Thermal and Photochemical Vapor Deposition of Aluminum Nitride and Gallium Nitride

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Total Pages : 244 pages
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Book Synopsis Thermal and Photochemical Vapor Deposition of Aluminum Nitride and Gallium Nitride by : James Jamil Alwan

Download or read book Thermal and Photochemical Vapor Deposition of Aluminum Nitride and Gallium Nitride written by James Jamil Alwan and published by . This book was released on 1994 with total page 244 pages. Available in PDF, EPUB and Kindle. Book excerpt: Currently, the optical spectrum of the III-V compound semiconductors has been largely confined, with a few notable exceptions, to the visible red-orange to infrared portion of the electromagnetic spectrum ($sim$650 nm to $sim$1550 nm). The AlGaN material system may be able to extend this range to the visible green, blue and even ultraviolet regions. The current status of work on the column III-nitride system of compound semiconductors is reviewed with special attention given to the material challenges presently limiting sophisticated device development. Furthermore, the organometallic vapor phase epitaxy (OMVPE) method of growing these materials is discussed in detail in terms of process physics and reactor design and operation. Fundamental characteristics of the OMVPE growth of AlN and GaN on sapphire substrates at low temperatures and pressures are presented. The precursor adsorption and nucleation behavior was investigated. A model of dissociative adsorption is developed to explain the observed trends. The use of thin AlN buffer layers to improve nucleation and crystallinity of GaN layers is presented and discussed. The OMVPE growth of these materials was further investigated via the introduction of UV radiation to the chamber during growth. The results of growth under such conditions are presented and discussed. A model of ammonia photolysis is developed and presented, which describes the photochemical growth effects observed and suggests a mechanism of nitrogen incorporation in thermal OMVPE growth of AlN and GaN.

THE LOW-TEMPERATURE THERMAL CHEMICAL VAPOR DEPOSITION AND CATALYZED CHEMICAL VAPOR DEPOSITION OF ALUMINUM NITRIDE AND SILICON NITRIDE (CHEMICAL VAPOR DEPOSITION).

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ISBN 13 :
Total Pages : 396 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis THE LOW-TEMPERATURE THERMAL CHEMICAL VAPOR DEPOSITION AND CATALYZED CHEMICAL VAPOR DEPOSITION OF ALUMINUM NITRIDE AND SILICON NITRIDE (CHEMICAL VAPOR DEPOSITION). by : JEFFREY L. DUPUIE

Download or read book THE LOW-TEMPERATURE THERMAL CHEMICAL VAPOR DEPOSITION AND CATALYZED CHEMICAL VAPOR DEPOSITION OF ALUMINUM NITRIDE AND SILICON NITRIDE (CHEMICAL VAPOR DEPOSITION). written by JEFFREY L. DUPUIE and published by . This book was released on 1991 with total page 396 pages. Available in PDF, EPUB and Kindle. Book excerpt: deposition scheme holds much promise for low temperature film growth.

Metalorganic Chemical Vapor Deposition of Aluminum Nitride and Gallium Nitride

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ISBN 13 :
Total Pages : 304 pages
Book Rating : 4.:/5 (265 download)

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Book Synopsis Metalorganic Chemical Vapor Deposition of Aluminum Nitride and Gallium Nitride by : Kwok-Lun Ho

Download or read book Metalorganic Chemical Vapor Deposition of Aluminum Nitride and Gallium Nitride written by Kwok-Lun Ho and published by . This book was released on 1991 with total page 304 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Characterization of the Growth of Aluminum Nitride and Gallium Nitride Thin Films on Hydrogen Etched And/or Cleaned 6H-SiC(0001) Surfaces

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ISBN 13 :
Total Pages : 219 pages
Book Rating : 4.:/5 (451 download)

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Book Synopsis Characterization of the Growth of Aluminum Nitride and Gallium Nitride Thin Films on Hydrogen Etched And/or Cleaned 6H-SiC(0001) Surfaces by : Jeffrey David Hartman

Download or read book Characterization of the Growth of Aluminum Nitride and Gallium Nitride Thin Films on Hydrogen Etched And/or Cleaned 6H-SiC(0001) Surfaces written by Jeffrey David Hartman and published by . This book was released on 2000 with total page 219 pages. Available in PDF, EPUB and Kindle. Book excerpt: Keywords: 6H-SiC, Hydrogen etching, Aluminum nitride, Gallium nitride, Photo-electron emission microscopy, Chemical vapor deposition, Molecular beam epitaxy.

Experimental and Computational Investigations of Platinum and Gallium Nitride Vapor Deposition Processes

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ISBN 13 :
Total Pages : 0 pages
Book Rating : 4.:/5 (134 download)

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Book Synopsis Experimental and Computational Investigations of Platinum and Gallium Nitride Vapor Deposition Processes by : Ian Campbell

Download or read book Experimental and Computational Investigations of Platinum and Gallium Nitride Vapor Deposition Processes written by Ian Campbell and published by . This book was released on 2022 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical vapor deposition (CVD) and atomic layer deposition (ALD) are widely used and still rapidly growing material synthesis technologies. CVD and ALD are used to prepare thin films and nanoparticles from a chemically diverse library of precursors and, under the right conditions, have excellent process control that enables atomic scale precision. This dissertation primarily focuses on the deposition chemistry associated with the metal organic platinum precursor trimethyl (methylcyclopentadienyl) platinum (MeCpPtMe3) used in ALD and CVD of Pt, and with a special focus on substrates functionalized via ALD pretreatments and doping. The first focus of this dissertation was a platinum deposition process that utilized repeated doses of MeCpPtMe3 to deposit platinum nuclei on SiO2, monolayer graphene, and in mesoporous nitrogen-doped carbon powder (MPNC). The main purpose of this study was to enhance the nucleation density of platinum, further enabling the deposition of ultrathin films and catalytic materials, and to synthesize platinum nuclei with enhanced resistance to agglomeration under thermal stress. The effects of AlN and Al2O3 ALD-based pretreatment processes on the nucleation density and thermal stability of Pt nuclei deposited on planar SiO2 and graphene substrates were assessed. AlN was chosen as a promising pretreatment layer due to its relatively high surface energy as compared to Al2O3, which has been used previously to enhance the density of atomic layer deposited platinum nuclei. It was found that both Al2O3 and AlN pretreatments enhanced Pt nucleation density on SiO2 and graphene dramatically compared to bare SiO2 at 250 °C. The nucleation density for depositions performed at 300 °C was not so greatly enhanced by either pretreatment. However, four-point probe measurements indicated that depositing at 300 °C on pretreated SiO2 substrates, especially those pretreated with AlN, resulted in conductive films with significantly lower sheet resistance than films on untreated SiO2. After annealing these samples at 400 °C for one hour, it was found that Pt nuclei on pretreated samples generally resisted agglomeration more so than on untreated samples. Interestingly, a fully coalesced Pt film was deposited on AlN pretreated graphene at 300 °C. Conductive films with thicknesses in the range of 10-17 nm were deposited using just MeCpPtMe3. However, a combination of Al2O3 pretreatment, extended MeCpPtMe3 exposure, and MeCpPtMe3/H2 ALD was used to prepare films with the lowest thickness and resistivity. Another substrate functionalization strategy employed to influence the properties of deposited nuclei involved doping. Specifically, N doping in graphene-based materials, like MPNC, is proven to enhance catalytic activity and limit the agglomeration of nuclei under working conditions. The MPNC used in this dissertation was prepared elsewhere by carbonizing a composite of polyaniline and SiO2 nanoparticles then etching away the SiO2 to make a disordered, inverse structure composed largely of nitrogen-doped sp2 hybridized carbon. MPNC carbonized at 1000 °C (MPNC-1000) was observed via X-ray photoelectron spectroscopy to contain higher amounts of O and N dopants than MPNC carbonized at 1500 °C (MPNC-1500). It was found that exposure of both MPNC types to static pulses of MeCpPtMe3 resulted in the deposition of Pt nuclei up to 10 nm in diameter. Depositions performed at 250 °C resulted in nearly the same Pt loading (at. %) for both MPNC types, but increasing the deposition temperature to 300 °C resulted in a large increase in Pt loading for MPNC-1000 only, indicating a thermally driven change in reactivity for MPNC-1000 that is attributable to higher levels of O and N. The purpose of the second study was to use density functional theory to assess the effects of N doping on the reactivity of oxidized monovacancies in graphene towards MeCpPtMe3 adsorption and dissociation, and to identify a possible reason for the temperature-dependent reactivity of MPNC-1000. The substrates considered in this investigation consisted of monovacancies in monolayer graphene oxidized by two and three oxygen atoms. Each of these substrates was doped with a single N atom at various locations around the monovacancy. The chosen substrates are believed to be representative of defects found in N-doped, graphene-based substrates like MPNC. Oxidation of monovacancies in graphene with and without N dopants at various locations relative to the vacancy is thermodynamically favorable. N doping at and around monovacancies increased the length of critical oxygen-substrate bonds, indicating increased reactivity of the involved oxygen atoms, and resulted in a more robust interaction between adsorbed MeCpPtMe3 and oxidized defects. Nudged elastic band calculations were used to characterize the effects of N doping on methyl transfer from an adsorbed MeCpPtMe3 molecule to oxygen atoms bound to vacancies in doped and undoped substrates. All methyl transfer reactions were found to have positive activation energies and enthalpies of reaction. In each case, N dopants reduced the enthalpy and activation energy and made the reaction less reversible, with pyridinic N yielding the most pronounced changes. After losing one methyl group during the methyl transfer reaction, MeCpPtMe2 was generally found to bind much more strongly to the substrate than MeCpPtMe3, especially in the case of N-doped substrates. Thus, N doping at or near oxidized monovacancies in graphene significantly enhances the likelihood of precursor dissociation and adsorption. The deposition of GaN via plasma enhanced ALD (PEALD) and high pressure confined CVD (HPcCVD) was the final focus of this dissertation. A PEALD process was used to investigate the synthesis of amorphous GaN (a-GaN) and the subsequent crystallization of a-GaN by thermal annealing while in contact with a highly oriented GaN crystal template. By depositing a-GaN on amorphous Al2O3, it was thought that highly oriented crystalline GaN might be prepared on an amorphous substrate, thus creating a process that would enable crystalline GaN films to be deposited on any substrate capable of withstanding the process conditions regardless of epitaxial mismatch. Whether deposited GaN films were amorphous or crystalline depended largely on oxygen incorporation and its complex relationship with the background level of oxygen in the reactor and plasma chemistry, duration, and power. Shorter plasma duration, higher hydrogen concentration in the plasma, and lower plasma power were found to increase oxygen content in the deposited films. An oxygen concentration of ~17 at. % was required for the deposition of a-GaN. Lastly, HPcCVD was chosen as a potentially new method of preparing high surface area GaN structures for photocatalytic and sensing applications. A homemade reactor was used to contain mixtures of nitrogen gas, trimethyl gallium, and ammonia pressurized up to ~5000 psi. By venting this mixture through hollow core silica optical fiber heated to 650 °C, deposition of centimeter-scale micron-thick gallium nitride films could be performed on the interior surface of the fiber. The findings herein contribute to a deeper understanding of vapor deposition processes at the nanoscale and highlight the role of computational materials science in providing insight into precursor-substrate interactions at the early stages of deposition.

An Examination of the Kinetics and Mechanisms of the Chemical Vapor Deposition of Aluminum Nitride

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ISBN 13 :
Total Pages : 448 pages
Book Rating : 4.:/5 (319 download)

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Book Synopsis An Examination of the Kinetics and Mechanisms of the Chemical Vapor Deposition of Aluminum Nitride by : Scott Arnold Hanson

Download or read book An Examination of the Kinetics and Mechanisms of the Chemical Vapor Deposition of Aluminum Nitride written by Scott Arnold Hanson and published by . This book was released on 1993 with total page 448 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Aluminum Nitride Buffer Layer Growth for Group III-nitride Epitaxy on (111) Silicon

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ISBN 13 : 9781369615760
Total Pages : pages
Book Rating : 4.6/5 (157 download)

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Book Synopsis Aluminum Nitride Buffer Layer Growth for Group III-nitride Epitaxy on (111) Silicon by : Andrew Philip Lange

Download or read book Aluminum Nitride Buffer Layer Growth for Group III-nitride Epitaxy on (111) Silicon written by Andrew Philip Lange and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: This dissertation examines the growth of aluminum nitride (AlN) on (111) silicon by metalorganic chemical vapor deposition. AlN is commonly used as a buffer layer for the growth of gallium nitride on silicon templates. This makes the development of growth protocols for high quality, smooth AlN films on silicon critical to improving the performance and reliability of III-nitride on silicon devices such as light emitting diodes and high power transistors. The optimal nucleation conditions for AlN on silicon have been heavily disputed. Some crystal growers expose the substrate to aluminum prior to AlN deposition, which has been shown to improve crystal quality and decrease surface roughness of both AlN buffer layers and overgrown gallium nitride. However, others adopt an ammonia-first approach, in which the substrate is nitrided prior to AlN deposition. Both can be effective depending on the growth conditions, which has resulted in considerable controversy regarding how aluminum, nitrogen, and silicon interact during these initial "predoses" and how the resulting morphology influences subsequent AlN and gallium nitride growth. The structure and morphology of aluminum predose layers deposited directly on (111) silicon at ~970 °C both with and without subsequent ammonia exposure were studied using electron microscopy, atomic force microscopy, and X-ray photoelectron spectroscopy. Three morphological features were identified -- trenches, islands, and patches. When the predose layer was not exposed to ammonia, a roughening of the substrate was observed, similar to what occurs when gallium reacts with silicon. This gave rise to aluminum rich surface trenches, which suggests that silicon is dissolved by liquid aluminum and the resulting aluminum-silicon liquid solution evaporates. When the predose layer was exposed to ammonia, faceted patches were observed with small islands near their edges. The islands were composed of both zinc-blende and wurtzite AlN polytypes, while the patches consisted of diamond cubic silicon with dilute concentrations of aluminum. A model was proposed to explain these features in which the liquid aluminum-silicon surface layer is converted into AlN and silicon upon nitridation. Low temperature and high temperature AlN growth was examined after varied aluminum predoses using electron microscopy and atomic force microscopy with the aim of explaining anomalous AlN-silicon interface structures observed by others. AlN formed small, three-dimensional islands when grown directly on the substrate at ~970 °C with no predose. When the substrate was first exposed to a predose at ~970 °C, AlN nucleated on both island and patch features causing them to grow laterally and eventually coalesce. The morphologies of films grown with and without predoses were nearly identical after coalescence. This suggests that growth at this temperature is kinetically limited and does not depend on the nucleation surface. At high temperatures (~1060 °C), enhanced lateral growth on patch features formed during the predose was observed. The AlN-silicon interface was found to be predominantly amorphous when no predose was used, consistent with previous reports. The interface was structurally abrupt when aluminum was deposited prior to growth, but contained an additional phase consistent with the zinc-blende islands observed in predose layers. It was proposed that the amorphous SiN[subscript x] interfacial layer formed between nucleation sites when no predose was used as the substrate was exposed to an ammonia ambient prior to lateral growth of the nuclei. When the substrate was first exposed to a predose, aluminum rich silicon patches covered the surface. The presence of aluminum in the patches may limit the reaction between silicon and nitrogen during the early stages of growth. Dislocations in buffer layers grown both with and without aluminum predoses were studied using weak beam dark field transmission electron microscopy. A mosaic microstructure was observed which consisted of clustered dislocations along subgrain boundaries. Many of these subgrains were not bounded by dislocations on all sides, which suggests they did not form by the coalescence of misaligned islands. It was proposed they formed instead by the clustering of dislocations due to attractive and repulsive interactions. Dislocation densities were lower in films grown with a predose, which resulted in the formation of fewer subgrains. It was also found that buffers grown with a predose had a smoother surface. The surface of buffer layers grown without a predose contained small pits along the edges of surface terraces. The separation and geometry of these terraces was consistent with the subgrain structure, indicating surface step bunching may occur around subgrains where dislocation densities are high. Consistent with III-nitride growth on alternative substrates, a-type threading dislocations with line directions normal to the basal plane were found to terminate within highly defective, low temperature nucleation layers. C-type threading dislocations were found to terminate near the AlN-Si interface. It was suggested that the former originate from the climb of basal plane dislocations which form through the dissociation of Shockley partials or the coalescence of I1 type stacking faults. It was suggested that the latter nucleate from surface steps on the substrate. The observed improvement in crystal quality of buffer layers grown with a predose may be due to dislocation annihilation events, rather than the nucleation of fewer threading dislocations. This is corroborated by the presence of voids in the substrate when the buffer was grown with a predose, which indicates that point defects diffuse across the abrupt interface during growth. The presence of amorphous interfaces in films grown without an aluminum predose may inhibit the diffusion of point defects and thereby deter dislocation climb. If this mechanism is active as evidence in this dissertation suggests, an appropriate objective of any nucleation process for AlN buffer layers on silicon may be to improve the structural coherence of the interface.

MOCVD Growth of GAN, AlN and AlGaN for UV Photodetector Applications

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Total Pages : 108 pages
Book Rating : 4.:/5 (227 download)

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Book Synopsis MOCVD Growth of GAN, AlN and AlGaN for UV Photodetector Applications by :

Download or read book MOCVD Growth of GAN, AlN and AlGaN for UV Photodetector Applications written by and published by . This book was released on 1993 with total page 108 pages. Available in PDF, EPUB and Kindle. Book excerpt: For the growth of III-V nitrides, three main problems hinder the production of device quality materials. They are large lattice mismatch between nitride films and substrates, high n-type background concentration and difficulty in p-type doping. In the past year, we focused on the first problem, the lattice mismatch. Different substrates and different orientations of the substrates have been used in order to find a suitable substrate for the nitride growth. An atmospheric horizontal-type metalorganic chemical vapor deposition (MOCVD) reactor was used for the growth of aluminum nitride gallium nitride and ternary AlGa(1-x)N.

Proceedings of the First Symposium on III-V Nitride Materials and Processes

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Publisher : The Electrochemical Society
ISBN 13 : 9781566771634
Total Pages : 250 pages
Book Rating : 4.7/5 (716 download)

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Book Synopsis Proceedings of the First Symposium on III-V Nitride Materials and Processes by : T. D. Moustakas

Download or read book Proceedings of the First Symposium on III-V Nitride Materials and Processes written by T. D. Moustakas and published by The Electrochemical Society. This book was released on 1996 with total page 250 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Metalorganic Chemical Vapor Deposition of Aluminum Nitride and Aluminum Nitride/silicon Carbide Solid Solutions

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ISBN 13 :
Total Pages : 69 pages
Book Rating : 4.:/5 (115 download)

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Book Synopsis Metalorganic Chemical Vapor Deposition of Aluminum Nitride and Aluminum Nitride/silicon Carbide Solid Solutions by : I. Wang

Download or read book Metalorganic Chemical Vapor Deposition of Aluminum Nitride and Aluminum Nitride/silicon Carbide Solid Solutions written by I. Wang and published by . This book was released on 1995 with total page 69 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Metalorganic Chemical Vapor Deposition of Aluminum Nitride

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ISBN 13 :
Total Pages : 392 pages
Book Rating : 4.:/5 (356 download)

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Book Synopsis Metalorganic Chemical Vapor Deposition of Aluminum Nitride by : Herng Liu

Download or read book Metalorganic Chemical Vapor Deposition of Aluminum Nitride written by Herng Liu and published by . This book was released on 1995 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Charaterization of the Growth of Aluminum Nitride and Gallium Nitride Thin Films on Hydrogen Etched And/or Cleaned 6H-SiC(0001) Surfaces

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Total Pages : pages
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Book Synopsis Charaterization of the Growth of Aluminum Nitride and Gallium Nitride Thin Films on Hydrogen Etched And/or Cleaned 6H-SiC(0001) Surfaces by :

Download or read book Charaterization of the Growth of Aluminum Nitride and Gallium Nitride Thin Films on Hydrogen Etched And/or Cleaned 6H-SiC(0001) Surfaces written by and published by . This book was released on 2000 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The surface morphology and atomic structure of nitrogen doped, n-type 6H-SiC(0001)Si wafers before and after various surface preparation techniques were investigated. As-received wafers were exposed to in-situ cleaning with or without excess silicon to obtain either a (rt3 x rt3)R30 & deg; or a (3 x 3) reconstructed surface. The resulting surfaces were characterized using reflection high-energy electron diffraction, photo-electron emission microscopy, and atomic force microscopy. An atomically clean, reconstructed surface was obtained via thermal annealing at 950 & deg;C. Cleaning with excess silicon resulted in the formation of silicon islands on the surface. The surface morphology of hydrogen etched wafers depended upon their doping concentrations. Wafers with doping concentrations of greater than or equal 2.5 x 10E18 and less than 7 x 10E17 (ND-NA)/cm3 were investigated with the former exhibiting more surface features. The microstructure of all the samples showed regions with full and half unit cell high steps. An atomically clean, ordered, stepped surface was achieved via annealing at 1030 degrees Celcius. Chemical vapor cleaning resulted in the formation of silicon islands. The initial growth of AlN and GaN thin films on the cleaned, hydrogen etched 6H-SiC(0001) substrates were investigated using PEEM and AFM. The AlN films nucleated immediately and coalesced, except in the areas of the substrate surface which contained half unit cell height steps where pits were observed. The GaN films grown at 800 & deg;C for 2.5 minutes exhibited nucleation and three-dimensional growth along the steps. The GaN films deposited at 700 & deg; C for 2 minutes grew three-dimensionally with coalescence of the film dependent upon the step structure. Almost complete coalescence occurred in regions with unit cell high steps and incomplete coalesce occurred in regions with half unit cell height steps. Films of AlN grown for 30 minutes via GSMBE on hydrogen etched surfaces exhibited two-dimens.

Numerical Investigation of Pulsed Chemical Vapor Deposition of Aluminum Nitride

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ISBN 13 :
Total Pages : 64 pages
Book Rating : 4.:/5 (631 download)

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Book Synopsis Numerical Investigation of Pulsed Chemical Vapor Deposition of Aluminum Nitride by : Derek Endres

Download or read book Numerical Investigation of Pulsed Chemical Vapor Deposition of Aluminum Nitride written by Derek Endres and published by . This book was released on 2010 with total page 64 pages. Available in PDF, EPUB and Kindle. Book excerpt: Abstract: The Metal Organic Vapor Phase Epitaxy (MOVPE) of Aluminum Nitride (AlN) results not only in the growth of an AlN thin film, but also in the growth of AlN particles suspended in the gas-phase. Particle formation of AlN is unique to the MOVPE of AlN because the bond strength of AlN (11.5eV) is much larger than that of other III-V materials. This study numerically examined the effect of pulsing the precursor gases on the MOVPE of AlN as a way to curb AlN particle formation, in both horizontal and vertical reactors. Pulsing parameters such as pulse width, pulse duration, and precursor gas flow rate were varied to see the effect on growth rate and particle formation. The numerical predictions show AlN particle formation decreases significantly as the length of carrier gas pulse width increases and the deposition rate of substrate AlN can stay at approximately the same value as the steady state value with increased precursor gas flow rates. Therefore, if pulsing is introduced with relatively large carrier gas pulse width and increased precursor gas flow rates the AlN particle formation would be minimized while keeping the growth rate more or less unaffected. Numerical results also showed that pulsing has the added benefit that it increased the average growth rate (compared to steady state growth rates) because the precursors are not wasted as particles.

A Chemical Fluid Dynamic Study of the Chemical Vapor Deposition of Aluminum Nitride in a Vertical Reactor

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ISBN 13 :
Total Pages : 250 pages
Book Rating : 4.:/5 (46 download)

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Book Synopsis A Chemical Fluid Dynamic Study of the Chemical Vapor Deposition of Aluminum Nitride in a Vertical Reactor by : Wayne Anthony Bather

Download or read book A Chemical Fluid Dynamic Study of the Chemical Vapor Deposition of Aluminum Nitride in a Vertical Reactor written by Wayne Anthony Bather and published by . This book was released on 1997 with total page 250 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Synthesis of Aluminum Nitride Thin Films at Lower Temperatures by Metalorganic Chemical Vapor Deposition

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ISBN 13 :
Total Pages : 368 pages
Book Rating : 4.:/5 (366 download)

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Book Synopsis Synthesis of Aluminum Nitride Thin Films at Lower Temperatures by Metalorganic Chemical Vapor Deposition by : John N. Kidder

Download or read book Synthesis of Aluminum Nitride Thin Films at Lower Temperatures by Metalorganic Chemical Vapor Deposition written by John N. Kidder and published by . This book was released on 1996 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Growth of Solid Solutions of Aluminum Nitride and Silicon Carbide by Metal Organic Chemical Vapor Deposition

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ISBN 13 :
Total Pages : 140 pages
Book Rating : 4.:/5 (3 download)

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Book Synopsis Growth of Solid Solutions of Aluminum Nitride and Silicon Carbide by Metal Organic Chemical Vapor Deposition by : Ingrid Gwyn Jenkins

Download or read book Growth of Solid Solutions of Aluminum Nitride and Silicon Carbide by Metal Organic Chemical Vapor Deposition written by Ingrid Gwyn Jenkins and published by . This book was released on 1992 with total page 140 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Low-Temperature Chemical Vapor Deposition of Ruthenium and Manganese Nitride Thin Films

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ISBN 13 :
Total Pages : pages
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Book Synopsis Low-Temperature Chemical Vapor Deposition of Ruthenium and Manganese Nitride Thin Films by : Teresa S. Lazarz

Download or read book Low-Temperature Chemical Vapor Deposition of Ruthenium and Manganese Nitride Thin Films written by Teresa S. Lazarz and published by . This book was released on 2009 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Materials and thin film processing development has been and remains key to continuing to make ever smaller, or miniaturized, microelectronic devices. In order to continue miniaturization, conformal, low-temperature deposition of new electronic materials is needed. Two techniques capable of conformality have emerged: chemical vapor deposition (CVD) and atomic layer deposition (ALD). Here, two processes for deposition of materials which could be useful in microelectronics, but for which no low-temperature, conformal process has been established as commercializable, are presented. One is ruthenium, intended for use in interconnects and in dynamic random access memory electrodes, a known material for use in microelectronics but for which a more conformal, yet fast process than previously demonstrated is required. The other is manganese nitride, which could be used as active magnetic layers in devices or as a dopant in materials for spintronics, which is not yet established as a desired material in part due to the lack of any previously known CVD or ALD process for deposition.