Silicon Micromachined Packages For Rf Mems Switches

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Advanced RF MEMS

Author : Stepan Lucyszyn
Publisher : Cambridge University Press
ISBN 13 : 1139491660
Total Pages : 441 pages
Book Rating : 4.1/5 (394 download)

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Book Synopsis Advanced RF MEMS by : Stepan Lucyszyn

Download or read book Advanced RF MEMS written by Stepan Lucyszyn and published by Cambridge University Press. This book was released on 2010-08-19 with total page 441 pages. Available in PDF, EPUB and Kindle. Book excerpt: An up-to-date guide to the theory and applications of RF MEMS. With detailed information about RF MEMS technology as well as its reliability and applications, this is a comprehensive resource for professionals, researchers, and students alike. • Reviews RF MEMS technologies • Illustrates new techniques that solve long-standing problems associated with reliability and packaging • Provides the information needed to incorporate RF MEMS into commercial products • Describes current and future trends in RF MEMS, providing perspective on industry growth • Ideal for those studying or working in RF and microwave circuits, systems, microfabrication and manufacturing, production management and metrology, and performance evaluation

RF MEMS Switches and Integrated Switching Circuits

Author : Ai-Qun Liu
Publisher : Springer Science & Business Media
ISBN 13 : 0387462627
Total Pages : 276 pages
Book Rating : 4.3/5 (874 download)

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Book Synopsis RF MEMS Switches and Integrated Switching Circuits by : Ai-Qun Liu

Download or read book RF MEMS Switches and Integrated Switching Circuits written by Ai-Qun Liu and published by Springer Science & Business Media. This book was released on 2010-08-09 with total page 276 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectromechanical Systems (MEMS) stand poised for the next major breakthrough in the silicon revolution that began with the transistor in the 1960s and has revolutionized microelectronics. MEMS allow one to not only observe and process information of all types from small scale systems, but also to affect changes in systems and the environment at that scale. “RF MEMS Switches and Integrated Switching Circuits” builds on the extensive body of literature that exists in research papers on analytical and numerical modeling and design based on RF MEMS switches and micromachined switching circuits, and presents a unified framework of coverage. This volume includes, but is not limited to, RF MEMS approaches, developments from RF MEMS switches to RF switching circuits, and MEMS switch components in circuit systems. This book also: -Presents RF Switches and switching circuit MEMS devices in a unified framework covering all aspects of engineering innovation, design, modeling, fabrication, control and experimental implementation -Discusses RF switch devices in detail, with both system and component-level circuit integration using micro- and nano-fabrication techniques -Includes an emphasis on design innovation and experimental relevance rather than basic electromagnetic theory and device physics “RF MEMS Switches and Integrated Switching Circuits” is perfect for engineers, researchers and students working in the fields of MEMS, circuits and systems and RFs.

Radio Frequency Micromachined Switches, Switching Networks, and Phase Shifters

Author : Shiban Kishen Koul
Publisher : CRC Press
ISBN 13 : 135102132X
Total Pages : 291 pages
Book Rating : 4.3/5 (51 download)

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Book Synopsis Radio Frequency Micromachined Switches, Switching Networks, and Phase Shifters by : Shiban Kishen Koul

Download or read book Radio Frequency Micromachined Switches, Switching Networks, and Phase Shifters written by Shiban Kishen Koul and published by CRC Press. This book was released on 2019-05-03 with total page 291 pages. Available in PDF, EPUB and Kindle. Book excerpt: Radio Frequency Micromachined Switches, Switching Networks, and Phase Shifters discusses radio frequency microelectromechanical systems (RF MEMS)-based control components and will be useful for researchers and R&D engineers. It offers an in-depth study, performance analysis, and extensive characterization on micromachined switches and phase shifters. The reader will learn about basic design methodology and techniques to carry out extensive measurements on MEMS switches and phase shifters which include electrical, mechanical, power handling, linearity, temperature stability, reliability, and radio frequency performance. Practical examples included in the book will help readers to build high performance systems/subsystems using micromachined circuits. Key Features Provides simple design methodology of MEMS switches and switching networks including SPST to SP16T switches Gives an in-depth performance study of micromachined phase shifters. Detailed study on reliability and power handling capability of RF MEMS switches and phase shifters presented Proposes reconfigurable micromachined phase shifters Verifies a variety of MEMS switches and phase shifters experimentally

Introduction to Microelectromechanical Microwave Systems

Author : Héctor J. de los Santos
Publisher : Artech House
ISBN 13 : 9781580538725
Total Pages : 242 pages
Book Rating : 4.5/5 (387 download)

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Book Synopsis Introduction to Microelectromechanical Microwave Systems by : Héctor J. de los Santos

Download or read book Introduction to Microelectromechanical Microwave Systems written by Héctor J. de los Santos and published by Artech House. This book was released on 2004 with total page 242 pages. Available in PDF, EPUB and Kindle. Book excerpt: Annotation The second edition covers the latest in fabrication technologies, actuation mechanisms, packaging, switching, resonator design, and microwave and wireless applications. This practical book steers readers past the drawbacks and towards the benefits of integrating RF/microwave MEMS into communications equipment

RF MEMS and Their Applications

Author : Vijay K. Varadan
Publisher : John Wiley & Sons
ISBN 13 : 0470846194
Total Pages : 406 pages
Book Rating : 4.4/5 (78 download)

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Book Synopsis RF MEMS and Their Applications by : Vijay K. Varadan

Download or read book RF MEMS and Their Applications written by Vijay K. Varadan and published by John Wiley & Sons. This book was released on 2003-07-25 with total page 406 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectromechanical systems (MEMS) refer to a collection of micro-sensors and actuators, which can react to environmental change under micro- circuit control. The integration of MEMS into traditional Radio Frequency (RF) circuits has resulted in systems with superior performance levels and lower manufacturing costs. The incorporation of MEMS based fabrication technologies into micro and millimeter wave systems offers viable routes to ICs with MEMS actuators, antennas, switches and transmission lines. The resultant systems operate with an increased bandwidth and increased radiation efficiency and have considerable scope for implementation within the expanding area of wireless personal communication devices. This text provides leading edge coverage of this increasingly important area and highlights the overlapping information requirements of the RF and MEMS research and development communities. * Provides an introduction to micromachining techniques and their use in the fabrication of micro switches, capacitors and inductors * Includes coverage of MEMS devices for wireless and Bluetooth enabled systems Essential reading for RF Circuit design practitioners and researchers requiring an introduction to MEMS technologies, as well as practitioners and researchers in MEMS and silicon technology requiring an introduction to RF circuit design.

More than Moore

Author : Guo Qi Zhang
Publisher : Springer Science & Business Media
ISBN 13 : 0387755934
Total Pages : 338 pages
Book Rating : 4.3/5 (877 download)

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Book Synopsis More than Moore by : Guo Qi Zhang

Download or read book More than Moore written by Guo Qi Zhang and published by Springer Science & Business Media. This book was released on 2010-01-23 with total page 338 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the past decades, the mainstream of microelectronics progression was mainly powered by Moore's law focusing on IC miniaturization down to nano scale. However, there is a fast increasing need for "More than Moore" (MtM) products and technology that are based upon or derived from silicon technologies, but do not simply scale with Moore’s law. This book provides new vision, strategy and guidance for the future technology and business development of micro/nanoelectronics.

Advances in Small Satellite Technologies

Author : R.S. Priyadarsini
Publisher : Springer Nature
ISBN 13 : 9811974748
Total Pages : 268 pages
Book Rating : 4.8/5 (119 download)

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Book Synopsis Advances in Small Satellite Technologies by : R.S. Priyadarsini

Download or read book Advances in Small Satellite Technologies written by R.S. Priyadarsini and published by Springer Nature. This book was released on 2023-06-18 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains select papers presented during the 2nd National Conference on Small Satellites, discussing the latest research and developments relating to small satellite technology. The papers cover various issues relating to design and engineering, ranging from the control, mechanical, and thermal systems to the sensors, antennas, and RF systems used. The book is of interest to scientists and engineers working on or utilizing satellite and space technologies.

Three Dimensional Integration and Packaging Using Silicon Micromachining

Author : Alexandros D. Margomenos
Publisher :
ISBN 13 :
Total Pages : 394 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Three Dimensional Integration and Packaging Using Silicon Micromachining by : Alexandros D. Margomenos

Download or read book Three Dimensional Integration and Packaging Using Silicon Micromachining written by Alexandros D. Margomenos and published by . This book was released on 2003 with total page 394 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Electrical Performance of Electronic Packaging

Author :
Publisher :
ISBN 13 :
Total Pages : 390 pages
Book Rating : 4.:/5 (31 download)

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Book Synopsis Electrical Performance of Electronic Packaging by :

Download or read book Electrical Performance of Electronic Packaging written by and published by . This book was released on 2002 with total page 390 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Materials, Integration and Packaging Issues for High-frequency Devices

Author :
Publisher :
ISBN 13 :
Total Pages : 256 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Materials, Integration and Packaging Issues for High-frequency Devices by :

Download or read book Materials, Integration and Packaging Issues for High-frequency Devices written by and published by . This book was released on 2003 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Handbook of Silicon Based MEMS Materials and Technologies

Author : Markku Tilli
Publisher : Elsevier
ISBN 13 : 0815519885
Total Pages : 670 pages
Book Rating : 4.8/5 (155 download)

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Book Synopsis Handbook of Silicon Based MEMS Materials and Technologies by : Markku Tilli

Download or read book Handbook of Silicon Based MEMS Materials and Technologies written by Markku Tilli and published by Elsevier. This book was released on 2009-12-08 with total page 670 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications. Key topics covered include: - Silicon as MEMS material - Material properties and measurement techniques - Analytical methods used in materials characterization - Modeling in MEMS - Measuring MEMS - Micromachining technologies in MEMS - Encapsulation of MEMS components - Emerging process technologies, including ALD and porous silicon Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities. - Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland. - Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland. - Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland. - Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan. - Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques - Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs - Discusses properties, preparation, and growth of silicon crystals and wafers - Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures

Mems for Automotive and Aerospace Applications

Author : Michael Kraft
Publisher : Elsevier
ISBN 13 : 0857096486
Total Pages : 358 pages
Book Rating : 4.8/5 (57 download)

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Book Synopsis Mems for Automotive and Aerospace Applications by : Michael Kraft

Download or read book Mems for Automotive and Aerospace Applications written by Michael Kraft and published by Elsevier. This book was released on 2013-01-02 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt: MEMS for automotive and aerospace applications reviews the use of Micro-Electro-Mechanical-Systems (MEMS) in developing solutions to the unique challenges presented by the automotive and aerospace industries.Part one explores MEMS for a variety of automotive applications. The role of MEMS in passenger safety and comfort, sensors for automotive vehicle stability control applications and automotive tire pressure monitoring systems are considered, along with pressure and flow sensors for engine management, and RF MEMS for automotive radar sensors. Part two then goes on to explore MEMS for aerospace applications, including devices for active drag reduction in aerospace applications, inertial navigation and structural health monitoring systems, and thrusters for nano- and pico-satellites. A selection of case studies are used to explore MEMS for harsh environment sensors in aerospace applications, before the book concludes by considering the use of MEMS in space exploration and exploitation.With its distinguished editors and international team of expert contributors, MEMS for automotive and aerospace applications is a key tool for MEMS manufacturers and all scientists, engineers and academics working on MEMS and intelligent systems for transportation. - Chapters consider the role of MEMS in a number of automotive applications, including passenger safety and comfort, vehicle stability and control - MEMS for aerospace applications are also discussed, including active drag reduction, inertial navigation and structural health monitoring systems - Presents a number of case studies exploring MEMS for harsh environment sensors in aerospace

RF and Microwave Microelectronics Packaging

Author : Ken Kuang
Publisher : Springer Science & Business Media
ISBN 13 : 1441909842
Total Pages : 295 pages
Book Rating : 4.4/5 (419 download)

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Book Synopsis RF and Microwave Microelectronics Packaging by : Ken Kuang

Download or read book RF and Microwave Microelectronics Packaging written by Ken Kuang and published by Springer Science & Business Media. This book was released on 2009-12-01 with total page 295 pages. Available in PDF, EPUB and Kindle. Book excerpt: RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

LCP for Microwave Packages and Modules

Author : Anh-Vu H. Pham
Publisher : Cambridge University Press
ISBN 13 : 1107377986
Total Pages : 269 pages
Book Rating : 4.1/5 (73 download)

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Book Synopsis LCP for Microwave Packages and Modules by : Anh-Vu H. Pham

Download or read book LCP for Microwave Packages and Modules written by Anh-Vu H. Pham and published by Cambridge University Press. This book was released on 2012-06-21 with total page 269 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP), giving you everything you need to know to get up-to-speed on the subject. This text describes successful design and development techniques for high-performance microwave and millimeter-wave packages and modules in an organic platform. These were specifically developed to make the most of LCP's inert, hermetic, low-cost, high-frequency (DC to 110+ GHz) properties. First-hand accounts show you how to avoid various pitfalls during design and development. You'll get extensive electrical design details in areas of broadband circuit design for low-loss interconnects, couplers, splitters/combiners, baluns, phase shifters, time-delay units (TDU), power amplifier (PA) modules, receiver modules, phased-array antennas, flexible electronics, surface mounted packages, Microelectromechanical Systems (MEMS) and reliability. Ideal for engineers in the fields of RF, microwave, signal integrity, advanced packaging, material science, optical and biomedical engineering.

Silicon Heterostructure Handbook

Author : John D. Cressler
Publisher : CRC Press
ISBN 13 : 1420026585
Total Pages : 1249 pages
Book Rating : 4.4/5 (2 download)

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Book Synopsis Silicon Heterostructure Handbook by : John D. Cressler

Download or read book Silicon Heterostructure Handbook written by John D. Cressler and published by CRC Press. This book was released on 2018-10-03 with total page 1249 pages. Available in PDF, EPUB and Kindle. Book excerpt: An extraordinary combination of material science, manufacturing processes, and innovative thinking spurred the development of SiGe heterojunction devices that offer a wide array of functions, unprecedented levels of performance, and low manufacturing costs. While there are many books on specific aspects of Si heterostructures, the Silicon Heterostructure Handbook: Materials, Fabrication, Devices, Circuits, and Applications of SiGe and Si Strained-Layer Epitaxy is the first book to bring all aspects together in a single source. Featuring broad, comprehensive, and in-depth discussion, this handbook distills the current state of the field in areas ranging from materials to fabrication, devices, CAD, circuits, and applications. The editor includes "snapshots" of the industrial state-of-the-art for devices and circuits, presenting a novel perspective for comparing the present status with future directions in the field. With each chapter contributed by expert authors from leading industrial and research institutions worldwide, the book is unequalled not only in breadth of scope, but also in depth of coverage, timeliness of results, and authority of references. It also includes a foreword by Dr. Bernard S. Meyerson, a pioneer in SiGe technology. Containing nearly 1000 figures along with valuable appendices, the Silicon Heterostructure Handbook authoritatively surveys materials, fabrication, device physics, transistor optimization, optoelectronics components, measurement, compact modeling, circuit design, and device simulation.

RF MEMS

Author : Gabriel M. Rebeiz
Publisher : John Wiley & Sons
ISBN 13 : 0471462888
Total Pages : 512 pages
Book Rating : 4.4/5 (714 download)

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Book Synopsis RF MEMS by : Gabriel M. Rebeiz

Download or read book RF MEMS written by Gabriel M. Rebeiz and published by John Wiley & Sons. This book was released on 2004-02-06 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ultrasmall Radio Frequency and Micro-wave Microelectromechanical systems (RF MEMs), such as switches, varactors, and phase shifters, exhibit nearly zero power consumption or loss. For this reason, they are being developed intensively by corporations worldwide for use in telecommunications equipment. This book acquaints readers with the basics of RF MEMs and describes how to design practical circuits and devices with them. The author, an acknowledged expert in the field, presents a range of real-world applications and shares many valuable tricks of the trade.

Introduction to Microsystem Packaging Technology

Author : Yufeng Jin
Publisher : CRC Press
ISBN 13 : 1351832972
Total Pages : 233 pages
Book Rating : 4.3/5 (518 download)

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Book Synopsis Introduction to Microsystem Packaging Technology by : Yufeng Jin

Download or read book Introduction to Microsystem Packaging Technology written by Yufeng Jin and published by CRC Press. This book was released on 2017-12-19 with total page 233 pages. Available in PDF, EPUB and Kindle. Book excerpt: The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.