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Reliability Of Microtechnology
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Book Synopsis Reliability of Microtechnology by : Johan Liu
Download or read book Reliability of Microtechnology written by Johan Liu and published by Springer Science & Business Media. This book was released on 2011-02-07 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail. The book also includes exercises and detailed solutions at the end of each chapter.
Book Synopsis Reliability of Microtechnology by : Johan Liu
Download or read book Reliability of Microtechnology written by Johan Liu and published by . This book was released on 2011-03-30 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Safety and Reliability: Methodology and Applications by : Tomasz Nowakowski
Download or read book Safety and Reliability: Methodology and Applications written by Tomasz Nowakowski and published by CRC Press. This book was released on 2014-09-01 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt: Within the last fifty years the performance requirements for technical objects and systems were supplemented with: customer expectations (quality), abilities to prevent the loss of the object properties in operation time (reliability and maintainability), protection against the effects of undesirable events (safety and security) and the ability to
Book Synopsis Harsh Environment Electronics by : Ahmed Sharif
Download or read book Harsh Environment Electronics written by Ahmed Sharif and published by John Wiley & Sons. This book was released on 2019-08-05 with total page 398 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.
Book Synopsis Improving Practice and Performance in Basketball by : Aaron T. Scanlan
Download or read book Improving Practice and Performance in Basketball written by Aaron T. Scanlan and published by MDPI. This book was released on 2019-11-18 with total page 106 pages. Available in PDF, EPUB and Kindle. Book excerpt: Despite being one of the most popular sports worldwide, basketball has received limited research attention compared to other team sports. Establishing a strong evidence base with high-quality and impactful research is essential in enhancing decision-making processes to optimize player performance for basketball professionals. Consequently, the book entitled Improving Performance and Practice in Basketball provides a collection of novel research studies to increase the available evidence on various topics with strong translation to practice in basketball. The book includes work by 40 researchers from 16 institutions or professional organizations from 9 countries. In keeping with notable topics in basketball research, the book contains 2 reviews focused on monitoring strategies to detect player fatigue and considerations for travel in National Basketball Association players. In addition, 8 applied studies are also included in the book, focused on workload monitoring, game-related statistics, and the measurement of physical and skill attributes in basketball players. This book also has a strong focus on increasing the evidence available for female basketball players, who have traditionally been under-represented in the literature. The outcomes generated from this book should provide new insights to inform practice in many areas for professionals working in various roles with basketball teams.
Book Synopsis Failures and the Law by : H.P. Rossmanith
Download or read book Failures and the Law written by H.P. Rossmanith and published by Routledge. This book was released on 2003-09-02 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt: The interaction between engineering and the law is undergoing dramatic changes. Product liability, laws have been introduced in Japan, patent claims over living organisms have been made in bioengineering and the differing national laws of copyright protection and liability are in the process of harmonisation, especially in the European Union. The pace and complexity of these changes make it essential for technologists, lawyers, engineers and insurance experts to establish a common basis for understanding, co-operation and exchange of expertise. The recently founded International Society for Technology, Law and Insurance aims to foster such co-operation. This volume features 46 selected contributions which address various topical issues and the law. The most important issues relate to engineering risks, quality assurance and assessment and legal implications assiciated with them. Recent failure cases are explained and the technical, legal and insurance-related issues discussed in detail.
Book Synopsis Advances in RAMS Engineering by : Durga Rao Karanki
Download or read book Advances in RAMS Engineering written by Durga Rao Karanki and published by Springer Nature. This book was released on 2019-12-10 with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book surveys reliability, availability, maintainability and safety (RAMS) analyses of various engineering systems. It highlights their role throughout the lifecycle of engineering systems and explains how RAMS activities contribute to their efficient and economic design and operation. The book discusses a variety of examples and applications of RAMS analysis, including: • software products; • electrical and electronic engineering systems; • mechanical engineering systems; • nuclear power plants; • chemical and process plants and • railway systems. The wide-ranging nature of the applications discussed highlights the multidisciplinary nature of complex engineering systems. The book provides a quick reference to the latest advances and terminology in various engineering fields, assisting students and researchers in the areas of reliability, availability, maintainability, and safety engineering.
Book Synopsis Testing, Reliability, and Application of Micro- and Nano-material Systems by :
Download or read book Testing, Reliability, and Application of Micro- and Nano-material Systems written by and published by . This book was released on 2003 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Micro Electronic and Mechanical Systems by : Kenichi Takahata
Download or read book Micro Electronic and Mechanical Systems written by Kenichi Takahata and published by BoD – Books on Demand. This book was released on 2009-12-01 with total page 528 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses key aspects of MEMS technology areas, organized in twenty-seven chapters that present the latest research developments in micro electronic and mechanical systems. The book addresses a wide range of fundamental and practical issues related to MEMS, advanced metal-oxide-semiconductor (MOS) and complementary MOS (CMOS) devices, SoC technology, integrated circuit testing and verification, and other important topics in the field. ?Several chapters cover state-of-the-art microfabrication techniques and materials as enabling technologies for the microsystems. Reliability issues concerning both electronic and mechanical aspects of these devices and systems are also addressed in various chapters.
Download or read book Lead Free Solders written by Abhijit Kar and published by BoD – Books on Demand. This book was released on 2019-10-02 with total page 96 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides some of the most advanced research observations and in-depth knowledge behind lead-free soldering. Readers will find a description of different cutting-edge techniques used for improving the reliability of interconnects manufacturing. Some of the most unconventional topics covered in this book include solder joint formation for microelectronic devices at room temperature and the possibility of soldering ceramic materials, which is limited due to the poor wettability of ceramic substrates with commercial solders following classical soldering techniques. We also discuss the possibilities of nanoscale preparation of solder joints for bringing down the processing temperature so that it does not affect the packaging technologies. Readers will find that precise, systematic discussion of solder joint formation and its interfacial characterization has been depicted for each technique used in different chapters. This book is of interest to both fundamental researchers and also to practicing scientists and will prove invaluable to all those working in industry and academia.
Book Synopsis Microsystems Technology by : Jumana Boussey
Download or read book Microsystems Technology written by Jumana Boussey and published by Elsevier Science & Technology. This book was released on 2003 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Table of contents
Book Synopsis Nanotribology and Nanomechanics by : Bharat Bhushan
Download or read book Nanotribology and Nanomechanics written by Bharat Bhushan and published by Springer. This book was released on 2017-04-05 with total page 928 pages. Available in PDF, EPUB and Kindle. Book excerpt: This textbook and comprehensive reference source and serves as a timely, practical introduction to the principles of nanotribology and nanomechanics. This 4th edition has been completely revised and updated, concentrating on the key measurement techniques, their applications, and theoretical modeling of interfaces. It provides condensed knowledge of the field from the mechanics and materials science perspectives to graduate students, research workers, and practicing engineers.
Book Synopsis Fracture of Nano and Engineering Materials and Structures by : E.E. Gdoutos
Download or read book Fracture of Nano and Engineering Materials and Structures written by E.E. Gdoutos and published by Springer Science & Business Media. This book was released on 2008-01-08 with total page 1452 pages. Available in PDF, EPUB and Kindle. Book excerpt: The 16th European Conference of Fracture (ECF16) was held in Greece, July, 2006. It focused on all aspects of structural integrity with the objective of improving the safety and performance of engineering structures, components, systems and their associated materials. Emphasis was given to the failure of nanostructured materials and nanostructures including micro- and nano-electromechanical systems (MEMS and NEMS).
Book Synopsis Engineering Geology and the Environment by : G.C. Koukis
Download or read book Engineering Geology and the Environment written by G.C. Koukis and published by CRC Press. This book was released on 1997-01-01 with total page 366 pages. Available in PDF, EPUB and Kindle. Book excerpt: Composed of the proceedings of a symposium on engineering geology and the environment, held in Athens in June, 1997, this work provides a survey of trends in engineering geology, and an interdisciplinary collaboration with hydrogeology, geochemistry, geomorphology, and soil and rock mechanics.
Book Synopsis Handbook of Flexible Organic Electronics by : Stergios Logothetidis
Download or read book Handbook of Flexible Organic Electronics written by Stergios Logothetidis and published by Elsevier. This book was released on 2014-12-03 with total page 483 pages. Available in PDF, EPUB and Kindle. Book excerpt: Organic flexible electronics represent a highly promising technology that will provide increased functionality and the potential to meet future challenges of scalability, flexibility, low power consumption, light weight, and reduced cost. They will find new applications because they can be used with curved surfaces and incorporated in to a number of products that could not support traditional electronics. The book covers device physics, processing and manufacturing technologies, circuits and packaging, metrology and diagnostic tools, architectures, and systems engineering. Part one covers the production, properties and characterisation of flexible organic materials and part two looks at applications for flexible organic devices. Reviews the properties and production of various flexible organic materials. Describes the integration technologies of flexible organic electronics and their manufacturing methods. Looks at the application of flexible organic materials in smart integrated systems and circuits, chemical sensors, microfluidic devices, organic non-volatile memory devices, and printed batteries and other power storage devices.
Book Synopsis Implications of Emerging Micro- and Nanotechnologies by : National Research Council
Download or read book Implications of Emerging Micro- and Nanotechnologies written by National Research Council and published by National Academies Press. This book was released on 2003-02-06 with total page 267 pages. Available in PDF, EPUB and Kindle. Book excerpt: Expansion of micro-technology applications and rapid advances in nano-science have generated considerable interest by the Air Force in how these developments will affect the nature of warfare and how it could exploit these trends. The report notes four principal themes emerging from the current technological trends: increased information capability, miniaturization, new materials, and increased functionality. Recommendations about Air Force roles in micro- and nanotechnology research are presented including those areas in which the Air Force should take the lead. The report also provides a number of technical and policy findings and recommendations that are critical for effective development of the Air Force's micro- and nano-science and technology program
Book Synopsis Micro Process Engineering, 3 Volume Set by : Volker Hessel
Download or read book Micro Process Engineering, 3 Volume Set written by Volker Hessel and published by John Wiley & Sons. This book was released on 2009-03-23 with total page 1413 pages. Available in PDF, EPUB and Kindle. Book excerpt: This three-volume handbook provides an overview of the key aspects of micro process engineering. Volume 1 covers the fundamentals, operations and catalysts, volume 2 examines devices, reactions and applications, with volume 3 rounding off the trilogy with system, process and plant engineering. Fluid dynamics, mixing, heat/mass transfer, purification and separation microstructured devices and microstructured reactors are explained in the first volume. Volume 2 segments microreactor design, fabrication and assembly, bulk and fine chemistry, polymerisation, fuel processing and functional materials into understandable parts. The final volume of the handbook addresses microreactor systems design and scale-up, sensing, analysis and control, chemical process engineering, economic and eco-efficiency analyses as well as microreactor plant case studies in one book. Together, this 3-volume handbook explains the science behind micro process engineering to the scale-up and their real life industrial applications.
