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Author :
Publisher :
ISBN 13 :
Total Pages : 259 pages
Book Rating : 4.:/5 (913 download)
Download or read book 1989 IEEE International Reliability Physics Symposium Proceedings written by and published by . This book was released on 1989 with total page 259 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Ariz.) International Reliability Physics Symposium (27th : 1989 : Phoenix
Publisher :
ISBN 13 :
Total Pages : 259 pages
Book Rating : 4.:/5 (826 download)
Download or read book Reliability Physics 1989 written by Ariz.) International Reliability Physics Symposium (27th : 1989 : Phoenix and published by . This book was released on 1989 with total page 259 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : J. W. McPherson
Publisher : Springer
ISBN 13 : 3319936832
Total Pages : 469 pages
Book Rating : 4.3/5 (199 download)
Download or read book Reliability Physics and Engineering written by J. W. McPherson and published by Springer. This book was released on 2018-12-20 with total page 469 pages. Available in PDF, EPUB and Kindle. Book excerpt: This third edition textbook provides the basics of reliability physics and engineering that are needed by electrical engineers, mechanical engineers, civil engineers, biomedical engineers, materials scientists, and applied physicists to help them to build better devices/products. The information contained within should help all fields of engineering to develop better methodologies for: more reliable product designs, more reliable materials selections, and more reliable manufacturing processes— all of which should help to improve product reliability. A mathematics level through differential equations is needed. Also, a familiarity with the use of excel spreadsheets is assumed. Any needed statistical training and tools are contained within the text. While device failure is a statistical process (thus making statistics important), the emphasis of this book is clearly on the physics of failure and developing the reliability engineering tools required for product improvements during device-design and device-fabrication phases.
Author : Reliability Physics
Publisher :
ISBN 13 :
Total Pages : 0 pages
Book Rating : 4.:/5 (14 download)
Download or read book Reliability Physics (27th Annual Proceedings 1989) Phoenix, April 11-13, 1989 written by Reliability Physics and published by . This book was released on with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliability Physics Symposium, 1989. 27th Annual Proceedings., International written by and published by . This book was released on 1989 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 259 pages
Book Rating : 4.:/5 (258 download)
Download or read book Reliability Physics 1989 written by and published by . This book was released on 1989 with total page 259 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 309 pages
Book Rating : 4.:/5 (932 download)
Download or read book 22nd Annual Proceedings of International Reliability Physics Symposium, 1984, Las Vegas, Nevada written by and published by . This book was released on 1984 with total page 309 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Yoshio Nishi
Publisher : CRC Press
ISBN 13 : 1420017667
Total Pages : 1720 pages
Book Rating : 4.4/5 (2 download)
Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2017-12-19 with total page 1720 pages. Available in PDF, EPUB and Kindle. Book excerpt: Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Author : International Reliability Physics Symposium
Publisher :
ISBN 13 :
Total Pages : 259 pages
Book Rating : 4.:/5 (634 download)
Download or read book Reliability Physics ... written by International Reliability Physics Symposium and published by . This book was released on with total page 259 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 27th Annual Proceedings., International Reliability Physics Symposium written by and published by . This book was released on 1989 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 259 pages
Book Rating : 4.:/5 (475 download)
Download or read book 27th Annual Proceedings, Reliability Physics 1989 written by and published by . This book was released on 1989 with total page 259 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 384 pages
Book Rating : 4.:/5 (15 download)
Download or read book 1997 IEEE International Reliability Physics Symposium Proceedings written by and published by . This book was released on 1997 with total page 384 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliability Physics 1989 written by and published by . This book was released on 1989 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: ESD and hot-carriers / metallization and corrosion / packaging / dielectric / electromigration.
Author : Y.-L. Shen
Publisher : Springer Science & Business Media
ISBN 13 : 144196312X
Total Pages : 290 pages
Book Rating : 4.4/5 (419 download)
Download or read book Constrained Deformation of Materials written by Y.-L. Shen and published by Springer Science & Business Media. This book was released on 2010-08-09 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Constrained Deformation of Materials: Devices, Heterogeneous Structures and Thermo-Mechanical Modeling" is an in-depth look at the mechanical analyses and modeling of advanced small-scale structures and heterogeneous material systems. Mechanical deformations in thin films and miniaturized materials, commonly found in microelectronic devices and packages, MEMS, nanostructures and composite and multi-phase materials, are heavily influenced by the external or internal physical confinement. A continuum mechanics-based approach is used, together with discussions on micro-mechanisms, to treat the subject in a systematic manner under the unified theme. Readers will find valuable information on the proper application of thermo-mechanics in numerical modeling as well as in the interpretation and prediction of physical material behavior, along with many case studies. Additionally, particular attention is paid to practical engineering relevance. Thus real-life reliability issues are discussed in detail to serve the needs of researchers and engineers alike.
Author : Michael Pecht
Publisher : CRC Press
ISBN 13 : 9780849394577
Total Pages : 450 pages
Book Rating : 4.3/5 (945 download)
Download or read book Product Reliability, Maintainability, and Supportability Handbook written by Michael Pecht and published by CRC Press. This book was released on 1995-05-04 with total page 450 pages. Available in PDF, EPUB and Kindle. Book excerpt: This unique publication addresses the role of reliability, maintainability, and supportability in the life-cycle of a product, in the context of product effectiveness and worth. It emphasizes all aspects of producing an effective electrical or mechanical system. This is the only handbook available on this subject and the only book that is this comprehensive and informative. The Product Reliability, Maintainability, and Supportability Handbook examines the logistics, cost, and the physics of failure-topics never before found in a single volume on reliability. It describes the factors that affect product effectiveness and worth: performance, reliability, design effectiveness and margin for error, availability, affordability, use effectiveness, and logistic effectiveness. The handbook contains 13 in-depth chapters, opening with an introduction on product effectiveness and worth and concluding with reliability and maintainability data that can be combined with performance data to assess overall effectiveness of the product. The pages are filled with valuable information that can be easily and quickly put to practical use. Basic principles of the mathematical theory of probability and necessary background are provided. Concepts and basic theory of reliability in terms of probability and statistical inference are also given. Techniques for deriving probabilistic models from observational data as well as reliability models and associated validation techniques are detailed. Software and software reliability, quality, and safety are all covered, including the development life-cycle process and mechanisms by which software errors are introduced. The book presents design guidelines and techniques and the requirements for materials, manufacturing, and assembly. Learn how to analyze the reliability of redundant and fault-tolerant products. Use the methods for modeling and analyzing failures of repairable products that normally exhibit wearout characteristics. The Product Reliability, Maintainability, and Supportability Handbook also provides reliability improvement techniques to improve the competitiveness of existing products. The book includes helpful summaries and numerous problem sections to reinforce and test learned information. This reference source is the guide that professionals and technical managers should turn to when they need a comprehensive and detailed overview of everything that goes into producing systems and products that meet customer needs in an effective and timely manner.
Author : E. Beyne
Publisher : Springer Science & Business Media
ISBN 13 : 9401155062
Total Pages : 358 pages
Book Rating : 4.4/5 (11 download)
Download or read book Thermal Management of Electronic Systems II written by E. Beyne and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt: For the second time, the Eurotherm Committee has chosen Thermal Managment of Electronic Systems as the subject for its 45th Seminar, held at IMEC in Leuven, Belgium, from 20 to 22 September 1995. After the successfui first edition of this seminar in Delft, June 14-16, 1993, it was decided to repeat this event on a two year basis. This volume constitutes the edited proceedings of the Seminar. Thermal management of electronic systems is gaining importance. Whereas a few years ago papers on this subject where mainly devoted to applications in high end markets, such as mainframes and telecommunication switching equipment, we see a growing importance in the "lower" end applications. This may be understood from the growing impact of electronics on every day life, from car electronics, GSM phones, personal computers to electronic games. These applications add new requirements to the thermal design. The thermal problem and the applicable cooling strategies are quite different from those in high end products. In this seminar the latest developments in many of the different aspects of the thermal design of electronic systems were discussed. Particular attention was given to thermal modelling, experimental characterisation and the impact of thermal design on the reliability of electronic systems.
Author : Yufeng Jin
Publisher : CRC Press
ISBN 13 : 1439865973
Total Pages : 232 pages
Book Rating : 4.4/5 (398 download)
Download or read book Introduction to Microsystem Packaging Technology written by Yufeng Jin and published by CRC Press. This book was released on 2017-12-19 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt: The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.
