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Author : Andrew A. O. Tay
Publisher :
ISBN 13 : 9780780341579
Total Pages : 0 pages
Book Rating : 4.3/5 (415 download)
Download or read book Proceedings of the 1997 1st Electronic Packaging Technology Conference written by Andrew A. O. Tay and published by . This book was released on 1997 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 319 pages
Book Rating : 4.:/5 (961 download)
Download or read book Proceedings of the 1997 1st Electronic Packaging Technology Conference, 8-10 October 1997, ... , Singapore written by and published by . This book was released on 1997 with total page 319 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Hewlett-Packard Company. Electronic Assembly Development Center
Publisher :
ISBN 13 :
Total Pages : 658 pages
Book Rating : 4.:/5 (77 download)
Download or read book Electronic Packaging & Manufacturing Conference Proceedings written by Hewlett-Packard Company. Electronic Assembly Development Center and published by . This book was released on 1997 with total page 658 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Glenn R. Blackwell
Publisher : CRC Press
ISBN 13 : 9781420049848
Total Pages : 648 pages
Book Rating : 4.0/5 (498 download)
Download or read book The Electronic Packaging Handbook written by Glenn R. Blackwell and published by CRC Press. This book was released on 2017-12-19 with total page 648 pages. Available in PDF, EPUB and Kindle. Book excerpt: The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
Author : Thiam Beng Lim
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 :
Total Pages : 492 pages
Book Rating : 4.3/5 (91 download)
Download or read book Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) written by Thiam Beng Lim and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2000 with total page 492 pages. Available in PDF, EPUB and Kindle. Book excerpt: Topics covered by this title include: packaging materials; packaging trends; thermal design and modelling; solder joint metallurgy; process and reliability modelling; thermal characterization; materials characterization techniques; and assembly/manufacturing technologies.
Author :
Publisher :
ISBN 13 :
Total Pages : 154 pages
Book Rating : 4.:/5 (31 download)
Download or read book Proceedings of the Technical Program written by and published by . This book was released on 2000 with total page 154 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : E. Suhir
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (841 download)
Download or read book Advances in Electronic Packaging 1997 written by E. Suhir and published by . This book was released on 1997 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Daniel Dobkin
Publisher : Newnes
ISBN 13 : 0123948304
Total Pages : 540 pages
Book Rating : 4.1/5 (239 download)
Download or read book The RF in RFID written by Daniel Dobkin and published by Newnes. This book was released on 2012-11-01 with total page 540 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains how UHF tags and readers communicate wirelessly. It gives an understanding of what limits the read range of a tag, how to increase it (and why that might result in breaking the law), and the practical things that need to be addressed when designing and implementing RFID technology. Avoiding heavy math but giving breadth of coverage with the right amount of detail, it is an ideal introduction to radio communications for engineers who need insight into how tags and readers work. New to this edition: • Examples of near-metal antenna techniques • Discussion of the wakeup challenge for battery-assisted tags, with a BAT architecture example • Latest development of protocols: EPC Gen 1.2.0 • Update 18000-6 discussion with battery-assisted tags, sensor tags, Manchester tags and wakeup provisions Named a 2012 Notable Computer Book for Computer Systems Organization by Computing Reviews The only book to give an understanding of radio communications, the underlying technology for radio frequency identification (RFID) Praised for its readability and clarity, it balances breadth and depth of coverage New edition includes latest developments in chip technology, antennas and protocols
Author : British Library. Document Supply Centre
Publisher :
ISBN 13 :
Total Pages : 870 pages
Book Rating : 4.F/5 ( download)
Download or read book Index of Conference Proceedings written by British Library. Document Supply Centre and published by . This book was released on 2003 with total page 870 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Ephraim Suhir
Publisher :
ISBN 13 :
Total Pages : 1282 pages
Book Rating : 4.:/5 (832 download)
Download or read book Advances in Electronic Packaging 1997 written by Ephraim Suhir and published by . This book was released on 1997 with total page 1282 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in Electronic Packaging written by and published by . This book was released on 1967 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 772 pages
Book Rating : 4.:/5 (334 download)
Download or read book Publications in Engineering written by and published by . This book was released on 1999 with total page 772 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Ephraim Suhir
Publisher :
ISBN 13 : 9780791815595
Total Pages : 2223 pages
Book Rating : 4.8/5 (155 download)
Download or read book Advances in Electronic Packaging, 1997 written by Ephraim Suhir and published by . This book was released on 1997 with total page 2223 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Shen Liu
Publisher : John Wiley & Sons
ISBN 13 : 0470828412
Total Pages : 586 pages
Book Rating : 4.4/5 (78 download)
Download or read book Modeling and Simulation for Microelectronic Packaging Assembly written by Shen Liu and published by John Wiley & Sons. This book was released on 2011-08-24 with total page 586 pages. Available in PDF, EPUB and Kindle. Book excerpt: Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
Author : Vitaliy Zhurbenko
Publisher : BoD – Books on Demand
ISBN 13 : 9533070870
Total Pages : 502 pages
Book Rating : 4.5/5 (33 download)
Download or read book Advanced Microwave Circuits and Systems written by Vitaliy Zhurbenko and published by BoD – Books on Demand. This book was released on 2010-04-01 with total page 502 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is based on recent research work conducted by the authors dealing with the design and development of active and passive microwave components, integrated circuits and systems. It is divided into seven parts. In the first part comprising the first two chapters, alternative concepts and equations for multiport network analysis and characterization are provided. A thru-only de-embedding technique for accurate on-wafer characterization is introduced. The second part of the book corresponds to the analysis and design of ultra-wideband low- noise amplifiers (LNA).
Author :
Publisher :
ISBN 13 :
Total Pages : 148 pages
Book Rating : 4.F/5 ( download)
Download or read book National Semiconductor Metrology Program, Semiconductor Electronics Division, NIST List Of Publications, LP 103, March 1999 written by and published by . This book was released on 1999 with total page 148 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : C.P. Wong
Publisher : Springer Science & Business Media
ISBN 13 : 1441900403
Total Pages : 761 pages
Book Rating : 4.4/5 (419 download)
Download or read book Nano-Bio- Electronic, Photonic and MEMS Packaging written by C.P. Wong and published by Springer Science & Business Media. This book was released on 2009-12-23 with total page 761 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.
