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Wafer Defect Inspection Optimization
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Book Synopsis Wafer Defect Inspection Optimization by : Zhongshun Shi
Download or read book Wafer Defect Inspection Optimization written by Zhongshun Shi and published by . This book was released on 2019 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: The prevalence of electronic devices has propelled the tremendous growth of the semiconductor industry in the past half century. The manufacturing of semiconductor wafers is a long and delicate process, where defect points may occur and cause the failure of the entire circuit. As more advanced devices introduce tiny and harder-to-detect defects, improvements in wafer defect inspection technologies are highly desired by the industry. One promising direction is to optimize the positioning of inspection regions for the e-beam inspection tool, so as to cover all suspect defect points on a target area of a wafer while maximizing the throughput of the scan. To this end, we formulate this defect inspection optimization problem (DIOP) as a mixed integer linear programming (MILP) model, and enhance the formulation using variable reduction. To address the computational challenge of solving large-scale DIOP instances, we further propose three approximation methods with theoretical bounds, namely, a constant-factor approximation algorithm that provides heuristic solutions quickly, a polynomial-time approximation scheme (PTAS) that has a strong performance guarantee, and an MILP-based hybrid method that combines the PTAS framework and MILP formulation and is suitable for parallel computing by design. Numerical experiments on synthetic and industry instances show the efficiency and effectiveness of the proposed methods. Particularly, for large-scale instances, the hybrid algorithm is capable of generating near-optimal solutions with theoretical guarantees within practically acceptable computational time.
Book Synopsis Modeling of Defect Propagation/growth for In-line Defect Inspection Optimization in VLSI Fabrication by : Xiaolei Li
Download or read book Modeling of Defect Propagation/growth for In-line Defect Inspection Optimization in VLSI Fabrication written by Xiaolei Li and published by . This book was released on 1997 with total page 4 pages. Available in PDF, EPUB and Kindle. Book excerpt: Abstract: "Particulate contamination deposited on silicon wafers is typically the dominant reason for yield loss in VLSI manufacturing. The transformation of contaminating particles into defects and then electrical faults is a very complex process which depends on the defect location, size, material and the underlying IC topography. A rigorous 2D topography simulator, METROPOLE, has been developed to allow the prediction and correlation of the critical physical parameters (material, size and location) of contamination in the manufacturing process to device defects. The results for a large number of defect samples simulated using the above approach were compared with data gathered from the AMD-Sunnyvale fabline. A good match was obtained indicating the accuracy of this method which provided a framework for developing contamination to defect propagation/growth macromodels. We have demonstrated that the understanding of defect transformation can be applied to optimizing wafer inspection sampling strategy."
Book Synopsis Variation Reduction in a Wafer Fabrication Line Through Inspection Optimization by : John Wellard Bean
Download or read book Variation Reduction in a Wafer Fabrication Line Through Inspection Optimization written by John Wellard Bean and published by . This book was released on 1997 with total page 52 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Simulation of Defect Detection Schemes for Wafer Inspection in VLSI Manufacturing by : Aaron Swecker
Download or read book Simulation of Defect Detection Schemes for Wafer Inspection in VLSI Manufacturing written by Aaron Swecker and published by . This book was released on 1997 with total page 4 pages. Available in PDF, EPUB and Kindle. Book excerpt: Abstract: "The detection of critical defects on modern VLSI wafers is a challenging and complex problem. Simulation of these critical defects allows for rapid characterization and optimization of in-line detection schemes. In this paper we introduce a 3-D electromagnetic field simulator (METRO 3-D) that calculates the scattering of light from wafer topographies. An approach that allows highly absorptive materials to be investigated is discussed for the three dimensional topography simulator. With this enhancement to the simulator, several defect studies were performed and the results of these studies illustrate the ability of the simulator to model wafer topographies and defects that occur in modern fab lines."
Book Synopsis Design Optimization and Structural Analysis of a 3D Abbe Error-free Wafer Inspection Stage by : 郭彥佐
Download or read book Design Optimization and Structural Analysis of a 3D Abbe Error-free Wafer Inspection Stage written by 郭彥佐 and published by . This book was released on 2019 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Variational and Optimal Control Problems on Unbounded Domains by : Gershon Wolansky
Download or read book Variational and Optimal Control Problems on Unbounded Domains written by Gershon Wolansky and published by American Mathematical Soc.. This book was released on 2014-07-01 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume contains the proceedings of the workshop on Variational and Optimal Control Problems on Unbounded Domains, held in memory of Arie Leizarowitz, from January 9-12, 2012, in Haifa, Israel. The workshop brought together a select group of worldwide experts in optimal control theory and the calculus of variations, working on problems on unbounded domains. The papers in this volume cover many different areas of optimal control and its applications. Topics include needle variations in infinite-horizon optimal control, Lyapunov stability with some extensions, small noise large time asymptotics for the normalized Feynman-Kac semigroup, linear-quadratic optimal control problems with state delays, time-optimal control of wafer stage positioning, second order optimality conditions in optimal control, state and time transformations of infinite horizon problems, turnpike properties of dynamic zero-sum games, and an infinite-horizon variational problem on an infinite strip. This book is co-published with Bar-Ilan University (Ramat-Gan, Israel).
Book Synopsis Metrology, Inspection, and Process Control for Microlithography by :
Download or read book Metrology, Inspection, and Process Control for Microlithography written by and published by . This book was released on 2001 with total page 914 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis In-line Characterization Techniques for Performance and Yield Enhancement in Microelectronic Manufacturing II by : Sergio Ajuria
Download or read book In-line Characterization Techniques for Performance and Yield Enhancement in Microelectronic Manufacturing II written by Sergio Ajuria and published by SPIE-International Society for Optical Engineering. This book was released on 1998 with total page 258 pages. Available in PDF, EPUB and Kindle. Book excerpt: A collection of papers on in-line characterization techniques for performance and yield enhancement in microelectronic manufacturing. They cover: electrical/field emission techniques; optical and em-wave techniques; and surface photovoltage techniques.
Book Synopsis In-line Characterization Techniques for Performance and Yield Enhancement in Microelectronic Manufacturing by :
Download or read book In-line Characterization Techniques for Performance and Yield Enhancement in Microelectronic Manufacturing written by and published by . This book was released on 1998 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :Davies William de Lima Monteiro Publisher :The Electrochemical Society ISBN 13 :1566777372 Total Pages :639 pages Book Rating :4.5/5 (667 download)
Book Synopsis Microelectronics Technology and Devices - SBMicro 2009 by : Davies William de Lima Monteiro
Download or read book Microelectronics Technology and Devices - SBMicro 2009 written by Davies William de Lima Monteiro and published by The Electrochemical Society. This book was released on 2009-08 with total page 639 pages. Available in PDF, EPUB and Kindle. Book excerpt: This issue of ECS Transactions features eight invited and sixty-seven regular papers on technology, devices, systems, optoelectronics, modeling and characterization; all either directly or indirectly related to microelectronics. The topics presented herein reveal the multidisciplinary character of this field, which definitely incites the highly cooperative trace of human nature.
Author :Bernd O. Kolbesen (Chemiker.) Publisher :The Electrochemical Society ISBN 13 :9781566772396 Total Pages :568 pages Book Rating :4.7/5 (723 download)
Book Synopsis Analytical and Diagnostic Techniques for Semiconductor Materials, Devices and Processes by : Bernd O. Kolbesen (Chemiker.)
Download or read book Analytical and Diagnostic Techniques for Semiconductor Materials, Devices and Processes written by Bernd O. Kolbesen (Chemiker.) and published by The Electrochemical Society. This book was released on 1999 with total page 568 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Handbook of Thin Film Deposition by : Krishna Seshan
Download or read book Handbook of Thin Film Deposition written by Krishna Seshan and published by William Andrew. This book was released on 2001-02-01 with total page 659 pages. Available in PDF, EPUB and Kindle. Book excerpt: New second edition of the popular book on deposition (first edition by Klaus Schruegraf) for engineers, technicians, and plant personnel in the semiconductor and related industries. This book traces the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition. The book includes much cutting-edge material. Entirely new chapters on contamination and contamination control describe the basics and the issues—as feature sizes shrink to sub-micron dimensions, cleanliness and particle elimination has to keep pace. A new chapter on metrology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together all the physical vapor deposition techniques.Two entirely new areas receive full treatment: chemical mechanical polishing which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.
Book Synopsis Plasma Etching Processes for Sub-quarter Micron Devices by : G. S. Mathad
Download or read book Plasma Etching Processes for Sub-quarter Micron Devices written by G. S. Mathad and published by The Electrochemical Society. This book was released on 2000 with total page 396 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Crystalline Defects and Contamination by : Bernd O. Kolbesen
Download or read book Crystalline Defects and Contamination written by Bernd O. Kolbesen and published by The Electrochemical Society. This book was released on 2005 with total page 202 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Handbook of Silicon Wafer Cleaning Technology by : Karen Reinhardt
Download or read book Handbook of Silicon Wafer Cleaning Technology written by Karen Reinhardt and published by William Andrew. This book was released on 2018-03-16 with total page 794 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Silicon Wafer Cleaning Technology, Third Edition, provides an in-depth discussion of cleaning, etching and surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet and plasma processing are reviewed, including surface and colloidal aspects. This revised edition includes the developments of the last ten years to accommodate a continually involving industry, addressing new technologies and materials, such as germanium and III-V compound semiconductors, and reviewing the various techniques and methods for cleaning and surface conditioning. Chapters include numerous examples of cleaning technique and their results. The book helps the reader understand the process they are using for their cleaning application and why the selected process works. For example, discussion of the mechanism and physics of contamination, metal, particle and organic includes information on particle removal, metal passivation, hydrogen-terminated silicon and other processes that engineers experience in their working environment. In addition, the handbook assists the reader in understanding analytical methods for evaluating contamination. The book is arranged in an order that segments the various cleaning techniques, aqueous and dry processing. Sections include theory, chemistry and physics first, then go into detail for the various methods of cleaning, specifically particle removal and metal removal, amongst others. - Focuses on cleaning techniques including wet, plasma and other surface conditioning techniques used to manufacture integrated circuits - Reliable reference for anyone that manufactures integrated circuits or supplies the semiconductor and microelectronics industries - Covers processes and equipment, as well as new materials and changes required for the surface conditioning process
Book Synopsis Istc/cstic 2009 (cistc) by : David Huang
Download or read book Istc/cstic 2009 (cistc) written by David Huang and published by The Electrochemical Society. This book was released on 2009-03 with total page 1124 pages. Available in PDF, EPUB and Kindle. Book excerpt: ISTC/CSTIC is an annual semiconductor technology conference covering all the aspects of semiconductor technology and manufacturing, including devices, design, lithography, integration, materials, processes, manufacturing as well as emerging semiconductor technologies and silicon material applications. ISTC/CSTIC 2009 was merged by ISTC (International Semiconductor Technology Conference) and CSTIC (China Semiconductor Technology International Conference), the two industry leading technical conferences in China, and consisted of one plenary session and nine technical symposia. This issue of ECS Transactions contains 159 papers from the conference.
Book Synopsis Fabless Semiconductor Manufacturing by : Chinmay K. Maiti
Download or read book Fabless Semiconductor Manufacturing written by Chinmay K. Maiti and published by CRC Press. This book was released on 2022-11-17 with total page 314 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book deals with 3D nanodevices such as nanowire and nanosheet transistors at 7 nm and smaller technology nodes. It discusses technology computer-aided design (TCAD) simulations of stress- and strain-engineered advanced semiconductor devices, including III-nitride and RF FDSOI CMOS, for flexible and stretchable electronics. The book focuses on how to set up 3D TCAD simulation tools, from mask layout to process and device simulation, including fabless intelligent manufacturing. The simulation examples chosen are from the most popular devices in use today and provide useful technology and device physics insights. In order to extend the role of TCAD in the More-than-Moore era, the design issues related to strain engineering for flexible and stretchable electronics have been introduced for the first time.
