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Reduction And Oxidation Of Copper Oxide Thin Films And Thermal Stability Issues In Copper Based Metallization
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Book Synopsis Reduction and Oxidation of Copper Oxide Thin Films and Thermal Stability Issues in Copper-based Metallization by : Jian Li
Download or read book Reduction and Oxidation of Copper Oxide Thin Films and Thermal Stability Issues in Copper-based Metallization written by Jian Li and published by . This book was released on 1992 with total page 314 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Dissertation Abstracts International by :
Download or read book Dissertation Abstracts International written by and published by . This book was released on 2008 with total page 902 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis American Doctoral Dissertations by :
Download or read book American Doctoral Dissertations written by and published by . This book was released on 2002 with total page 776 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Metals Abstracts written by and published by . This book was released on 1996 with total page 1622 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Area Array Interconnection Handbook by : Karl J. Puttlitz
Download or read book Area Array Interconnection Handbook written by Karl J. Puttlitz and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 1250 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
Download or read book Energy Research Abstracts written by and published by . This book was released on 1982 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Physics Briefs written by and published by . This book was released on 1994 with total page 1162 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Scientific and Technical Aerospace Reports by :
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1995 with total page 704 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Metals Abstracts Index written by and published by . This book was released on 1996 with total page 1622 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Electrical & Electronics Abstracts by :
Download or read book Electrical & Electronics Abstracts written by and published by . This book was released on 1997 with total page 1860 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Advanced Materials for Printed Flexible Electronics by : Colin Tong
Download or read book Advanced Materials for Printed Flexible Electronics written by Colin Tong and published by Springer Nature. This book was released on 2021-10-04 with total page 641 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive introduction to printed flexible electronics and their applications, including the basics of modern printing technologies, printable inks, performance characterization, device design, modeling, and fabrication processes. A wide range of materials used for printed flexible electronics are also covered in depth. Bridging the gap between the creation of structure and function, printed flexible electronics have been explored for manufacturing of flexible, stretchable, wearable, and conformal electronics device with conventional, 3D, and hybrid printing technologies. Advanced materials such as polymers, ceramics, nanoparticles, 2D materials, and nanocomposites have enabled a wide variety of applications, such as transparent conductive films, thin film transistors, printable solar cells, flexible energy harvesting and storage devices, electroluminescent devices, and wearable sensors. This book provides students, researchers and engineers with the information to understand the current status and future trends in printed flexible electronics, and acquire skills for selecting and using materials and additive manufacturing processes in the design of printed flexible electronics.
Book Synopsis Proceedings of the Symposium on Interconnect and Contact Metallization by : Harzara S. Rathore
Download or read book Proceedings of the Symposium on Interconnect and Contact Metallization written by Harzara S. Rathore and published by The Electrochemical Society. This book was released on 1998 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book The Engineering Index Annual written by and published by . This book was released on 1992 with total page 2264 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since its creation in 1884, Engineering Index has covered virtually every major engineering innovation from around the world. It serves as the historical record of virtually every major engineering innovation of the 20th century. Recent content is a vital resource for current awareness, new production information, technological forecasting and competitive intelligence. The world?s most comprehensive interdisciplinary engineering database, Engineering Index contains over 10.7 million records. Each year, over 500,000 new abstracts are added from over 5,000 scholarly journals, trade magazines, and conference proceedings. Coverage spans over 175 engineering disciplines from over 80 countries. Updated weekly.
Download or read book Chemical Abstracts written by and published by . This book was released on 1991 with total page 2682 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Low-dielectric Constant Materials by :
Download or read book Low-dielectric Constant Materials written by and published by . This book was released on 1998 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Ceramic Abstracts written by and published by . This book was released on 1998 with total page 252 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Energy written by and published by . This book was released on 1983 with total page 356 pages. Available in PDF, EPUB and Kindle. Book excerpt:
