Solder Joint Reliability

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Author :
Publisher : Springer
ISBN 13 : 9781461367437
Total Pages : 631 pages
Book Rating : 4.3/5 (674 download)

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Book Synopsis Solder Joint Reliability by : John H. Lau

Download or read book Solder Joint Reliability written by John H. Lau and published by Springer. This book was released on 2014-02-23 with total page 631 pages. Available in PDF, EPUB and Kindle. Book excerpt: Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.

Surface Mount Solder Joint Long-term Reliability

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Publisher :
ISBN 13 :
Total Pages : 50 pages
Book Rating : 4.:/5 (258 download)

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Book Synopsis Surface Mount Solder Joint Long-term Reliability by : Werner Engelmaier

Download or read book Surface Mount Solder Joint Long-term Reliability written by Werner Engelmaier and published by . This book was released on 1988 with total page 50 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Solder Joint Reliability

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Author :
Publisher : Springer Science & Business Media
ISBN 13 : 9780442002602
Total Pages : 504 pages
Book Rating : 4.0/5 (26 download)

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Book Synopsis Solder Joint Reliability by : John H. Lau

Download or read book Solder Joint Reliability written by John H. Lau and published by Springer Science & Business Media. This book was released on 1991-05-31 with total page 504 pages. Available in PDF, EPUB and Kindle. Book excerpt: Looks at how solder joint reliability is influenced by flux reactions, solder paste, reflow methods, wave soldering, and cleaning. Explores failure mechanisms and includes practical methods for testing, analysis, and life prediction of solder joints subjected to conditions of fatigue, creep, stress relaxation, shock, and vibration. For engineers and designers involved in electronics packaging. Annotation copyrighted by Book News, Inc., Portland, OR

Solder Joint Reliability Prediction for Multiple Environments

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Author :
Publisher : Springer Science & Business Media
ISBN 13 : 0387793941
Total Pages : 202 pages
Book Rating : 4.3/5 (877 download)

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Book Synopsis Solder Joint Reliability Prediction for Multiple Environments by : Andrew E. Perkins

Download or read book Solder Joint Reliability Prediction for Multiple Environments written by Andrew E. Perkins and published by Springer Science & Business Media. This book was released on 2008-12-16 with total page 202 pages. Available in PDF, EPUB and Kindle. Book excerpt: Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.

Lead-Free Solder Interconnect Reliability

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Author :
Publisher : ASM International
ISBN 13 : 161503093X
Total Pages : 292 pages
Book Rating : 4.6/5 (15 download)

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Book Synopsis Lead-Free Solder Interconnect Reliability by : Dongkai Shangguan

Download or read book Lead-Free Solder Interconnect Reliability written by Dongkai Shangguan and published by ASM International. This book was released on 2005 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Solder Joint Reliability of Bga, Csp, Flip Chip, and Fine Pitch Smt Assemblies

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Author :
Publisher : McGraw-Hill Professional Publishing
ISBN 13 : 9780070366480
Total Pages : 408 pages
Book Rating : 4.3/5 (664 download)

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Book Synopsis Solder Joint Reliability of Bga, Csp, Flip Chip, and Fine Pitch Smt Assemblies by : John H. Lau

Download or read book Solder Joint Reliability of Bga, Csp, Flip Chip, and Fine Pitch Smt Assemblies written by John H. Lau and published by McGraw-Hill Professional Publishing. This book was released on 1997 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt: This new volume by interconnection expert on solder joints, Johns H. Lau, deals with BGA, CSP, Flip Chips, and other new technologies that underlie the electronics industry's need for smaller, faster products. Naturally, as ever-smaller products are created, the reliability of the solder joints that bind them becomes increasingly crucial. Balancing concepts and practical applications, the authors explain the fundamentals of solder joint reliability and present creative, robust packaging techniques for cost-effective interconnection.

Design and Reliability of Solders and Solder Interconnections

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Author :
Publisher : Minerals, Metals, & Materials Society
ISBN 13 :
Total Pages : 468 pages
Book Rating : 4.X/5 (4 download)

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Book Synopsis Design and Reliability of Solders and Solder Interconnections by : Rao K. Mahidhara

Download or read book Design and Reliability of Solders and Solder Interconnections written by Rao K. Mahidhara and published by Minerals, Metals, & Materials Society. This book was released on 1997 with total page 468 pages. Available in PDF, EPUB and Kindle. Book excerpt: The reliability of solders and solder joints is an important factor in the durability and design of electronic packages. This volume addresses issues of reliability such as microstructural stability in service, creep, fatigue, creep/fatigue interactions, and thermomechanical fatigue of bulk solders and solder joints.

Reliability of Surface Mount Solder Joints

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Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (968 download)

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Book Synopsis Reliability of Surface Mount Solder Joints by : Vijay K. Garg

Download or read book Reliability of Surface Mount Solder Joints written by Vijay K. Garg and published by . This book was released on 1995 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Assembly and Reliability of Lead-Free Solder Joints

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Author :
Publisher : Springer Nature
ISBN 13 : 9811539200
Total Pages : 545 pages
Book Rating : 4.8/5 (115 download)

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Book Synopsis Assembly and Reliability of Lead-Free Solder Joints by : John H. Lau

Download or read book Assembly and Reliability of Lead-Free Solder Joints written by John H. Lau and published by Springer Nature. This book was released on 2020-05-29 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.

Principles of Reliable Soldering Techniques

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Author :
Publisher : New Age International
ISBN 13 : 9788122411096
Total Pages : 122 pages
Book Rating : 4.4/5 (11 download)

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Book Synopsis Principles of Reliable Soldering Techniques by : R. Sengupta

Download or read book Principles of Reliable Soldering Techniques written by R. Sengupta and published by New Age International. This book was released on 1997 with total page 122 pages. Available in PDF, EPUB and Kindle. Book excerpt: Soldering, Though Being An Age Old Phenomenon, Is Still Perhaps A Difficult Subject To Understand, Due To Its Interdisciplinary Nature. In This Book, Efforts Have Been Made To Describe The Physical Theories Responsible For Making A Good Joint, The Chemical Actions During Its Formation And The Electrical, Thermal And Mechanical Requirements Essential To Ensure Its Reliability. The Four M'S; Material, Machine, Method And Man, Necessary For Designing A Solder Joint Have Been Described In Detail. Further, Process Control, Solder Joint Inspection Criteria, Solder Joint Defect Analysis And Its Repair/Rework Are Also Discussed.Additionally, Brief Introductions To Surface Mount Devices (Smd) And Surface Mount Technology (Smt) Have Been Included A Annexures. The Book Will Be Useful In Industry, And To Design Production, Process Planning And Quality Control Engineers, As Well As In Engineering/Technical Colleges To Students As A Reference Book For The Present And, Hopefully, Future Modified Courses. The Academicians May Find This Book Useful For Redesigning The Present Diploma (Electronics), B.Sc. (Electronics), B.Sc. (Instrumentation), B.E. And M.E. / M.Tech (Electrical, Electronic, Instrumentation) Syllabus.

Solder Joint Reliability Assessment

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Author :
Publisher : Springer Science & Business
ISBN 13 : 3319000926
Total Pages : 179 pages
Book Rating : 4.3/5 (19 download)

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Book Synopsis Solder Joint Reliability Assessment by : Mohd N. Tamin

Download or read book Solder Joint Reliability Assessment written by Mohd N. Tamin and published by Springer Science & Business. This book was released on 2014-04-26 with total page 179 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface and bulk solder joint failure, respectively. Applications of the deliberated methodology to selected problems in assessing reliability of solder joints are demonstrated. These industry-defined research-based problems include solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, JEDEC board-level drop test and mechanisms of solder joint fatigue. Emphasis is placed on accurate quantitative assessment of solder joint reliability through basic understanding of the mechanics of materials as interpreted from results of FE simulations. The FE simulation methodology is readily applicable to numerous other problems in mechanics of materials and structures.

Designing for Surface Mount Solder Joint Reliability

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Author :
Publisher :
ISBN 13 :
Total Pages : 48 pages
Book Rating : 4.:/5 (318 download)

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Book Synopsis Designing for Surface Mount Solder Joint Reliability by : Werner Engelmaier

Download or read book Designing for Surface Mount Solder Joint Reliability written by Werner Engelmaier and published by . This book was released on 1991 with total page 48 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Lead Free Solder

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Publisher : Springer Science & Business Media
ISBN 13 : 1461404630
Total Pages : 184 pages
Book Rating : 4.4/5 (614 download)

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Book Synopsis Lead Free Solder by : John Hock Lye Pang

Download or read book Lead Free Solder written by John Hock Lye Pang and published by Springer Science & Business Media. This book was released on 2011-10-15 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt: Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests.

Reflow Soldering Processes

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Author :
Publisher : Newnes
ISBN 13 : 0750672188
Total Pages : 282 pages
Book Rating : 4.7/5 (56 download)

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Book Synopsis Reflow Soldering Processes by : Ning-Cheng Lee

Download or read book Reflow Soldering Processes written by Ning-Cheng Lee and published by Newnes. This book was released on 2002-01-11 with total page 282 pages. Available in PDF, EPUB and Kindle. Book excerpt: Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process

Reliability of Surface Mount Solder Joints Within Automotive Control Modules

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Author :
Publisher :
ISBN 13 :
Total Pages : 442 pages
Book Rating : 4.:/5 (34 download)

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Book Synopsis Reliability of Surface Mount Solder Joints Within Automotive Control Modules by : Jeffery Duane White

Download or read book Reliability of Surface Mount Solder Joints Within Automotive Control Modules written by Jeffery Duane White and published by . This book was released on 1995 with total page 442 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Solder Joint Reliability

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Publisher :
ISBN 13 :
Total Pages : 0 pages
Book Rating : 4.:/5 (139 download)

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Book Synopsis Solder Joint Reliability by : American Society of Mechanical Engineers. Winter Annual Meeting

Download or read book Solder Joint Reliability written by American Society of Mechanical Engineers. Winter Annual Meeting and published by . This book was released on 1989 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: An extensive finite element modeling and experimental testing program has been carried out to determine the most optimum design parameters for solder joints in surface mount applications. Although the analysis and testing (power cycling and thermal cycling) has been carried out for a variety of package styles, particular attention will be paid to the result for leadless ceramic chip carriers. This package is particularly useful in certain high performance military and commercial applications. Analysis and experimentation indicate that increased fatigue life under power cycling can be attained by fabricating solder joints with large fillets and low standoff heights. The large fillet geometry significantly reduces harmful stress concentrations while increasing the net cross-sectional area within the joint. Both factors tend to improve the fracture toughness of the joint. The temperature and frequency dependencies of solder joint fatigue life under power cycling testing is discussed. The observed frequency dependence can be minimized by eliminating harmful tensile strain components thus reducing harmful stress relaxation and tensile induced oxygen embrittlement of grain boundaries. Temperature cycling studies indicate joints with slightly higher standoffs and low fillet angles are more resistant to cyclic fatigue than pillar type joints which tend to focus shear strains at the interfaces. Solder joints can be tapered to improve overall reliability but, in most cases, tapering will provide only a small increase in fracture toughness of the joint through the elimination of stress concentrations. Additional fatigue life increases can be obtained only through an enlargement of the joint cross-sectional area. Aspects of the above results will be presented in detail along with design guidelines for creating high reliability solder joints for various application scenarios.

A Study of the Thermomechanical Reliability of Solder Joints in Surface Mount Electronics Technology

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Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (111 download)

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Book Synopsis A Study of the Thermomechanical Reliability of Solder Joints in Surface Mount Electronics Technology by : Jude Ebem Njoku

Download or read book A Study of the Thermomechanical Reliability of Solder Joints in Surface Mount Electronics Technology written by Jude Ebem Njoku and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: