated chip industry.
Download or read book Failure Analysis written by Marius Bazu and published by John Wiley & Sons. This book was released on 2011-03-08 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt: Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
Book Synopsis Semi-therm 6 by : IEEE Components, Hybrids, and Manufacturing Technology Society
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Download or read book 2000 International Symposium on Microelectronics written by and published by . This book was released on 2000 with total page 916 pages. Available in PDF, EPUB and Kindle. Book excerpt: This text constitutes proceedings from the International Symposium on Microelectronics that took place in Boston, Massachusetts in September, 2000.
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Book Synopsis Semi-therm 5 by : IEEE Components, Hybrids, and Manufacturing Technology Society
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