Read Books Online and Download eBooks, EPub, PDF, Mobi, Kindle, Text Full Free.
Download Study Of Intermetallic Compound Layer Formation Growth And Evaluation Of Shear Strength Of Lead Free Solder Joints full books in PDF, epub, and Kindle. Read online Study Of Intermetallic Compound Layer Formation Growth And Evaluation Of Shear Strength Of Lead Free Solder Joints ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!
Author : R. J. Klein Wassink
Publisher :
ISBN 13 :
Total Pages : 510 pages
Book Rating : 4.:/5 (44 download)
Download or read book Soldering in Electronics written by R. J. Klein Wassink and published by . This book was released on 1984 with total page 510 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 500 pages
Book Rating : 4.0/5 ( download)
Download or read book Iron & Steelmaker written by and published by . This book was released on 2003-07 with total page 500 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : John H. Lau
Publisher : Springer Science & Business Media
ISBN 13 : 1461539102
Total Pages : 649 pages
Book Rating : 4.4/5 (615 download)
Download or read book Solder Joint Reliability written by John H. Lau and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 649 pages. Available in PDF, EPUB and Kindle. Book excerpt: Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.
Author : Abhijit Kar
Publisher :
ISBN 13 : 9781839622786
Total Pages : 94 pages
Book Rating : 4.6/5 (227 download)
Download or read book Lead Free Solders written by Abhijit Kar and published by . This book was released on 2019 with total page 94 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides some of the most advanced research observations and in-depth knowledge behind lead-free soldering. Readers will find a description of different cutting-edge techniques used for improving the reliability of interconnects manufacturing. Some of the most unconventional topics covered in this book include solder joint formation for microelectronic devices at room temperature and the possibility of soldering ceramic materials, which is limited due to the poor wettability of ceramic substrates with commercial solders following classical soldering techniques. We also discuss the possibilities of nanoscale preparation of solder joints for bringing down the processing temperature so that it does not affect the packaging technologies. Readers will find that precise, systematic discussion of solder joint formation and its interfacial characterization has been depicted for each technique used in different chapters. This book is of interest to both fundamental researchers and also to practicing scientists and will prove invaluable to all those working in industry and academia.
Author : Yan Li
Publisher : Springer
ISBN 13 : 9783319445847
Total Pages : 560 pages
Book Rating : 4.4/5 (458 download)
Download or read book 3D Microelectronic Packaging written by Yan Li and published by Springer. This book was released on 2016-10-29 with total page 560 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
Author : King-Ning Tu
Publisher : Springer Science & Business Media
ISBN 13 : 0387388923
Total Pages : 376 pages
Book Rating : 4.3/5 (873 download)
Download or read book Solder Joint Technology written by King-Ning Tu and published by Springer Science & Business Media. This book was released on 2007-07-27 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: The European Union’s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.
Author :
Publisher :
ISBN 13 :
Total Pages : 1042 pages
Book Rating : 4.E/5 ( download)
Download or read book Metals Abstracts written by and published by . This book was released on 1998 with total page 1042 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Paul Thomas Vianco
Publisher :
ISBN 13 :
Total Pages : 580 pages
Book Rating : 4.F/5 ( download)
Download or read book Soldering Handbook written by Paul Thomas Vianco and published by . This book was released on 1999 with total page 580 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Michael F. Ashby
Publisher : Elsevier
ISBN 13 : 1483297217
Total Pages : 380 pages
Book Rating : 4.4/5 (832 download)
Download or read book Engineering Materials 2 written by Michael F. Ashby and published by Elsevier. This book was released on 2014-06-28 with total page 380 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides a thorough explanation of the basic properties of materials; of how these can be controlled by processing; of how materials are formed, joined and finished; and of the chain of reasoning that leads to a successful choice of material for a particular application. The materials covered are grouped into four classes: metals, ceramics, polymers and composites. Each class is studied in turn, identifying the families of materials in the class, the microstructural features, the processes or treatments used to obtain a particular structure and their design applications. The text is supplemented by practical case studies and example problems with answers, and a valuable programmed learning course on phase diagrams.
Author : C. Suryanarayana
Publisher : CRC Press
ISBN 13 : 1351649523
Total Pages : 529 pages
Book Rating : 4.3/5 (516 download)
Download or read book Bulk Metallic Glasses written by C. Suryanarayana and published by CRC Press. This book was released on 2017-11-22 with total page 529 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reflecting the fast pace of research in the field, the Second Edition of Bulk Metallic Glasses has been thoroughly updated and remains essential reading on the subject. It incorporates major advances in glass forming ability, corrosion behavior, and mechanical properties. Several of the newly proposed criteria to predict the glass-forming ability of alloys have been discussed. All other areas covered in this book have been updated, with special emphasis on topics where significant advances have occurred. These include processing of hierarchical surface structures and synthesis of nanophase composites using the chemical behavior of bulk metallic glasses and the development of novel bulk metallic glasses with high-strength and high-ductility and superelastic behavior. New topics such as high-entropy bulk metallic glasses, nanoporous alloys, novel nanocrystalline alloys, and soft magnetic glassy alloys with high saturation magnetization have also been discussed. Novel applications, such as metallic glassy screw bolts, surface coatings, hyperthermia glasses, ultra-thin mirrors and pressure sensors, mobile phone casing, and degradable biomedical materials, are described. Authored by the world’s foremost experts on bulk metallic glasses, this new edition endures as an indispensable reference and continues to be a one-stop resource on all aspects of bulk metallic glasses.
Author : David A. Scott
Publisher : Getty Publications
ISBN 13 : 9780892366385
Total Pages : 536 pages
Book Rating : 4.3/5 (663 download)
Download or read book Copper and Bronze in Art written by David A. Scott and published by Getty Publications. This book was released on 2002 with total page 536 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is a review of 190 years of literature on copper and its alloys. It integrates information on pigments, corrosion and minerals, and discusses environmental conditions, conservation methods, ancient and historical technologies.
Author : Ray Prasad
Publisher : Springer Science & Business Media
ISBN 13 : 1461540844
Total Pages : 791 pages
Book Rating : 4.4/5 (615 download)
Download or read book Surface Mount Technology written by Ray Prasad and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 791 pages. Available in PDF, EPUB and Kindle. Book excerpt: A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. When asked to write this foreword, I had no problem with what I wanted to say about the work or the author. I did, however, wonder why people read a foreword. It is probably of value to know the background of the writer of a book; it is probably also of value to know the background of the individual who is commenting on the work. I consider myself a good friend of the author, and when I was asked to write a few words I felt honored to provide my view of Ray Prasad, his expertise, and the contribution that he has made to our industry. This book is about the industry, its technology, and its struggle to learn and compete in a global market bursting with new ideas to satisfy a voracious appetite for new and innovative electronic products. I had the good fortune to be there at the beginning (or almost) and have witnessed the growth and excitement in the opportunities and challenges afforded the electronic industries' engineering and manufacturing talents. In a few years my involve ment will span half a century.
Author : John W. Evans
Publisher : Springer Science & Business Media
ISBN 13 : 1846283108
Total Pages : 212 pages
Book Rating : 4.8/5 (462 download)
Download or read book A Guide to Lead-free Solders written by John W. Evans and published by Springer Science & Business Media. This book was released on 2007-01-05 with total page 212 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. Europe and Asia are moving towards legislation to ban the use of lead in solders and public demand in the US will likely have the same result. Producers of solders and manufacturers who use them will have to invent and employ suitable substitutes and A Guide to Lead-free Solders will show them how to do so.
Author : R. M. Evans
Publisher :
ISBN 13 :
Total Pages : 86 pages
Book Rating : 4.3/5 (91 download)
Download or read book Joining of Nickel-base Alloys written by R. M. Evans and published by . This book was released on 1962 with total page 86 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher : American Society of Mechanical Engineers
ISBN 13 :
Total Pages : 632 pages
Book Rating : 4.3/5 (91 download)
Download or read book Electronic and Photonic Packaging, Integration and Packaging of Micro/nano/electronic Systems--2005 written by and published by American Society of Mechanical Engineers. This book was released on 2005 with total page 632 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : John H. Lau
Publisher : Springer Nature
ISBN 13 : 9811539200
Total Pages : 545 pages
Book Rating : 4.8/5 (115 download)
Download or read book Assembly and Reliability of Lead-Free Solder Joints written by John H. Lau and published by Springer Nature. This book was released on 2020-05-29 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
Author : Tae-Kyu Lee
Publisher : Springer
ISBN 13 : 1461492661
Total Pages : 266 pages
Book Rating : 4.4/5 (614 download)
Download or read book Fundamentals of Lead-Free Solder Interconnect Technology written by Tae-Kyu Lee and published by Springer. This book was released on 2014-11-05 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
