Multi-Chip Module Test Strategies

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Publisher : Springer Science & Business Media
ISBN 13 : 1461561078
Total Pages : 161 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Multi-Chip Module Test Strategies by : Yervant Zorian

Download or read book Multi-Chip Module Test Strategies written by Yervant Zorian and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 161 pages. Available in PDF, EPUB and Kindle. Book excerpt: MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).

Proceedings, 1996 International Conference on Multichip Modules

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Publisher :
ISBN 13 :
Total Pages : 440 pages
Book Rating : 4.:/5 (318 download)

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Book Synopsis Proceedings, 1996 International Conference on Multichip Modules by :

Download or read book Proceedings, 1996 International Conference on Multichip Modules written by and published by . This book was released on 1996 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Microelectronics Packaging Handbook

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Publisher : Springer Science & Business Media
ISBN 13 : 1461560373
Total Pages : 1060 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Microelectronics Packaging Handbook by : R.R. Tummala

Download or read book Microelectronics Packaging Handbook written by R.R. Tummala and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 1060 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

The 1994 IEEE International Conference on Neural Networks

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Publisher :
ISBN 13 :
Total Pages : 710 pages
Book Rating : 4.:/5 (318 download)

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Book Synopsis The 1994 IEEE International Conference on Neural Networks by :

Download or read book The 1994 IEEE International Conference on Neural Networks written by and published by . This book was released on 1994 with total page 710 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Algorithms - ESA '94

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Publisher : Springer Science & Business Media
ISBN 13 : 9783540584346
Total Pages : 536 pages
Book Rating : 4.5/5 (843 download)

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Book Synopsis Algorithms - ESA '94 by : Jan van Leeuwen

Download or read book Algorithms - ESA '94 written by Jan van Leeuwen and published by Springer Science & Business Media. This book was released on 1994-09-14 with total page 536 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book brings together recent developments in Alzheimer's disease research with related discoveries in the field of cell biology. The book moves between basic cell biological concepts that form the underpinnings of modern Alzheimer's disease research, and current findings about proteins and cellular processes affected by the disease. Divided into three topics, the book addresses (1) protein trafficking, a problem that has become germane to the study of the amyloid precursor protein; (2) phosphorylation, a problem that underlies studies of the pathological transformation of tau to paired helical filaments; and (3) cell death, a pervasive problem in neurodegeneration.

National Semiconductor Metrology Program

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Publisher :
ISBN 13 :
Total Pages : 160 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis National Semiconductor Metrology Program by : National Institute of Standards and Technology (U.S.)

Download or read book National Semiconductor Metrology Program written by National Institute of Standards and Technology (U.S.) and published by . This book was released on 2000 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt:

National Semiconductor Metrology Program, Semiconductor Electronics Division, NIST List Of Publications, LP 103, March 1999

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Publisher :
ISBN 13 :
Total Pages : 148 pages
Book Rating : 4.F/5 ( download)

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Book Synopsis National Semiconductor Metrology Program, Semiconductor Electronics Division, NIST List Of Publications, LP 103, March 1999 by :

Download or read book National Semiconductor Metrology Program, Semiconductor Electronics Division, NIST List Of Publications, LP 103, March 1999 written by and published by . This book was released on 1999 with total page 148 pages. Available in PDF, EPUB and Kindle. Book excerpt:

National Semiconductor Metrology Program

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Publisher :
ISBN 13 :
Total Pages : 160 pages
Book Rating : 4.3/5 ( download)

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Book Synopsis National Semiconductor Metrology Program by : National Semiconductor Metrology Program (U.S.)

Download or read book National Semiconductor Metrology Program written by National Semiconductor Metrology Program (U.S.) and published by . This book was released on 2000 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt:

MEMS Materials and Processes Handbook

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Publisher : Springer Science & Business Media
ISBN 13 : 0387473181
Total Pages : 1211 pages
Book Rating : 4.3/5 (874 download)

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Book Synopsis MEMS Materials and Processes Handbook by : Reza Ghodssi

Download or read book MEMS Materials and Processes Handbook written by Reza Ghodssi and published by Springer Science & Business Media. This book was released on 2011-03-18 with total page 1211 pages. Available in PDF, EPUB and Kindle. Book excerpt: MEMs Materials and Processes Handbook" is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on "Materials" and "Processes". The extensive Material Selection Guide" and a "Material Database" guides the reader through the selection of appropriate materials for the required task at hand. The "Processes" section of the book is organized as a catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMs.

Advances in Acoustic Microscopy

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Publisher : Springer Science & Business Media
ISBN 13 : 1461518733
Total Pages : 374 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Advances in Acoustic Microscopy by : Andrew Briggs

Download or read book Advances in Acoustic Microscopy written by Andrew Briggs and published by Springer Science & Business Media. This book was released on 2013-11-11 with total page 374 pages. Available in PDF, EPUB and Kindle. Book excerpt: In 1992 Acoustic Microscopy was published by Oxford University Press, in the series of Monographs on the Physics and Chemistry of Materials. Reviews appeared in the Journal of Microscopy [169 (1), 91] and in Contemporary Physics [33 (4), 296]. At the time of going to press, it seemed that the field of acoustic microscopy had settled down from the wonderful developments in resolution that had been seen in the late seventies and the early eighties and from the no less exciting developments in quantitative elastic measurements that had followed. One reviewer wrote, "The time is ripe for such a book, now that the expansion of the subject has perceptively slowed after it was detonated by Lemons and Quate. " [A. Howie, Proc. RMS 27 (4), 280]. In many ways, this remains true. The basic design for both imaging and quantitative instruments is well-established; the upper frequency for routine imaging is the 2 GHz established by the Ernst Leitz scanning acoustic microscope (ELSAM) in 1984. For the most accurate V(z) measurements, the 225-MHz line-focus-beam lens, developed at Tohoku Univer sity a little before then, remains standard. The principles of the contrast theory have been confirmed by abundant experience; in particular the role of surface acoustic waves, such as Rayleigh waves, dominates the contrast in most high resolution studies of many materials.

Handbook of Adhesives and Sealants

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Publisher : Elsevier
ISBN 13 : 0080534090
Total Pages : 511 pages
Book Rating : 4.0/5 (85 download)

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Book Synopsis Handbook of Adhesives and Sealants by : Philippe Cognard

Download or read book Handbook of Adhesives and Sealants written by Philippe Cognard and published by Elsevier. This book was released on 2005-07-14 with total page 511 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Adhesives and Sealants is the most comprehensive Adhesives and Sealants Handbook ever published, with the cooperation of around 35 authors from all over the world – each one a specialist in their field. It will include 80 chapters dealing with general information, theory of bonding and sealing, design of bonding parts, technical characteristics, chemistry, types of adhesives, application, equipment, controls, standards etc. Industrial applications such as automotive, aeronautics, building and civil engineering, electronics, packaging, wood, furniture, metals, plastics and composites, textiles, footwear etc. - Over 1,000 real-life examples illustrate the do's and don'ts of using adhesives - Every scientific and technical issue concerning every chemical type in every industry - Designed to help solve problems quickly, the content is structured to allow readers to navigate this comprehensive resource in 4 different ways

Microelectronics

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Publisher : CRC Press
ISBN 13 : 1420037595
Total Pages : 464 pages
Book Rating : 4.4/5 (2 download)

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Book Synopsis Microelectronics by : Jerry C. Whitaker

Download or read book Microelectronics written by Jerry C. Whitaker and published by CRC Press. This book was released on 2018-10-03 with total page 464 pages. Available in PDF, EPUB and Kindle. Book excerpt: When it comes to electronics, demand grows as technology shrinks. From consumer and industrial markets to military and aerospace applications, the call is for more functionality in smaller and smaller devices. Culled from the second edition of the best-selling Electronics Handbook, Microelectronics, Second Edition presents a summary of the current state of microelectronics and its innovative directions. This book focuses on the materials, devices, and applications of microelectronics technology. It details the IC design process and VLSI circuits, including gate arrays, programmable logic devices and arrays, parasitic capacitance, and transmission line delays. Coverage ranges from thermal properties and semiconductor materials to MOSFETs, digital logic families, memory devices, microprocessors, digital-to-analog and analog-to-digital converters, digital filters, and multichip module technology. Expert contributors discuss applications in machine vision, ad hoc networks, printing technologies, and data and optical storage systems. The book also includes defining terms, references, and suggestions for further reading. This edition features two new sections on fundamental properties and semiconductor devices. With updated material and references in every chapter, Microelectronics, Second Edition is an essential reference for work with microelectronics, electronics, circuits, systems, semiconductors, logic design, and microprocessors.

RF and Microwave Microelectronics Packaging

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Publisher : Springer Science & Business Media
ISBN 13 : 1441909842
Total Pages : 295 pages
Book Rating : 4.4/5 (419 download)

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Book Synopsis RF and Microwave Microelectronics Packaging by : Ken Kuang

Download or read book RF and Microwave Microelectronics Packaging written by Ken Kuang and published by Springer Science & Business Media. This book was released on 2009-12-01 with total page 295 pages. Available in PDF, EPUB and Kindle. Book excerpt: RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

Integrated Circuit Manufacturability

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Publisher : John Wiley & Sons
ISBN 13 : 0780334477
Total Pages : 338 pages
Book Rating : 4.7/5 (83 download)

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Book Synopsis Integrated Circuit Manufacturability by : José Pineda de Gyvez

Download or read book Integrated Circuit Manufacturability written by José Pineda de Gyvez and published by John Wiley & Sons. This book was released on 1998-10-30 with total page 338 pages. Available in PDF, EPUB and Kindle. Book excerpt: "INTEGRATED CIRCUIT MANUFACTURABILITY provides comprehensive coverage of the process and design variables that determine the ease and feasibility of fabrication (or manufacturability) of contemporary VLSI systems and circuits. This book progresses from semiconductor processing to electrical design to system architecture. The material provides a theoretical background as well as case studies, examining the entire design for the manufacturing path from circuit to silicon. Each chapter includes tutorial and practical applications coverage. INTEGRATED CIRCUIT MANUFACTURABILITY illustrates the implications of manufacturability at every level of abstraction, including the effects of defects on the layout, their mapping to electrical faults, and the corresponding approaches to detect such faults. The reader will be introduced to key practical issues normally applied in industry and usually required by quality, product, and design engineering departments in today's design practices: * Yield management strategies * Effects of spot defects * Inductive fault analysis and testing * Fault-tolerant architectures and MCM testing strategies. This book will serve design and product engineers both from academia and industry. It can also be used as a reference or textbook for introductory graduate-level courses on manufacturing."

VLSI: Integrated Systems on Silicon

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Publisher : Springer
ISBN 13 : 0387353119
Total Pages : 569 pages
Book Rating : 4.3/5 (873 download)

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Book Synopsis VLSI: Integrated Systems on Silicon by : Ricardo A. Reis

Download or read book VLSI: Integrated Systems on Silicon written by Ricardo A. Reis and published by Springer. This book was released on 2013-06-05 with total page 569 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains the papers that have been presented at the ninth Very Large Scale Integrated Systems conference VLSI'97 that is organized biannually by IFIP Working Group 10.5. It took place at Hotel Serra Azul, in Gramado Brazil from 26-30 August 1997. Previous conferences have taken place in Edinburgh, Trondheim, Vancouver, Munich, Grenoble and Tokyo. The papers in this book report on all aspects of importance to the design of the current and future integrated systems. The current trend towards the realization of versatile Systems-on-a-Chip require attention of embedded hardware/software systems, dedicated ASIC hardware, sensors and actuators, mixed analog/digital design, video and image processing, low power battery operation and wireless communication. The papers as presented in Jhis book have been organized in two tracks, where one is dealing with VLSI System Design and Applications and the other presents VLSI Design Methods and CAD. The following topics are addressed: VLSI System Design and Applications Track • VLSI for Video and Image Processing. • Microsystem and Mixed-mode design. • Communication And Memory System Design • Cow-voltage & Low-power Analog Circuits. • High Speed Circuit Techniques • Application Specific DSP Architectures. VLSI Design Methods and CAD Track • Specification and Simulation at System Level. • Synthesis and Technology Mapping. • CAD Techniques for Low-Power Design. • Physical Design Issues in Sub-micron Technologies. • Architectural Design and Synthesis. • Testing in Complex Mixed Analog and Digital Systems.

Fan-Out Wafer-Level Packaging

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Publisher : Springer
ISBN 13 : 9811088845
Total Pages : 319 pages
Book Rating : 4.8/5 (11 download)

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Book Synopsis Fan-Out Wafer-Level Packaging by : John H. Lau

Download or read book Fan-Out Wafer-Level Packaging written by John H. Lau and published by Springer. This book was released on 2018-04-05 with total page 319 pages. Available in PDF, EPUB and Kindle. Book excerpt: This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.

Computer Aided Design of Optoelectronic Multi-chip Modules

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Publisher :
ISBN 13 :
Total Pages : 404 pages
Book Rating : 4.:/5 (318 download)

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Book Synopsis Computer Aided Design of Optoelectronic Multi-chip Modules by : Jiao Fan

Download or read book Computer Aided Design of Optoelectronic Multi-chip Modules written by Jiao Fan and published by . This book was released on 1994 with total page 404 pages. Available in PDF, EPUB and Kindle. Book excerpt: