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Vlsi Metallization
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Book Synopsis VLSI Metallization by : Norman G. Einspruch
Download or read book VLSI Metallization written by Norman G. Einspruch and published by Academic Press. This book was released on 2014-12-01 with total page 491 pages. Available in PDF, EPUB and Kindle. Book excerpt: VLSI Electronics Microstructure Science, Volume 15: VLSI Metallization discusses the various issues and problems related to VLSI metallization. It details the available solutions and presents emerging trends. This volume is comprised of 10 chapters. The two introductory chapters, Chapter 1 and 2 serve as general references for the electrical and metallurgical properties of thin conducting films. Subsequent chapters review the various aspects of VLSI metallization. The order of presentation has been chosen to follow the common processing sequence. In Chapter 3, some relevant metal deposition techniques are discussed. Chapter 4 presents the methods of VLSI lithography and etching. Conducting films are first deposited at the gate definition step; therefore, the issues related to gate metallization are discussed next in Chapter 5.In Chapter 6, contact metallization is elaborated, and Chapter 7 is devoted to multilevel metallization schemes. Long-time reliability is the subject of Chapter 8, which discusses the issues of contact and interconnect electromigration. GaAs metallization is tackled in Chapter 9. The volume concludes with a general discussion of the functions of interconnect systems in VLSI. Materials scientists, processing and design engineers, and device physicists will find the book very useful.
Book Synopsis VLSI Metallization by : Krishna Shenai
Download or read book VLSI Metallization written by Krishna Shenai and published by Artech House Publishers. This book was released on 1991 with total page 548 pages. Available in PDF, EPUB and Kindle. Book excerpt: This comprehensive collection of reprinted articles presents the most important developments on VLSI contact and interconnect technologies and applications. The book covers important developments in metallization of compound semiconductor technologies, and includes a section on metallization reliability and high speed testing.
Book Synopsis VLSI Electronics: VLSI metallization by : Norman G. Einspruch
Download or read book VLSI Electronics: VLSI metallization written by Norman G. Einspruch and published by . This book was released on 1981 with total page 506 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings of the Symposium on Multilevel Metallization, Interconnection, and Contact Technologies by : L. B. Rothman
Download or read book Proceedings of the Symposium on Multilevel Metallization, Interconnection, and Contact Technologies written by L. B. Rothman and published by . This book was released on 1987 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Metal-semiconductor Interfaces by : Akio Hiraki
Download or read book Metal-semiconductor Interfaces written by Akio Hiraki and published by IOS Press. This book was released on 1995 with total page 422 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Multi-Net Optimization of VLSI Interconnect by : Konstantin Moiseev
Download or read book Multi-Net Optimization of VLSI Interconnect written by Konstantin Moiseev and published by Springer. This book was released on 2014-11-07 with total page 245 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers layout design and layout migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects. Scaling-dependent models for interconnect power, interconnect delay and crosstalk noise are covered in depth, and several design optimization problems are addressed, such as minimization of interconnect power under delay constraints, or design for minimal delay in wire bundles within a given routing area. A handy reference or a guide for design methodologies and layout automation techniques, this book provides a foundation for physical design challenges of interconnect in advanced integrated circuits.
Book Synopsis Integrated Circuit Fabrication by : Shubham Kumar
Download or read book Integrated Circuit Fabrication written by Shubham Kumar and published by CRC Press. This book was released on 2021-04-28 with total page 353 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers theoretical and practical aspects of all major steps in the fabrication sequence. This book can be used conveniently in a semester length course on integrated circuit fabrication. This text can also serve as a reference for practicing engineer and scientist in the semiconductor industry. IC Fabrication are ever demanding of technology in rapidly growing industry growth opportunities are numerous. A recent survey shows that integrated circuit currently outnumber humans in UK, USA, India and China. The spectacular advances in the development and application of integrated circuit technology have led to the emergence of microelectronic process engineering as an independent discipline. Integrated circuit fabrication text books typically divide the fabrication sequence into a number of unit processes that are repeated to form the integrated circuit. The effect is to give the book an analysis flavor: a number of loosely related topics each with its own background material. Note: T& F does not sell or distribute the Hardback in India, Pakistan, Nepal, Bhutan, Bangladesh and Sri Lanka.
Book Synopsis Metal – Semiconductor Contacts and Devices by : Simon S. Cohen
Download or read book Metal – Semiconductor Contacts and Devices written by Simon S. Cohen and published by Academic Press. This book was released on 2014-12-01 with total page 435 pages. Available in PDF, EPUB and Kindle. Book excerpt: VLSI Electronics Microstructure Science, Volume 13: Metal-Semiconductor Contacts and Devices presents the physics, technology, and applications of metal-semiconductor barriers in digital integrated circuits. The emphasis is placed on the interplay among the theory, processing, and characterization techniques in the development of practical metal-semiconductor contacts and devices. This volume contains chapters that are devoted to the discussion of the physics of metal-semiconductor interfaces and its basic phenomena; fabrication procedures; and interface characterization techniques, particularly, ohmic contacts. Contacts that involve polycrystalline silicon; applications of the metal-semiconductor barriers in MOS, bipolar, and MESFET digital integrated circuits; and methods for measuring the barrier height are covered as well. Process engineers, device physicists, circuit designers, and students of this discipline will find the book very useful.
Download or read book VLSI Technology written by Yasuo Tarui and published by Springer Science & Business Media. This book was released on 2013-03-12 with total page 464 pages. Available in PDF, EPUB and Kindle. Book excerpt: The origin of the development of integrated circuits up to VLSI is found in the invention of the transistor, which made it possible to achieve the ac tion of a vacuum tube in a semiconducting solid. The structure of the tran sistor can be constructed by a manufacturing technique such as the intro duction of a small amount of an impurity into a semiconductor and, in ad dition, most transistor characteristics can be improved by a reduction of dimensions. These are all important factors in the development. Actually, the microfabrication of the integrated circuit can be used for two purposes, namely to increase the integration density and to obtain an improved perfor mance, e. g. a high speed. When one of these two aims is pursued, the result generally satisfies both. We use the Engl ish translation "very large scale integration (VLSIl" for "Cho LSI" in Japanese. In the United States of America, however, similar technology is bei ng developed under the name "very hi gh speed integrated circuits (VHSIl". This also originated from the nature of the integrated circuit which satisfies both purposes. Fortunately, the Japanese word "Cho LSI" has a wider meani ng than VLSI, so it can be used ina broader area. However, VLSI has a larger industrial effect than VHSI.
Book Synopsis High-Speed VLSI Interconnections by : Ashok K. Goel
Download or read book High-Speed VLSI Interconnections written by Ashok K. Goel and published by John Wiley & Sons. This book was released on 2007-10-19 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.
Book Synopsis Integrated Circuit Quality and Reliability by : Eugene R. Hnatek
Download or read book Integrated Circuit Quality and Reliability written by Eugene R. Hnatek and published by CRC Press. This book was released on 2018-10-03 with total page 809 pages. Available in PDF, EPUB and Kindle. Book excerpt: Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.
Book Synopsis Metallized Plastics 3 by : K.L. Mittal
Download or read book Metallized Plastics 3 written by K.L. Mittal and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 391 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume chronicles the proceedings of the Third Symposium on Metallized Plastics: Fundamental and Applied Aspects held under the auspices of the Dielectric Science and Technology Division of the Electrochemical Society in Phoenix, Arizona, October 13-18, 1991. This series of symposia to address the subject of metallized plastics was initiated in 1988 and the premier symposium was held in Chicago, October 10-12, 1988, followed by the second event in Montreal, Canada, May 7-10, 1990. The rroceedings of these two symposia have been properly documented ,2. The third symposium was a huge success like the previous two events, and all this is testimonial to the brisk interest and high tempo of R&D activity in the fie14 of metallized plastics. This further bolsters our earlier thinking that there was a conspicuous need to hold symposia on this topic on a regular basis and the fourth is planned for May 16-21, 1993 in Honolulu, Hawaii. The study of metallized plastics constitutes an important human endeavor l and as pointed out earlier there are myriad applications of metallized plastics ranging from very commonplace to exotic. Also a survey of the recent literature will reveal that both the fundamental and applied aspects of metallized plastics are being pursued with great vigor.
Book Synopsis Electrochemical Processing in ULSI Fabrication and Semiconductor/metal Deposition II by : Panayotis C. Andricacos
Download or read book Electrochemical Processing in ULSI Fabrication and Semiconductor/metal Deposition II written by Panayotis C. Andricacos and published by The Electrochemical Society. This book was released on 1999 with total page 418 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Chemical Vapour Deposition by : Xiu-Tian Yan
Download or read book Chemical Vapour Deposition written by Xiu-Tian Yan and published by Springer Science & Business Media. This book was released on 2010-03-23 with total page 352 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Chemical Vapour Deposition: An Integrated Engineering Design for Advanced Materials" focuses on the application of this technology to engineering coatings and, in particular, to the manufacture of high performance materials, such as fibre reinforced ceramic composite materials, for structural applications at high temperatures. This book aims to provide a thorough exploration of the design and applications of advanced materials, and their manufacture in engineering. From physical fundamentals and principles, to optimization of processing parameters and other current practices, this book is designed to guide readers through the development of both high performance materials and the design of CVD systems to manufacture such materials. "Chemical Vapour Deposition: An Integrated Engineering Design for Advanced Materials" introduces integrated design and manufacture of advanced materials to researchers, industrial practitioners, postgraduates and senior undergraduate students.
Book Synopsis Microelectronic Failure Analysis by :
Download or read book Microelectronic Failure Analysis written by and published by ASM International. This book was released on 2002-01-01 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides new or expanded coverage on the latest techniques for microelectronic failure analysis. The CD-ROM includes the complete content of the book in fully searchable Adobe Acrobat format. Developed by the Electronic Device Failure Analysis Society (EDFAS) Publications Committee
Download or read book Metallization written by S. P. Murarka and published by Butterworth-Heinemann. This book was released on 1993 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt: This title covers fundemental concepts, properties and applicabilities of metals and alloys for use in various metallization schemes. Metallizations form the key components on electronic circuits - controlling device properties and providing power and device interconnections with the outside world or with other devices. The recent advent of submicron dimensions and increasingly faster devices in the semiconductor have challenged researchers to keep metallization schemes in line with new demanding requirements.
Author :Gennady Sh Gildenblat Publisher :SPIE-International Society for Optical Engineering ISBN 13 : Total Pages :176 pages Book Rating :4.3/5 (91 download)
Book Synopsis Metallization by : Gennady Sh Gildenblat
Download or read book Metallization written by Gennady Sh Gildenblat and published by SPIE-International Society for Optical Engineering. This book was released on 1991 with total page 176 pages. Available in PDF, EPUB and Kindle. Book excerpt:
