Read Books Online and Download eBooks, EPub, PDF, Mobi, Kindle, Text Full Free.
Download Thermally Aware Design full books in PDF, epub, and Kindle. Read online Thermally Aware Design ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!
Author : Yong Zhan
Publisher : Now Publishers Inc
ISBN 13 : 1601981708
Total Pages : 131 pages
Book Rating : 4.6/5 (19 download)
Download or read book Thermally-Aware Design written by Yong Zhan and published by Now Publishers Inc. This book was released on 2008 with total page 131 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides an overview of analysis and optimization techniques for thermally-aware chip design.
Author : Rainer Leupers
Publisher : Springer Science & Business Media
ISBN 13 : 1441961755
Total Pages : 343 pages
Book Rating : 4.4/5 (419 download)
Download or read book Processor and System-on-Chip Simulation written by Rainer Leupers and published by Springer Science & Business Media. This book was released on 2010-09-15 with total page 343 pages. Available in PDF, EPUB and Kindle. Book excerpt: Simulation of computer architectures has made rapid progress recently. The primary application areas are hardware/software performance estimation and optimization as well as functional and timing verification. Recent, innovative technologies such as retargetable simulator generation, dynamic binary translation, or sampling simulation have enabled widespread use of processor and system-on-chip (SoC) simulation tools in the semiconductor and embedded system industries. Simultaneously, processor and SoC simulation is still a very active research area, e.g. what amounts to higher simulation speed, flexibility, and accuracy/speed trade-offs. This book presents and discusses the principle technologies and state-of-the-art in high-level hardware architecture simulation, both at the processor and the system-on-chip level.
Author : Peter R. Lewis
Publisher : Springer
ISBN 13 : 3319396757
Total Pages : 348 pages
Book Rating : 4.3/5 (193 download)
Download or read book Self-aware Computing Systems written by Peter R. Lewis and published by Springer. This book was released on 2016-07-28 with total page 348 pages. Available in PDF, EPUB and Kindle. Book excerpt: Taking inspiration from self-awareness in humans, this book introduces the new notion of computational self-awareness as a fundamental concept for designing and operating computing systems. The basic ability of such self-aware computing systems is to collect information about their state and progress, learning and maintaining models containing knowledge that enables them to reason about their behaviour. Self-aware computing systems will have the ability to utilise this knowledge to effectively and autonomously adapt and explain their behaviour, in changing conditions. This book addresses these fundamental concepts from an engineering perspective, aiming at developing primitives for building systems and applications. It will be of value to researchers, professionals and graduate students in computer science and engineering.
Author :
Publisher : World Scientific
ISBN 13 : 9814520241
Total Pages : 1396 pages
Book Rating : 4.8/5 (145 download)
Download or read book Encyclopedia Of Thermal Packaging, Set 2: Thermal Packaging Tools (A 4-volume Set) written by and published by World Scientific. This book was released on 2014-10-23 with total page 1396 pages. Available in PDF, EPUB and Kindle. Book excerpt: Please click here for information on Set 1: Thermal Packaging Techniques Thermal and mechanical packaging -- the enabling technologies for the physical implementation of electronic systems -- are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories. Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics. Set 2: Thermal Packaging Tools The second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order “compact” thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve “correct by design” thermal packaging solutions. The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging "learning curve," the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering. Foreword Foreword (English) (42 KB) Foreword (Japanese) (342 KB) Please click here for information on Set 1: Thermal Packaging Techniques Thermal and mechanical packaging -- the enabling technologies for the physical implementation of electronic systems -- are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly e
Author : Jose L. Ayala
Publisher : Springer
ISBN 13 : 3642241549
Total Pages : 362 pages
Book Rating : 4.6/5 (422 download)
Download or read book Integrated Circuit and System Design. Power and Timing Modeling, Optimization and Simulation written by Jose L. Ayala and published by Springer. This book was released on 2011-09-25 with total page 362 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 21st International Conference on Integrated Circuit and System Design, PATMOS 2011, held in Madrid, Spain, in September 2011. The 34 revised full papers presented were carefully reviewed and selected from numerous submissions. The paper feature emerging challenges in methodologies and tools for the design of upcoming generations of integrated circuits and systems and focus especially on timing, performance and power consumption as well as architectural aspects with particular emphasis on modeling, design, characterization, analysis and optimization.
Author : Chong-Min Kyung
Publisher : Springer Science & Business Media
ISBN 13 : 9400716796
Total Pages : 295 pages
Book Rating : 4.4/5 (7 download)
Download or read book Energy-Aware System Design written by Chong-Min Kyung and published by Springer Science & Business Media. This book was released on 2011-06-17 with total page 295 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power consumption becomes the most important design goal in a wide range of electronic systems. There are two driving forces towards this trend: continuing device scaling and ever increasing demand of higher computing power. First, device scaling continues to satisfy Moore’s law via a conventional way of scaling (More Moore) and a new way of exploiting the vertical integration (More than Moore). Second, mobile and IT convergence requires more computing power on the silicon chip than ever. Cell phones are now evolving towards mobile PC. PCs and data centers are becoming commodities in house and a must in industry. Both supply enabled by device scaling and demand triggered by the convergence trend realize more computation on chip (via multi-core, integration of diverse functionalities on mobile SoCs, etc.) and finally more power consumption incurring power-related issues and constraints. Energy-Aware System Design: Algorithms and Architectures provides state-of-the-art ideas for low power design methods from circuit, architecture to software level and offers design case studies in three fast growing areas of mobile storage, biomedical and security. Important topics and features: - Describes very recent advanced issues and methods for energy-aware design at each design level from circuit and architecture to algorithm level, and also covering important blocks including low power main memory subsystem and on-chip network at architecture level - Explains efficient power conversion and delivery which is becoming important as heterogeneous power sources are adopted for digital and non-digital parts - Investigates 3D die stacking emphasizing temperature awareness for better perspective on energy efficiency - Presents three practical energy-aware design case studies; novel storage device (e.g., solid state disk), biomedical electronics (e.g., cochlear and retina implants), and wireless surveillance camera systems. Researchers and engineers in the field of hardware and software design will find this book an excellent starting point to catch up with the state-of-the-art ideas of low power design.
Author : Marta Rencz
Publisher : Springer Nature
ISBN 13 : 3030861740
Total Pages : 389 pages
Book Rating : 4.0/5 (38 download)
Download or read book Theory and Practice of Thermal Transient Testing of Electronic Components written by Marta Rencz and published by Springer Nature. This book was released on 2023-01-23 with total page 389 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed to understand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers.
Author : Clemens J.M. Lasance
Publisher : Springer Science & Business Media
ISBN 13 : 1461450918
Total Pages : 550 pages
Book Rating : 4.4/5 (614 download)
Download or read book Thermal Management for LED Applications written by Clemens J.M. Lasance and published by Springer Science & Business Media. This book was released on 2013-09-17 with total page 550 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal Management for LED Applications provides state-of-the-art information on recent developments in thermal management as it relates to LEDs and LED-based systems and their applications. Coverage begins with an overview of the basics of thermal management including thermal design for LEDs, thermal characterization and testing of LEDs, and issues related to failure mechanisms and reliability and performance in harsh environments. Advances and recent developments in thermal management round out the book with discussions on advances in TIMs (thermal interface materials) for LED applications, advances in forced convection cooling of LEDs, and advances in heat sinks for LED assemblies.
Author : Vasilis F. Pavlidis
Publisher : Newnes
ISBN 13 : 0124104843
Total Pages : 768 pages
Book Rating : 4.1/5 (241 download)
Download or read book Three-Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and published by Newnes. This book was released on 2017-07-04 with total page 768 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization
Author : Aida Todri-Sanial
Publisher : CRC Press
ISBN 13 : 1498710379
Total Pages : 397 pages
Book Rating : 4.4/5 (987 download)
Download or read book Physical Design for 3D Integrated Circuits written by Aida Todri-Sanial and published by CRC Press. This book was released on 2017-12-19 with total page 397 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Author : Dongkai Shangguan
Publisher : CRC Press
ISBN 13 : 1040028691
Total Pages : 549 pages
Book Rating : 4.0/5 (4 download)
Download or read book Direct Copper Interconnection for Advanced Semiconductor Technology written by Dongkai Shangguan and published by CRC Press. This book was released on 2024-06-28 with total page 549 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.
Author : Marilyn Wolf
Publisher : Newnes
ISBN 13 : 0124104886
Total Pages : 507 pages
Book Rating : 4.1/5 (241 download)
Download or read book High-Performance Embedded Computing written by Marilyn Wolf and published by Newnes. This book was released on 2014-03-17 with total page 507 pages. Available in PDF, EPUB and Kindle. Book excerpt: High-Performance Embedded Computing, Second Edition, combines leading-edge research with practical guidance in a variety of embedded computing topics, including real-time systems, computer architecture, and low-power design. Author Marilyn Wolf presents a comprehensive survey of the state of the art, and guides you to achieve high levels of performance from the embedded systems that bring these technologies together. The book covers CPU design, operating systems, multiprocessor programs and architectures, and much more. Embedded computing is a key component of cyber-physical systems, which combine physical devices with computational resources for control and communication. This revised edition adds new content and examples of cyber-physical systems throughout the book, including design methodologies, scheduling, and wide-area CPS to illustrate the possibilities of these new systems. Revised and updated with coverage of recently developed consumer electronics architectures and models of computing Includes new VLIW processors such as the TI Da Vinci, and CPU simulation Learn model-based verification and middleware for embedded systems Supplemental material includes lecture slides, labs, and additional resources
Author : Vassilis Paliouras
Publisher : Springer Science & Business Media
ISBN 13 : 3540290133
Total Pages : 767 pages
Book Rating : 4.5/5 (42 download)
Download or read book Integrated Circuit and System Design. Power and Timing Modeling, Optimization and Simulation written by Vassilis Paliouras and published by Springer Science & Business Media. This book was released on 2005-09-06 with total page 767 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 15th International Workshop on Power and Timing Optimization and Simulation, PATMOS 2005, held in Leuven, Belgium in September 2005. The 74 revised full papers presented were carefully reviewed and selected from numerous submissions. The papers are organized in topical sections on low-power processors, code optimization for low-power, high-level design, telecommunications and signal processing, low-power circuits, system-on-chip design, busses and interconnections, modeling, design automation, low-power techniques, memory and register files, applications, digital circuits, and analog and physical design.
Author : Kanchan Manna
Publisher : Springer Nature
ISBN 13 : 3030313107
Total Pages : 167 pages
Book Rating : 4.0/5 (33 download)
Download or read book Design and Test Strategies for 2D/3D Integration for NoC-based Multicore Architectures written by Kanchan Manna and published by Springer Nature. This book was released on 2019-12-20 with total page 167 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers various aspects of optimization in design and testing of Network-on-Chip (NoC) based multicore systems. It gives a complete account of the state-of-the-art and emerging techniques for near optimal mapping and test scheduling for NoC-based multicores. The authors describe the use of the Integer Line Programming (ILP) technique for smaller benchmarks and a Particle Swarm Optimization (PSO) to get a near optimal mapping and test schedule for bigger benchmarks. The PSO-based approach is also augmented with several innovative techniques to get the best possible solution. The tradeoff between performance (communication or test time) of the system and thermal-safety is also discussed, based on designer specifications. Provides a single-source reference to design and test for circuit and system-level approaches to (NoC) based multicore systems; Gives a complete account of the state-of-the-art and emerging techniques for near optimal mapping and test scheduling in (NoC) based multicore systems; Organizes chapters systematically and hierarchically, rather than in an ad hoc manner, covering aspects of optimization in design and testing of Network-on-Chip (NoC) based multicore systems.
Author : Arslan Munir
Publisher : John Wiley & Sons
ISBN 13 : 1119086418
Total Pages : 399 pages
Book Rating : 4.1/5 (19 download)
Download or read book Modeling and Optimization of Parallel and Distributed Embedded Systems written by Arslan Munir and published by John Wiley & Sons. This book was released on 2016-02-08 with total page 399 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book introduces the state-of-the-art in research in parallel and distributed embedded systems, which have been enabled by developments in silicon technology, micro-electro-mechanical systems (MEMS), wireless communications, computer networking, and digital electronics. These systems have diverse applications in domains including military and defense, medical, automotive, and unmanned autonomous vehicles. The emphasis of the book is on the modeling and optimization of emerging parallel and distributed embedded systems in relation to the three key design metrics of performance, power and dependability. Key features: Includes an embedded wireless sensor networks case study to help illustrate the modeling and optimization of distributed embedded systems. Provides an analysis of multi-core/many-core based embedded systems to explain the modeling and optimization of parallel embedded systems. Features an application metrics estimation model; Markov modeling for fault tolerance and analysis; and queueing theoretic modeling for performance evaluation. Discusses optimization approaches for distributed wireless sensor networks; high-performance and energy-efficient techniques at the architecture, middleware and software levels for parallel multicore-based embedded systems; and dynamic optimization methodologies. Highlights research challenges and future research directions. The book is primarily aimed at researchers in embedded systems; however, it will also serve as an invaluable reference to senior undergraduate and graduate students with an interest in embedded systems research.
Author : Ishfaq Ahmad
Publisher : CRC Press
ISBN 13 : 1482254441
Total Pages : 1284 pages
Book Rating : 4.4/5 (822 download)
Download or read book Handbook of Energy-Aware and Green Computing - Two Volume Set written by Ishfaq Ahmad and published by CRC Press. This book was released on 2016-02-03 with total page 1284 pages. Available in PDF, EPUB and Kindle. Book excerpt: Implementing energy-efficient CPUs and peripherals as well as reducing resource consumption have become emerging trends in computing. As computers increase in speed and power, their energy issues become more and more prevalent. The need to develop and promote environmentally friendly computer technologies and systems has also come to the forefront
Author : Santanu Chattopadhyay
Publisher : CRC Press
ISBN 13 : 1351227777
Total Pages : 118 pages
Book Rating : 4.3/5 (512 download)
Download or read book Thermal-Aware Testing of Digital VLSI Circuits and Systems written by Santanu Chattopadhyay and published by CRC Press. This book was released on 2018-04-24 with total page 118 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book aims to highlight the research activities in the domain of thermal-aware testing. Thermal-aware testing can be employed both at circuit level and at system level Describes range of algorithms for addressing thermal-aware test issue, presents comparison of temperature reduction with power-aware techniques and include results on benchmark circuits and systems for different techniques This book will be suitable for researchers working on power- and thermal-aware design and the testing of digital VLSI chips
