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Thermal Aware Testing Of Digital Vlsi Circuits And Systems
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Book Synopsis Thermal-Aware Testing of Digital VLSI Circuits and Systems by : Santanu Chattopadhyay
Download or read book Thermal-Aware Testing of Digital VLSI Circuits and Systems written by Santanu Chattopadhyay and published by CRC Press. This book was released on 2018-04-24 with total page 118 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book aims to highlight the research activities in the domain of thermal-aware testing. Thermal-aware testing can be employed both at circuit level and at system level Describes range of algorithms for addressing thermal-aware test issue, presents comparison of temperature reduction with power-aware techniques and include results on benchmark circuits and systems for different techniques This book will be suitable for researchers working on power- and thermal-aware design and the testing of digital VLSI chips
Book Synopsis Thermal-Aware Testing of Digital VLSI Circuits and Systems by : Santanu Chattopadhyay
Download or read book Thermal-Aware Testing of Digital VLSI Circuits and Systems written by Santanu Chattopadhyay and published by CRC Press. This book was released on 2018-04-24 with total page 94 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book aims to highlight the research activities in the domain of thermal-aware testing. Thermal-aware testing can be employed both at circuit level and at system level Describes range of algorithms for addressing thermal-aware test issue, presents comparison of temperature reduction with power-aware techniques and include results on benchmark circuits and systems for different techniques This book will be suitable for researchers working on power- and thermal-aware design and the testing of digital VLSI chips
Book Synopsis Circadian Rhythms for Future Resilient Electronic Systems by : Xinfei Guo
Download or read book Circadian Rhythms for Future Resilient Electronic Systems written by Xinfei Guo and published by Springer. This book was released on 2019-06-12 with total page 208 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes methods to address wearout/aging degradations in electronic chips and systems, caused by several physical mechanisms at the device level. The authors introduce a novel technique called accelerated active self-healing, which fixes wearout issues by enabling accelerated recovery. Coverage includes recovery theory, experimental results, implementations and applications, across multiple nodes ranging from planar, FD-SOI to FinFET, based on both foundry provided models and predictive models. Presents novel techniques, tested with experiments on real hardware; Discusses circuit and system level wearout recovery implementations, many of these designs are portable and friendly to the standard design flow; Provides circuit-architecture-system infrastructures that enable the accelerated self-healing for future resilient systems; Discusses wearout issues at both transistor and interconnect level, providing solutions that apply to both; Includes coverage of resilient aspects of emerging applications such as IoT.
Book Synopsis Design and Test Strategies for 2D/3D Integration for NoC-based Multicore Architectures by : Kanchan Manna
Download or read book Design and Test Strategies for 2D/3D Integration for NoC-based Multicore Architectures written by Kanchan Manna and published by Springer Nature. This book was released on 2019-12-20 with total page 167 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers various aspects of optimization in design and testing of Network-on-Chip (NoC) based multicore systems. It gives a complete account of the state-of-the-art and emerging techniques for near optimal mapping and test scheduling for NoC-based multicores. The authors describe the use of the Integer Line Programming (ILP) technique for smaller benchmarks and a Particle Swarm Optimization (PSO) to get a near optimal mapping and test schedule for bigger benchmarks. The PSO-based approach is also augmented with several innovative techniques to get the best possible solution. The tradeoff between performance (communication or test time) of the system and thermal-safety is also discussed, based on designer specifications. Provides a single-source reference to design and test for circuit and system-level approaches to (NoC) based multicore systems; Gives a complete account of the state-of-the-art and emerging techniques for near optimal mapping and test scheduling in (NoC) based multicore systems; Organizes chapters systematically and hierarchically, rather than in an ad hoc manner, covering aspects of optimization in design and testing of Network-on-Chip (NoC) based multicore systems.
Book Synopsis Thermally-Aware Design by : Yong Zhan
Download or read book Thermally-Aware Design written by Yong Zhan and published by Now Publishers Inc. This book was released on 2008 with total page 131 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides an overview of analysis and optimization techniques for thermally-aware chip design.
Book Synopsis Power-Aware Testing and Test Strategies for Low Power Devices by : Patrick Girard
Download or read book Power-Aware Testing and Test Strategies for Low Power Devices written by Patrick Girard and published by Springer Science & Business Media. This book was released on 2010-03-11 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: Managing the power consumption of circuits and systems is now considered one of the most important challenges for the semiconductor industry. Elaborate power management strategies, such as dynamic voltage scaling, clock gating or power gating techniques, are used today to control the power dissipation during functional operation. The usage of these strategies has various implications on manufacturing test, and power-aware test is therefore increasingly becoming a major consideration during design-for-test and test preparation for low power devices. This book explores existing solutions for power-aware test and design-for-test of conventional circuits and systems, and surveys test strategies and EDA solutions for testing low power devices.
Book Synopsis Formal Methods for Components and Objects by : Bernhard Beckert
Download or read book Formal Methods for Components and Objects written by Bernhard Beckert and published by Springer. This book was released on 2013-01-05 with total page 356 pages. Available in PDF, EPUB and Kindle. Book excerpt: Formal methods have been applied successfully to the verification of medium-sized programs in protocol and hardware design for some time. However, their application to the development of large systems requires more emphasis on specification, modeling, and validation techniques supporting the concepts of reusability and modifiability, and their implementation in new extensions of existing programming languages like Java. This book contains 20 revised papers submitted after the 10th Symposium on Formal Methods for Components and Objects, FMCO 2011, which was held in Turin, Italy, in October 2011. Topics covered include autonomic service-component ensembles; trustworthy eternal systems via evolving software, data, and knowledge; parallel patterns for adaptive heterogeneous multicore systems; programming for future 3D architectures with many cores; formal verification of object oriented software; and an infrastructure for reliable computer systems.
Book Synopsis High-Level Synthesis by : Philippe Coussy
Download or read book High-Level Synthesis written by Philippe Coussy and published by Springer Science & Business Media. This book was released on 2008-08-01 with total page 307 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents an excellent collection of contributions addressing different aspects of high-level synthesis from both industry and academia. It includes an overview of available EDA tool solutions and their applicability to design problems.
Book Synopsis Physical Design for 3D Integrated Circuits by : Aida Todri-Sanial
Download or read book Physical Design for 3D Integrated Circuits written by Aida Todri-Sanial and published by CRC Press. This book was released on 2017-12-19 with total page 397 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Book Synopsis Design and Test Technology for Dependable Systems-on-chip by : Raimund Ubar
Download or read book Design and Test Technology for Dependable Systems-on-chip written by Raimund Ubar and published by IGI Global. This book was released on 2011-01-01 with total page 550 pages. Available in PDF, EPUB and Kindle. Book excerpt: "This book covers aspects of system design and efficient modelling, and also introduces various fault models and fault mechanisms associated with digital circuits integrated into System on Chip (SoC), Multi-Processor System-on Chip (MPSoC) or Network on Chip (NoC)"--
Book Synopsis Heat Management in Integrated Circuits by : Seda Ogrenci-Memik
Download or read book Heat Management in Integrated Circuits written by Seda Ogrenci-Memik and published by IET. This book was released on 2015-12 with total page 264 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heat Management in Integrated Circuits focuses on devices and materials that are intimately integrated on-chip (as opposed to in package or on-board) for the purposes of thermal monitoring and thermal management, i.e., cooling. The devices and circuits cover various designs used for the purpose of converting temperature to a digital measurement, heat to electricity, and actively biased circuits that reverse thermal gradients on chips for the purpose of cooling. The book includes fundamental operating principles that touch upon physics of materials that are used to construct sensing, harvesting, and cooling devices, which will be followed by circuit and system design aspects that enable successful functioning of these devices as an on-chip system. Finally, the author discusses the use of these devices and systems for thermal management and the role they play in enabling energy-efficient and sustainable high performance computing systems.
Book Synopsis Thermal Issues in Testing of Advanced Systems on Chip by : Nima Aghaee Ghaleshahi
Download or read book Thermal Issues in Testing of Advanced Systems on Chip written by Nima Aghaee Ghaleshahi and published by Linköping University Electronic Press. This book was released on 2015-09-23 with total page 197 pages. Available in PDF, EPUB and Kindle. Book excerpt: Many cutting-edge computer and electronic products are powered by advanced Systems-on-Chip (SoC). Advanced SoCs encompass superb performance together with large number of functions. This is achieved by efficient integration of huge number of transistors. Such very large scale integration is enabled by a core-based design paradigm as well as deep-submicron and 3D-stacked-IC technologies. These technologies are susceptible to reliability and testing complications caused by thermal issues. Three crucial thermal issues related to temperature variations, temperature gradients, and temperature cycling are addressed in this thesis. Existing test scheduling techniques rely on temperature simulations to generate schedules that meet thermal constraints such as overheating prevention. The difference between the simulated temperatures and the actual temperatures is called temperature error. This error, for past technologies, is negligible. However, advanced SoCs experience large errors due to large process variations. Such large errors have costly consequences, such as overheating, and must be taken care of. This thesis presents an adaptive approach to generate test schedules that handle such temperature errors. Advanced SoCs manufactured as 3D stacked ICs experience large temperature gradients. Temperature gradients accelerate certain early-life defect mechanisms. These mechanisms can be artificially accelerated using gradient-based, burn-in like, operations so that the defects are detected before shipping. Moreover, temperature gradients exacerbate some delay-related defects. In order to detect such defects, testing must be performed when appropriate temperature-gradients are enforced. A schedule-based technique that enforces the temperature-gradients for burn-in like operations is proposed in this thesis. This technique is further developed to support testing for delay-related defects while appropriate gradients are enforced. The last thermal issue addressed by this thesis is related to temperature cycling. Temperature cycling test procedures are usually applied to safety-critical applications to detect cycling-related early-life failures. Such failures affect advanced SoCs, particularly through-silicon-via structures in 3D-stacked-ICs. An efficient schedule-based cycling-test technique that combines cycling acceleration with testing is proposed in this thesis. The proposed technique fits into existing 3D testing procedures and does not require temperature chambers. Therefore, the overall cycling acceleration and testing cost can be drastically reduced. All the proposed techniques have been implemented and evaluated with extensive experiments based on ITC’02 benchmarks as well as a number of 3D stacked ICs. Experiments show that the proposed techniques work effectively and reduce the costs, in particular the costs related to addressing thermal issues and early-life failures. We have also developed a fast temperature simulation technique based on a closed-form solution for the temperature equations. Experiments demonstrate that the proposed simulation technique reduces the schedule generation time by more than half.
Book Synopsis Managing Temperature Effects in Nanoscale Adaptive Systems by : David Wolpert
Download or read book Managing Temperature Effects in Nanoscale Adaptive Systems written by David Wolpert and published by Springer Science & Business Media. This book was released on 2011-08-31 with total page 192 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses new techniques for detecting, controlling, and exploiting the impacts of temperature variations on nanoscale circuits and systems. A new sensor system is described that can determine the temperature dependence as well as the operating temperature to improve system reliability. A new method is presented to control a circuit’s temperature dependence by individually tuning pull-up and pull-down networks to their temperature-insensitive operating points. This method extends the range of supply voltages that can be made temperature-insensitive, achieving insensitivity at nominal voltage for the first time.
Book Synopsis Thermal Testing of Integrated Circuits by : J. Altet
Download or read book Thermal Testing of Integrated Circuits written by J. Altet and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 212 pages. Available in PDF, EPUB and Kindle. Book excerpt: Temperature has been always considered as an appreciable magnitude to detect failures in electric systems. In this book, the authors present the feasibility of considering temperature as an observable for testing purposes, with full coverage of the state of the art.
Book Synopsis Micro and Nanoelectronics Devices, Circuits and Systems by : Trupti Ranjan Lenka
Download or read book Micro and Nanoelectronics Devices, Circuits and Systems written by Trupti Ranjan Lenka and published by Springer Nature. This book was released on 2023-10-04 with total page 519 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents select proceedings of the International Conference on Micro and Nanoelectronics Devices, Circuits and Systems (MNDCS-2023). The book includes cutting-edge research papers in the emerging fields of micro and nanoelectronics devices, circuits, and systems from experts working in these fields over the last decade. The book is a unique collection of chapters from different areas with a common theme and is immensely useful to academic researchers and practitioners in the industry who work in this field.
Book Synopsis Electrothermal Analysis of VLSI Systems by : Yi-Kan Cheng
Download or read book Electrothermal Analysis of VLSI Systems written by Yi-Kan Cheng and published by Springer Science & Business Media. This book was released on 2000-06-30 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt: This useful book addresses electrothermal problems in modern VLSI systems. It discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires. The authors present three important applications of VLSI electrothermal analysis: temperature-dependent electromigration diagnosis, cell-level thermal placement, and temperature-driven power and timing analysis.
Book Synopsis Die-stacking Architecture by : Yuan Xie
Download or read book Die-stacking Architecture written by Yuan Xie and published by Springer Nature. This book was released on 2022-05-31 with total page 113 pages. Available in PDF, EPUB and Kindle. Book excerpt: The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.
