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Author :
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ISBN 13 :
Total Pages : 392 pages
Book Rating : 4.3/5 (91 download)
Download or read book Annual IEEE Semiconductor Thermal Measurement and Management Symposium written by and published by . This book was released on 2005 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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ISBN 13 :
Total Pages : 838 pages
Book Rating : 4.F/5 ( download)
Download or read book Future Energy Conferences and Symposia written by and published by . This book was released on 1989 with total page 838 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Institute of Electrical and Electronics Engineers
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 :
Total Pages : 312 pages
Book Rating : 4.X/5 (4 download)
Download or read book 1997 IEEE 13th Annual Semiconductor Thermal Measurement & Management Symposium written by Institute of Electrical and Electronics Engineers and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1997 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume features coverage of new developments in and applications relating to generation and removal of heat within semiconductor devices, and measurement of junction temperatures under various application and environmental conditions.
Author :
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ISBN 13 :
Total Pages : 160 pages
Book Rating : 4.F/5 ( download)
Download or read book National Semiconductor Metrology Program, NIST List OF Publications, LP 103, May 2000 written by and published by . This book was released on 2000 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : National Institute of Standards and Technology (U.S.)
Publisher :
ISBN 13 :
Total Pages : 160 pages
Book Rating : 4.0/5 ( download)
Download or read book National Semiconductor Metrology Program written by National Institute of Standards and Technology (U.S.) and published by . This book was released on 2000 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 :
Total Pages : 272 pages
Book Rating : 4.X/5 (4 download)
Download or read book Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1996 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : National Semiconductor Metrology Program (U.S.)
Publisher :
ISBN 13 :
Total Pages : 106 pages
Book Rating : 4.F/5 ( download)
Download or read book National Semiconductor Metrology Program written by National Semiconductor Metrology Program (U.S.) and published by . This book was released on with total page 106 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : A. H.-D. Cheng
Publisher : WIT Press
ISBN 13 : 1784664316
Total Pages : 174 pages
Book Rating : 4.7/5 (846 download)
Download or read book Boundary Elements and other Mesh Reduction Methods XLIV written by A. H.-D. Cheng and published by WIT Press. This book was released on 2021-08-31 with total page 174 pages. Available in PDF, EPUB and Kindle. Book excerpt: The maturity of BEM over the last few decades has resulted in a substantial number of industrial applications of the method; this demonstrates its accuracy, robustness and ease of use. The range of applications still needs to be widened, taking into account the potentialities of the Mesh Reduction techniques in general. Theoretical developments and new formulations have been reported over the last few decades, helping to expand the range of boundary elements and other mesh reduction methods (BEM/MRM) applications as well as the type of modelled materials in response to the requirements of contemporary industrial and professional environments. As design, analysis and manufacture become more integrated, the chances are that software users will be less aware of the capabilities of the analytical techniques that are at the core of the process. This reinforces the need to retain expertise in certain specialised areas of numerical methods, such as BEM/MRM, to ensure that all new tools perform satisfactorily within the aforementioned integrated process. The papers included were presented at the 44th International Conference on Boundary Elements and other Mesh Reduction Methods and report advances in techniques that reduce or eliminate the type of meshes associated with finite elements or finite differences.
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ISBN 13 :
Total Pages : 148 pages
Book Rating : 4.F/5 ( download)
Download or read book National Semiconductor Metrology Program, Semiconductor Electronics Division, NIST List Of Publications, LP 103, March 1999 written by and published by . This book was released on 1999 with total page 148 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Cher Ming Tan
Publisher : Woodhead Publishing
ISBN 13 : 012822407X
Total Pages : 190 pages
Book Rating : 4.1/5 (282 download)
Download or read book Reliability and Failure Analysis of High-Power LED Packaging written by Cher Ming Tan and published by Woodhead Publishing. This book was released on 2022-09-24 with total page 190 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide insights for readers regarding the possible failure mechanisms in high-power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to harsher stress conditions for high-power LEDs. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs. - Introduces the failure mechanisms of high-power LEDs under varying environmental conditions and methods of how to test, simulate, and predict them - Describes the chemistry underlying the material degradation and its impact on LEDs - Discusses future directions of new packaging materials for improved performance and reliability of high-power LEDs
Author : Chunwei Cai
Publisher : Springer Nature
ISBN 13 : 9819708656
Total Pages : 701 pages
Book Rating : 4.8/5 (197 download)
Download or read book The Proceedings of 2023 International Conference on Wireless Power Transfer (ICWPT2023) written by Chunwei Cai and published by Springer Nature. This book was released on with total page 701 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Ahteshamul Haque
Publisher : John Wiley & Sons
ISBN 13 : 1119873754
Total Pages : 356 pages
Book Rating : 4.1/5 (198 download)
Download or read book Fault Analysis and its Impact on Grid-connected Photovoltaic Systems Performance written by Ahteshamul Haque and published by John Wiley & Sons. This book was released on 2022-12-20 with total page 356 pages. Available in PDF, EPUB and Kindle. Book excerpt: A thorough and authoritative discussion of how to use fault analysis to prevent grid failures In Fault Analysis and its Impact on Grid-Connected Photovoltaic Systems Performance, a team of distinguished engineers delivers an insightful and concise analysis of how engineers can use fault analysis to estimate and ensure reliability in grid-connected photovoltaic systems. The editors explore how failure data can be used to identify how power electronics-based power systems operate and how they can help to perform risk analysis and reduce the likelihood and frequency of failure. The book explains how to apply different fault detection techniques—including signal and image processing, fault tolerant approaches—and explores the impact of faults in grid-connected photovoltaic systems. It offers contributions from noted experts in the field and is fully updated to include the latest technologies and approaches. Readers will also find: A failure mode effect classification approach for distributed generation systems and their components Explanations of advanced machine learning approaches with significant market potential and real-world relevance A consideration of the issues pertaining to the integration of power electronics converters with distributed generation systems in grid-connected environments Treatments of IoT-based monitoring, ageing detection for capacitors, image and signal processing approaches, and standards for failure modes and criticality analyses Perfect for manufacturers and engineers working in the power electronics-based power system and smart grid sectors, Fault Analysis and its Impact on Grid-Connected Photovoltaic Systems Performance will also earn a place in the libraries of distributed generation companies facing issues in operation and maintenance.
Author : C.J. Hoogendoorn
Publisher : Springer Science & Business Media
ISBN 13 : 9401110824
Total Pages : 334 pages
Book Rating : 4.4/5 (11 download)
Download or read book Thermal Management of Electronic Systems written by C.J. Hoogendoorn and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 334 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Eurotherm Committee has chosen Thermal Management of Electronic Systems as the subject of its 29th Seminar, at Delft University of Technology, the Netherlands, 14-16 June 1993. This volume constitutes the proceedings of the Seminar. Thermal Management is but one of the several critical topics in the design of electronic systems. However, as a result of the combined effects of increasing heat fluxes, miniaturisation and the striving for zero defects, preferably in less time and at a lower cost than before, thermal management has become an increasingly tough challenge. Therefore, it is being increasingly recognised that cooling requirements could eventually hamper the technical progress in miniaturisation. It might be argued that we are on the verge of a revolution in thermal management techniques. Previously, a packaging engineer had no way of predicting the tempera tures of critical electronic parts with the required accuracy. He or she· had to rely on full-scale experiments, doubtful design rules, or worst-case estimates. This situation is going to be changed in the foreseeable future. User-friendly software tools, the acquisition and integrity of input and output data, the badly needed training mea sures, the introduction into a concurrent engineering environment: all these items will exert a heavy toll on the flexibility of the electronics industries. Fortunately, this situation is being realised at the appropriate management levels, and the interest in this seminar and the pre-conference tutorials testifies to this assertion.
Author : Marta Rencz
Publisher : Springer Nature
ISBN 13 : 3030861740
Total Pages : 389 pages
Book Rating : 4.0/5 (38 download)
Download or read book Theory and Practice of Thermal Transient Testing of Electronic Components written by Marta Rencz and published by Springer Nature. This book was released on 2023-01-23 with total page 389 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed to understand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers.
Author : Jemal H. Abawajy
Publisher : Springer
ISBN 13 : 9811317992
Total Pages : 624 pages
Book Rating : 4.8/5 (113 download)
Download or read book Proceedings of the International Conference on Data Engineering 2015 (DaEng-2015) written by Jemal H. Abawajy and published by Springer. This book was released on 2019-08-09 with total page 624 pages. Available in PDF, EPUB and Kindle. Book excerpt: These proceedings gather outstanding research papers presented at the Second International Conference on Data Engineering 2015 (DaEng-2015) and offer a consolidated overview of the latest developments in databases, information retrieval, data mining and knowledge management. The conference brought together researchers and practitioners from academia and industry to address key challenges in these fields, discuss advanced data engineering concepts and form new collaborations. The topics covered include but are not limited to: • Data engineering • Big data • Data and knowledge visualization • Data management • Data mining and warehousing • Data privacy & security • Database theory • Heterogeneous databases • Knowledge discovery in databases • Mobile, grid and cloud computing • Knowledge management • Parallel and distributed data • Temporal data • Web data, services and information engineering • Decision support systems • E-Business engineering and management • E-commerce and e-learning • Geographical information systems • Information management • Information quality and strategy • Information retrieval, integration and visualization • Information security • Information systems and technologies
Author : R.R. Tummala
Publisher : Springer Science & Business Media
ISBN 13 : 1461540860
Total Pages : 742 pages
Book Rating : 4.4/5 (615 download)
Download or read book Microelectronics Packaging Handbook written by R.R. Tummala and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 742 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Author : Alhussein Albarbar
Publisher : Springer
ISBN 13 : 3319598287
Total Pages : 224 pages
Book Rating : 4.3/5 (195 download)
Download or read book Thermal Analysis of Power Electronic Devices Used in Renewable Energy Systems written by Alhussein Albarbar and published by Springer. This book was released on 2017-07-19 with total page 224 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book analyzes the thermal characteristics of power electronic devices (PEDs) with a focus on those used in wind and solar energy systems. The authors focus on the devices used in such applications, for example boost converters and inverters under different operating conditions. The book explains in detail finite element modeling techniques, setting up measuring systems, data analysis, and PEDs’ lifetime calculations. It is appropriate reading for graduate students and researchers who focus on the design and reliability of power electronic devices.
