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Variation Tolerant On Chip Interconnects
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Author :Ethiopia Enideg Nigussie Publisher :Springer Science & Business Media ISBN 13 :1461401313 Total Pages :177 pages Book Rating :4.4/5 (614 download)
Book Synopsis Variation Tolerant On-Chip Interconnects by : Ethiopia Enideg Nigussie
Download or read book Variation Tolerant On-Chip Interconnects written by Ethiopia Enideg Nigussie and published by Springer Science & Business Media. This book was released on 2011-12-02 with total page 177 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents design techniques, analysis and implementation of high performance and power efficient, variation tolerant on-chip interconnects. Given the design paradigm shift to multi-core, interconnect-centric designs and the increase in sources of variability and their impact in sub-100nm technologies, this book will be an invaluable reference for anyone concerned with the design of next generation, high-performance electronics systems.
Book Synopsis Low-Power Variation-Tolerant Design in Nanometer Silicon by : Swarup Bhunia
Download or read book Low-Power Variation-Tolerant Design in Nanometer Silicon written by Swarup Bhunia and published by Springer Science & Business Media. This book was released on 2010-11-10 with total page 444 pages. Available in PDF, EPUB and Kindle. Book excerpt: Design considerations for low-power operations and robustness with respect to variations typically impose contradictory requirements. Low-power design techniques such as voltage scaling, dual-threshold assignment and gate sizing can have large negative impact on parametric yield under process variations. This book focuses on circuit/architectural design techniques for achieving low power operation under parameter variations. We consider both logic and memory design aspects and cover modeling and analysis, as well as design methodology to achieve simultaneously low power and variation tolerance, while minimizing design overhead. This book will discuss current industrial practices and emerging challenges at future technology nodes.
Book Synopsis Interconnect Technologies for Integrated Circuits and Flexible Electronics by : Yash Agrawal
Download or read book Interconnect Technologies for Integrated Circuits and Flexible Electronics written by Yash Agrawal and published by Springer Nature. This book was released on 2023-10-17 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.
Book Synopsis Designing Network On-Chip Architectures in the Nanoscale Era by : Jose Flich
Download or read book Designing Network On-Chip Architectures in the Nanoscale Era written by Jose Flich and published by CRC Press. This book was released on 2010-12-18 with total page 515 pages. Available in PDF, EPUB and Kindle. Book excerpt: Going beyond isolated research ideas and design experiences, Designing Network On-Chip Architectures in the Nanoscale Era covers the foundations and design methods of network on-chip (NoC) technology. The contributors draw on their own lessons learned to provide strong practical guidance on various design issues.Exploring the design process of the
Book Synopsis Intelligent Computing and Applications by : Durbadal Mandal
Download or read book Intelligent Computing and Applications written by Durbadal Mandal and published by Springer. This book was released on 2015-02-23 with total page 613 pages. Available in PDF, EPUB and Kindle. Book excerpt: The idea of the 1st International Conference on Intelligent Computing and Applications (ICICA 2014) is to bring the Research Engineers, Scientists, Industrialists, Scholars and Students together from in and around the globe to present the on-going research activities and hence to encourage research interactions between universities and industries. The conference provides opportunities for the delegates to exchange new ideas, applications and experiences, to establish research relations and to find global partners for future collaboration. The proceedings covers latest progresses in the cutting-edge research on various research areas of Image, Language Processing, Computer Vision and Pattern Recognition, Machine Learning, Data Mining and Computational Life Sciences, Management of Data including Big Data and Analytics, Distributed and Mobile Systems including Grid and Cloud infrastructure, Information Security and Privacy, VLSI, Electronic Circuits, Power Systems, Antenna, Computational fluid dynamics & Heat transfer, Intelligent Manufacturing, Signal Processing, Intelligent Computing, Soft Computing, Bio-informatics, Bio Computing, Web Security, Privacy and E-Commerce, E-governance, Service Orient Architecture, Data Engineering, Open Systems, Optimization, Communications, Smart wireless and sensor Networks, Smart Antennae, Networking and Information security, Machine Learning, Mobile Computing and Applications, Industrial Automation and MES, Cloud Computing, Green IT, IT for Rural Engineering, Business Computing, Business Intelligence, ICT for Education for solving hard problems, and finally to create awareness about these domains to a wider audience of practitioners.
Book Synopsis Nanoscale Communication Networks by : Stephen F. Bush
Download or read book Nanoscale Communication Networks written by Stephen F. Bush and published by Artech House. This book was released on 2010 with total page 327 pages. Available in PDF, EPUB and Kindle. Book excerpt: A highly useful resource for professionals and students alike, this cutting-edge, first-of-its-kind book provides a thorough introduction to nanoscale communication networks. Written in a clear tutorial style, this volume covers a wide range of the most important topics in the area, from molecular communication and carbon nanotube nano-networks, to nanoscale quantum networking and the future direction of nano networks. Moreover, the book features numerous exercise problems at the end of each chapter to ensure a solid understanding of the material.
Author :Thucydides Xanthopoulos Publisher :Springer Science & Business Media ISBN 13 :1441902619 Total Pages :339 pages Book Rating :4.4/5 (419 download)
Book Synopsis Clocking in Modern VLSI Systems by : Thucydides Xanthopoulos
Download or read book Clocking in Modern VLSI Systems written by Thucydides Xanthopoulos and published by Springer Science & Business Media. This book was released on 2009-08-19 with total page 339 pages. Available in PDF, EPUB and Kindle. Book excerpt: . . . ????????????????????????????????? ????????????? ????????????,????? ???? ??????????? ???????????????????? ???. THUCYDIDIS HISTORIAE IV:108 C. Hude ed. , Teubner, Lipsiae MCMXIII ???????????,????? ??,? ????????????????? ???????????????????? ?????? ?????? ?????? ??? ????????? ??? ?’ ?????????? ??’ ?????????? ? ??????? ??? ????????????? ???????. ???????????????????:108 ???????????? ?????????????????????? ?. ?????????????. ????????????,????? It being the fashion of men, what they wish to be true to admit even upon an ungrounded hope, and what they wish not, with a magistral kind of arguing to reject. Thucydides (the Peloponnesian War Part I), IV:108 Thomas Hobbes Trans. , Sir W. Molesworth ed. In The English Works of Thomas Hobbes of Malmesbury, Vol. VIII I have been introduced to clock design very early in my professional career when I was tapped right out of school to design and implement the clock generation and distribution of the Alpha 21364 microprocessor. Traditionally, Alpha processors - hibited highly innovative clocking systems, always worthy of ISSCC/JSSC publi- tions and for a while Alpha processors were leading the industry in terms of clock performance. I had huge shoes to ?ll. Obviously, I was overwhelmed, confused and highly con?dent that I would drag the entire project down.
Book Synopsis Crosstalk in Modern On-Chip Interconnects by : B.K. Kaushik
Download or read book Crosstalk in Modern On-Chip Interconnects written by B.K. Kaushik and published by Springer. This book was released on 2016-04-06 with total page 126 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book provides accurate FDTD models for on-chip interconnects, covering most recent advancements in materials and design. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for CNT and GNR based interconnects are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR-based interconnects are also discussed in the book. The proposed models are validated with the HSPICE simulations. The book introduces the current research scenario in the modeling of on-chip interconnects. It presents the structure, properties, and characteristics of graphene based on-chip interconnects and the FDTD modeling of Cu based on-chip interconnects. The model considers the non-linear effects of CMOS driver as well as the transmission line effects of interconnect line that includes coupling capacitance and mutual inductance effects. In a more realistic manner, the proposed model includes the effect of width-dependent MFP of the MLGNR while taking into account the edge roughness.
Book Synopsis Analysis and Design of Networks-on-Chip Under High Process Variation by : Rabab Ezz-Eldin
Download or read book Analysis and Design of Networks-on-Chip Under High Process Variation written by Rabab Ezz-Eldin and published by Springer. This book was released on 2015-12-16 with total page 156 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes in detail the impact of process variations on Network-on-Chip (NoC) performance. The authors evaluate various NoC topologies under high process variation and explain the design of efficient NoCs, with advanced technologies. The discussion includes variation in logic and interconnect, in order to evaluate the delay and throughput variation with different NoC topologies. The authors describe an asynchronous router, as a robust design to mitigate the impact of process variation in NoCs and the performance of different routing algorithms is determined with/without process variation for various traffic patterns. Additionally, a novel Process variation Delay and Congestion aware Routing algorithm (PDCR) is described for asynchronous NoC design, which outperforms different adaptive routing algorithms in the average delay and saturation throughput for various traffic patterns.
Book Synopsis Proceedings of 2nd International Conference on Intelligent Computing and Applications by : P. Deiva Sundari
Download or read book Proceedings of 2nd International Conference on Intelligent Computing and Applications written by P. Deiva Sundari and published by Springer. This book was released on 2016-10-12 with total page 677 pages. Available in PDF, EPUB and Kindle. Book excerpt: Second International Conference on Intelligent Computing and Applications was the annual research conference aimed to bring together researchers around the world to exchange research results and address open issues in all aspects of Intelligent Computing and Applications. The main objective of the second edition of the conference for the scientists, scholars, engineers and students from the academia and the industry is to present ongoing research activities and hence to foster research relations between the Universities and the Industry. The theme of the conference unified the picture of contemporary intelligent computing techniques as an integral concept that highlights the trends in computational intelligence and bridges theoretical research concepts with applications. The conference covered vital issues ranging from intelligent computing, soft computing, and communication to machine learning, industrial automation, process technology and robotics. This conference also provided variety of opportunities for the delegates to exchange ideas, applications and experiences, to establish research relations and to find global partners for future collaboration.
Book Synopsis Adoption and Optimization of Embedded and Real-Time Communication Systems by : Virtanen, Seppo
Download or read book Adoption and Optimization of Embedded and Real-Time Communication Systems written by Virtanen, Seppo and published by IGI Global. This book was released on 2013-01-31 with total page 293 pages. Available in PDF, EPUB and Kindle. Book excerpt: Adoption and Optimization of Embedded and Real-Time Communication Systems presents innovative research on the integration of embedded systems, real-time systems and the developments towards multimedia technology. This book is essential for researchers, practitioners, scientists, and IT professionals interested in expanding their knowledge of this interdisciplinary field.
Book Synopsis Asynchronous On-Chip Networks and Fault-Tolerant Techniques by : Wei Song
Download or read book Asynchronous On-Chip Networks and Fault-Tolerant Techniques written by Wei Song and published by CRC Press. This book was released on 2022-05-10 with total page 381 pages. Available in PDF, EPUB and Kindle. Book excerpt: Asynchronous On-Chip Networks and Fault-Tolerant Techniques is the first comprehensive study of fault-tolerance and fault-caused deadlock effects in asynchronous on-chip networks, aiming to overcome these drawbacks and ensure greater reliability of applications. As a promising alternative to the widely used synchronous on-chip networks for multicore processors, asynchronous on-chip networks can be vulnerable to faults even if they can deliver the same performance with much lower energy and area compared with their synchronous counterparts – faults can not only corrupt data transmission but also cause a unique type of deadlock. By adopting a new redundant code along with a dynamic fault detection and recovery scheme, the authors demonstrate that asynchronous on-chip networks can be efficiently hardened to tolerate both transient and permanent faults and overcome fault-caused deadlocks. This book will serve as an essential guide for researchers and students studying interconnection networks, fault-tolerant computing, asynchronous system design, circuit design and on-chip networking, as well as for professionals interested in designing fault-tolerant and high-throughput asynchronous circuits.
Book Synopsis Variability Tolerant Networks on Chip by : Eman Gawish
Download or read book Variability Tolerant Networks on Chip written by Eman Gawish and published by LAP Lambert Academic Publishing. This book was released on 2015-04-29 with total page 132 pages. Available in PDF, EPUB and Kindle. Book excerpt: NoC have been successfully replacing interconnects in multi-core chip. As technology scales down, process variations cause NoC links designed to be identical to have different electrical properties. We propose statistical design methodology that uses a statistical guard to tolerate variations with lower guard than conventional worst-case design. Thus saving power at low failure rate. A variability-aware NoC topology and geometry scaling, in addition to topology evaluation from variation perspective help the designer to perform scaling and choose the topology with lower variations for different technology nodes and NoC size. Finally, variability-aware routing algorithms make use of process variability link failure probability and adapt routing to reduce the NoC failure rate.
Book Synopsis Advancing Embedded Systems and Real-Time Communications with Emerging Technologies by : Virtanen, Seppo
Download or read book Advancing Embedded Systems and Real-Time Communications with Emerging Technologies written by Virtanen, Seppo and published by IGI Global. This book was released on 2014-04-30 with total page 530 pages. Available in PDF, EPUB and Kindle. Book excerpt: Embedded systems and real-time computing can be useful tools for a variety of applications. Further research developments in this field can assist in promoting the future development of these technologies for various applications. Advancing Embedded Systems and Real-Time Communications with Emerging Technologies discusses embedded systems, communication system engineering, and real-time systems in an integrated manner. This research book includes advancements in the fields of computer science, computer engineering, and telecommunication engineering in regard to how they are used in embedded and real-time systems for communications purposes. With its practical and theoretical research, this book is an essential reference for academicians, students, researchers, practitioners, and IT professionals.
Book Synopsis CMOSET 2008 Circuits and Systems Design Track Presentation Slides by : CMOS Emerging Technologies Research
Download or read book CMOSET 2008 Circuits and Systems Design Track Presentation Slides written by CMOS Emerging Technologies Research and published by CMOS Emerging Technologies. This book was released on with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Transition of HPC Towards Exascale Computing by : E.H. D'Hollander
Download or read book Transition of HPC Towards Exascale Computing written by E.H. D'Hollander and published by IOS Press. This book was released on 2013-10-22 with total page 228 pages. Available in PDF, EPUB and Kindle. Book excerpt: The US, Europe, Japan and China are racing to develop the next generation of supercomputers – exascale machines capable of 10 to the 18th power calculations a second – by 2020. But the barriers are daunting: the challenge is to change the paradigm of high-performance computing. The 2012 biennial high performance workshop, held in Cetraro, Italy in June 2012, focused on the challenges facing the computing research community to reach exascale performance in the next decade. This book presents papers from this workshop, arranged into four major topics: energy, scalability, new architectural concepts and programming of heterogeneous computing systems. Chapter 1 introduces the status of present supercomputers, which are still about two orders of magnitude separated from the exascale mark. Chapter 2 examines energy demands, a major limiting factor of today's fastest supercomputers; the quantum leap in performance required for exascale computing will require a shift in architectures and technology. In Chapter 3, scalable computer paradigms for dense linear algebra on massive heterogeneous systems are presented, and Chapter 4 discusses architectural concepts. Finally, Chapter 5 addresses the programming of heterogeneous systems. This book will be of interest to all those wishing to understand how the development of modern supercomputers is set to advance in the next decade.
Book Synopsis Direct Copper Interconnection for Advanced Semiconductor Technology by : Dongkai Shangguan
Download or read book Direct Copper Interconnection for Advanced Semiconductor Technology written by Dongkai Shangguan and published by CRC Press. This book was released on 2024-06-28 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.
