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Wafer Scale Integration

Author : Earl E. Swartzlander Jr.
Publisher : Springer Science & Business Media
ISBN 13 : 1461316219
Total Pages : 515 pages
Book Rating : 4.4/5 (613 download)

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Book Synopsis Wafer Scale Integration by : Earl E. Swartzlander Jr.

Download or read book Wafer Scale Integration written by Earl E. Swartzlander Jr. and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 515 pages. Available in PDF, EPUB and Kindle. Book excerpt: Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In VLSI chips are developed by fabricating a wafer with hundreds of identical circuits, testing the circuits, dicing the wafer, and packaging the good dice. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer. Since most signal lines stay on the wafer, stray capacitance is low, so that high speeds are achieved with low power consumption. For the same technology a WSI implementation may be a factor of five faster, dissipate a factor of ten less power, and require one hundredth to one thousandth the volume. Successful development of WSI involves many overlapping disciplines, ranging from architecture to test design to fabrication (including laser linking and cutting, multiple levels of interconnection, and packaging). This book concentrates on the areas that are unique to WSI and that are as a result not well covered by any of the many books on VLSI design. A unique aspect of WSI is that the finished circuits are so large that there will be defects in some portions of the circuit. Accordingly much attention must be devoted to designing architectures that facilitate fault detection and reconfiguration to of WSI include fabrication circumvent the faults. Other unique aspects technology and packaging.

Seventh Annual IEEE International Conference on Wafer Scale Integration, San Francisco, California, USA

Author : Glenn Chapman
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 :
Total Pages : 400 pages
Book Rating : 4.:/5 (318 download)

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Book Synopsis Seventh Annual IEEE International Conference on Wafer Scale Integration, San Francisco, California, USA by : Glenn Chapman

Download or read book Seventh Annual IEEE International Conference on Wafer Scale Integration, San Francisco, California, USA written by Glenn Chapman and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1995 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Electronic Materials Handbook

Author :
Publisher : ASM International
ISBN 13 : 9780871702852
Total Pages : 1234 pages
Book Rating : 4.7/5 (28 download)

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Book Synopsis Electronic Materials Handbook by :

Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.

Computer Arithmetic

Author : Earl E Swartzlander
Publisher : World Scientific
ISBN 13 : 9814641480
Total Pages : 486 pages
Book Rating : 4.8/5 (146 download)

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Book Synopsis Computer Arithmetic by : Earl E Swartzlander

Download or read book Computer Arithmetic written by Earl E Swartzlander and published by World Scientific. This book was released on 2015-03-17 with total page 486 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the new edition of the classic book Computer Arithmetic in three volumes published originally in 1990 by IEEE Computer Society Press. As in the original, the book contains many classic papers treating advanced concepts in computer arithmetic, which is very suitable as stand-alone textbooks or complementary materials to textbooks on computer arithmetic for graduate students and research professionals interested in the field. Told in the words of the initial developers, this book conveys the excitement of the creators, and the implementations provide insight into the details necessary to realize real chips. This second volume presents topics on error tolerant arithmetic, digit on-line arithmetic, number systems, and now in this new edition, a topic on implementations of arithmetic operations, all wrapped with an updated overview and a new introduction for each chapter. This volume is part of a 3 volume set: Computer Arithmetic Volume I Computer Arithmetic Volume II Computer Arithmetic Volume III The full set is available for sale in a print-only version. Contents:Error Tolerant ArithmeticOn-Line ArithmeticVLSI Adder ImplementationsVLSI Multiplier ImplementationsFloating-Point VLSI ChipsNumber RepresentationImplementations Readership: Graduate students and research professionals interested in computer arithmetic. Key Features:It reprints the classic papersIt covers advanced arithmetic operationsIt does this in the words of the original creatorsKeywords:Computer Arithmetic;Fault Tolerant;Arithmetic;On-Line Arithmetic;Adder Implementations;Multiplier Implementations;Floating Point Chips;Number Representation;Implementations

Dependable Computing - EDCC-1

Author : Klaus Echtle
Publisher : Springer Science & Business Media
ISBN 13 : 9783540584261
Total Pages : 642 pages
Book Rating : 4.5/5 (842 download)

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Book Synopsis Dependable Computing - EDCC-1 by : Klaus Echtle

Download or read book Dependable Computing - EDCC-1 written by Klaus Echtle and published by Springer Science & Business Media. This book was released on 1994-09-21 with total page 642 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the proceedings of the First European Dependable Computing Conference (EDCC-1), held in Berlin, Germany, in October 1994. EDCC is the merger of two former European events on dependable computing. The volume comprises 34 refereed full papers selected from 106 submissions. The contributions address all current aspects of dependable computing and reflect the state of the art in dependable systems research and advanced applications; among the topics covered are hardware and software reliability, safety-critical and secure systems, fault-tolerance and detection, verification and validation, formal methods, hardware and software testing, and parallel and distributed systems.

Soft Configurable Wafer Scale Integration

Author : M. G. Blatt
Publisher :
ISBN 13 :
Total Pages : 258 pages
Book Rating : 4.F/5 ( download)

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Book Synopsis Soft Configurable Wafer Scale Integration by : M. G. Blatt

Download or read book Soft Configurable Wafer Scale Integration written by M. G. Blatt and published by . This book was released on 1990 with total page 258 pages. Available in PDF, EPUB and Kindle. Book excerpt: The redundancy models constrain wafer yield by system requirements such as the minimum number of working circuit units, and whether these working units are distributed evenly around the wafer. Choice of redundancy model significantly affects the resulting wafer yield."

Integrated Circuit Manufacturability

Author : José Pineda de Gyvez
Publisher : John Wiley & Sons
ISBN 13 : 0780334477
Total Pages : 338 pages
Book Rating : 4.7/5 (83 download)

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Book Synopsis Integrated Circuit Manufacturability by : José Pineda de Gyvez

Download or read book Integrated Circuit Manufacturability written by José Pineda de Gyvez and published by John Wiley & Sons. This book was released on 1998-10-30 with total page 338 pages. Available in PDF, EPUB and Kindle. Book excerpt: "INTEGRATED CIRCUIT MANUFACTURABILITY provides comprehensive coverage of the process and design variables that determine the ease and feasibility of fabrication (or manufacturability) of contemporary VLSI systems and circuits. This book progresses from semiconductor processing to electrical design to system architecture. The material provides a theoretical background as well as case studies, examining the entire design for the manufacturing path from circuit to silicon. Each chapter includes tutorial and practical applications coverage. INTEGRATED CIRCUIT MANUFACTURABILITY illustrates the implications of manufacturability at every level of abstraction, including the effects of defects on the layout, their mapping to electrical faults, and the corresponding approaches to detect such faults. The reader will be introduced to key practical issues normally applied in industry and usually required by quality, product, and design engineering departments in today's design practices: * Yield management strategies * Effects of spot defects * Inductive fault analysis and testing * Fault-tolerant architectures and MCM testing strategies. This book will serve design and product engineers both from academia and industry. It can also be used as a reference or textbook for introductory graduate-level courses on manufacturing."

Parallel Computer Routing and Communication

Author : Kevin Bolding
Publisher : Springer Science & Business Media
ISBN 13 : 9783540584292
Total Pages : 340 pages
Book Rating : 4.5/5 (842 download)

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Book Synopsis Parallel Computer Routing and Communication by : Kevin Bolding

Download or read book Parallel Computer Routing and Communication written by Kevin Bolding and published by Springer Science & Business Media. This book was released on 1994-09-28 with total page 340 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume contains revised versions of the 23 regular papers presented at the First International Workshop on Parallel Computer Routing and Communication (PCRCW '94), held in Seattle, Washington in May 1994. Routing for parallel computer communication has recently experienced almost explosive activity: ever increasing processor speeds are placing greater demands on interprocessor communication, while technological advances offer new capabilities to respond to those demands. The contributions from industry and academia cover all areas, from details of hardware design to proofs of theoretical results. There are also many papers dealing with the performance of various adaptive routing schemes, new network topologies, network interfaces, and fault-tolerant issues.

Advances in Embedded and Fan-Out Wafer Level Packaging Technologies

Author : Beth Keser
Publisher : John Wiley & Sons
ISBN 13 : 111931397X
Total Pages : 580 pages
Book Rating : 4.1/5 (193 download)

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Book Synopsis Advances in Embedded and Fan-Out Wafer Level Packaging Technologies by : Beth Keser

Download or read book Advances in Embedded and Fan-Out Wafer Level Packaging Technologies written by Beth Keser and published by John Wiley & Sons. This book was released on 2019-02-20 with total page 580 pages. Available in PDF, EPUB and Kindle. Book excerpt: Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.

Physical Design for 3D Integrated Circuits

Author : Aida Todri-Sanial
Publisher : CRC Press
ISBN 13 : 1351830198
Total Pages : 409 pages
Book Rating : 4.3/5 (518 download)

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Book Synopsis Physical Design for 3D Integrated Circuits by : Aida Todri-Sanial

Download or read book Physical Design for 3D Integrated Circuits written by Aida Todri-Sanial and published by CRC Press. This book was released on 2017-12-19 with total page 409 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.

Defect and Fault Tolerance in VLSI Systems

Author : Israel Koren
Publisher : Springer Science & Business Media
ISBN 13 : 1461567998
Total Pages : 362 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Defect and Fault Tolerance in VLSI Systems by : Israel Koren

Download or read book Defect and Fault Tolerance in VLSI Systems written by Israel Koren and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 362 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains an edited selection of papers presented at the International Workshop on Defect and Fault Tolerance in VLSI Systems held October 6-7, 1988 in Springfield, Massachusetts. Our thanks go to all the contributors and especially the members of the program committee for the difficult and time-consuming work involved in selecting the papers that were presented in the workshop and reviewing the papers included in this book. Thanks are also due to the IEEE Computer Society (in particular, the Technical Committee on Fault-Tolerant Computing and the Technical Committee on VLSI) and the University of Massachusetts at Amherst for sponsoring the workshop, and to the National Science Foundation for supporting (under grant number MIP-8803418) the keynote address and the distribution of this book to all workshop attendees. The objective of the workshop was to bring t. ogether researchers and practition ers from both industry and academia in the field of defect tolerance and yield en ha. ncement in VLSI to discuss their mutual interests in defect-tolerant architectures and models for integrated circuit defects, faults, and yield. Progress in this area was slowed down by the proprietary nature of yield-related data, and by the lack of appropriate forums for disseminating such information. The goal of this workshop was therefore to provide a forum for a dialogue and exchange of views. A follow-up workshop in October 1989, with C. H. Stapper from IBM and V. K. Jain from the University of South Florida as general co-chairmen, is being organized.

Biomagnetism

Author : L. Deecke
Publisher : IOS Press
ISBN 13 : 9789051992335
Total Pages : 884 pages
Book Rating : 4.9/5 (923 download)

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Book Synopsis Biomagnetism by : L. Deecke

Download or read book Biomagnetism written by L. Deecke and published by IOS Press. This book was released on 1995 with total page 884 pages. Available in PDF, EPUB and Kindle. Book excerpt: Biomagnetism involves the investigation of bioelectric processes as reflected by their accompanying magnetic fields. These processes can be monitored in the brain, heart, peripheral nerve or gastrointestinal tract. SQUID technology can also be used for biosusceptometry in lung, liver and intestines. Biomagnetism also includes theoretical issues as encountered in the inverse problem, modelling, fundamentals, physics and mathematics of the method, technical applications and instrumentation, as well as future aspects.

Digital Signal Processing Systems: Implementation Techniques

Author :
Publisher : Elsevier
ISBN 13 : 0080529844
Total Pages : 414 pages
Book Rating : 4.0/5 (85 download)

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Book Synopsis Digital Signal Processing Systems: Implementation Techniques by :

Download or read book Digital Signal Processing Systems: Implementation Techniques written by and published by Elsevier. This book was released on 1995-06-23 with total page 414 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume on implementation techniques in digital signal processing systems clearly reveals the significance and power of the techniques that are available, and with further development, the essential role they will play as applied to a wide variety of areas. The authors are all to highly commended for their splendid contributors to this volume, which will provide a significant and unique international reference source for students, research workers, practicing engineers, and others for years to come.

Cities and Their Vital Systems

Author : Advisory Committee on Technology and Society
Publisher : National Academies Press
ISBN 13 : 9780309037860
Total Pages : 1298 pages
Book Rating : 4.0/5 (378 download)

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Book Synopsis Cities and Their Vital Systems by : Advisory Committee on Technology and Society

Download or read book Cities and Their Vital Systems written by Advisory Committee on Technology and Society and published by National Academies Press. This book was released on 1989 with total page 1298 pages. Available in PDF, EPUB and Kindle. Book excerpt: Cities and Their Vital Systems asks basic questions about the longevity, utility, and nature of urban infrastructures; analyzes how they grow, interact, and change; and asks how, when, and at what cost they should be replaced. Among the topics discussed are problems arising from increasing air travel and airport congestion; the adequacy of water supplies and waste treatment; the impact of new technologies on construction; urban real estate values; and the field of "telematics," the combination of computers and telecommunications that makes money machines and national newspapers possible.

From LED to Solid State Lighting

Author : S. W. Ricky Lee
Publisher : John Wiley & Sons
ISBN 13 : 1118881559
Total Pages : 256 pages
Book Rating : 4.1/5 (188 download)

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Book Synopsis From LED to Solid State Lighting by : S. W. Ricky Lee

Download or read book From LED to Solid State Lighting written by S. W. Ricky Lee and published by John Wiley & Sons. This book was released on 2021-09-17 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt: FROM LED TO SOLID STATE LIGHTING A comprehensive and practical reference complete with hands-on exercises and experimental data In From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features. Readers will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. They’ll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material. This important book also includes: Thorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chips Practical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterization Comprehensive explorations of board-level assembly and LED modules and optical and electrical characterization In-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting Perfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject.

INNC 90 PARIS

Author : The International Neural Society(INNS), The IEEE Neural
Publisher : Springer Science & Business Media
ISBN 13 : 9400906439
Total Pages : 569 pages
Book Rating : 4.4/5 (9 download)

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Book Synopsis INNC 90 PARIS by : The International Neural Society(INNS), The IEEE Neural

Download or read book INNC 90 PARIS written by The International Neural Society(INNS), The IEEE Neural and published by Springer Science & Business Media. This book was released on 2013-12-18 with total page 569 pages. Available in PDF, EPUB and Kindle. Book excerpt: Neural Networks have been the theater of a dramatic increase of activities in the last five years. The interest of mixing results from fields as different as neurobiology, physics (spin glass theory), mathematics (linear algebra, statistics ... ), computer science (software engineering, hardware architectures ... ) or psychology has attracted a large number of researchers to the field. The perspective of dramatic improvements in many applications has lead important companies to launch new neural network programs and start-ups have mushroomed to address this new market. Throughout the world large programs are being set-up: in Japan the government has committed more than $18 million per year to its 20 year Human Frontier Science program; the DARPA and the US Navy have alloted more than $10 million per year each and other US government agencies are contributing to important but less ambitious programs. Neural networks are also a major research are in the supercomputing initiative. Europe has from the beginning taken an active part in funding major projects in the new field with BRAIN, BRA, ANNIE and PYGMALION (Esprit). Approximately $20 million has been invested to date since 1988 and new programs of nearly $30 million are being funded for the next 3 years. National projects in certain countries may globally double these amounts. Neural network conferences are attracting larger audiences than ever before. Prior to 1987 attendance never surpassed 300. The June 1989 IJCNN conference in Washington had over 2200 participants.

Systolic Signal Processing Systems

Author : E. Swartzlander
Publisher : CRC Press
ISBN 13 : 100010351X
Total Pages : 408 pages
Book Rating : 4.0/5 (1 download)

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Book Synopsis Systolic Signal Processing Systems by : E. Swartzlander

Download or read book Systolic Signal Processing Systems written by E. Swartzlander and published by CRC Press. This book was released on 2020-10-28 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is about systolic signal processing systems: networks of signal processors with efficient data flow between the processors. It is written for students, engineers, and managers who wish a concise introduction to the key concepts and future directions of systolic processor architectures.