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Author :
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ISBN 13 :
Total Pages : 1220 pages
Book Rating : 4.0/5 ( download)
Download or read book Proceedings written by and published by . This book was released on 2004 with total page 1220 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 698 pages
Book Rating : 4.:/5 (318 download)
Download or read book Proceedings of the Technical Conference written by and published by . This book was released on 1989 with total page 698 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Michael Pecht
Publisher : John Wiley & Sons
ISBN 13 : 9780471594369
Total Pages : 498 pages
Book Rating : 4.5/5 (943 download)
Download or read book Quality Conformance and Qualification of Microelectronic Packages and Interconnects written by Michael Pecht and published by John Wiley & Sons. This book was released on 1994-12-13 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don't cost-effectively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests. This book's groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today's high-performancemicroelectronics. It does this with powerful... * Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata * Physics-of-failure product reliability assessment methods thatcan be proactively implemented throughout the design andmanufacture of the product * Process controls that decrease variabilities in the end productand reduce end-of-line screening and testing A wide range of microelectronic package and interconnectconfigurations for both single-and multi-chip modules is examined,including chip and wire-bonds, tape-automated (TAB), flip-TAB,flip-chip bonds, high-density interconnects, chip-on-board designs(COB), MCM, 3-D stack, and many more. The remaining packageelements, such as die attachment, case and lid, leads, and lid andlead seals are also discussed in detail. The product of a distinguished team of authors and editors, thisbook's guidelines for avoiding potential high-risk manufacturingand qualification problems, as well as for implementing ongoingquality assurance, are sure to prove invaluable to both studentsand practicing professionals. For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines:basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress,vibration, and acoustics; and manufacturing and assemblytechnology. 1994 (0-471-53299-1) 800 pp. INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGNGUIDELINES: A Focus on Reliability --Michael Pecht This comprehensive guide features a uniquely organized time-phasedapproach to design, development, qualification, manufacture, andin-service management. It provides step-by-step instructions on howto define realistic system requirements, define the system usageenvironment, identify potential failure modes, characterizematerials and processes by the key control label factors, and useexperiment, step-stress, and accelerated methods to ensure optimumdesign before production begins. Topics covered include: detaileddesign guidelines for substrate...wire and wire, tape automated,and flip-chip bonding...element attachment and case, lead, lead andlid seals--incorporating dimensional and geometric configurationsof package elements, manufacturing and assembly conditions,materials selection, and loading conditions. 1993 (0-471-59446-6)454 pp.
Author : Madhav Datta
Publisher : The Electrochemical Society
ISBN 13 : 9781566771719
Total Pages : 312 pages
Book Rating : 4.7/5 (717 download)
Download or read book Proceedings of the Symposium on Environmental Aspects of Electrochemical Technology: Applications in Electronics written by Madhav Datta and published by The Electrochemical Society. This book was released on 1997 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : James E. Morris
Publisher : Springer Science & Business Media
ISBN 13 : 9400904398
Total Pages : 459 pages
Book Rating : 4.4/5 (9 download)
Download or read book Electronics Packaging Forum written by James E. Morris and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 459 pages. Available in PDF, EPUB and Kindle. Book excerpt: Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.
Author : Edwin Bradley
Publisher : John Wiley & Sons
ISBN 13 : 9780470171462
Total Pages : 472 pages
Book Rating : 4.1/5 (714 download)
Download or read book Lead-Free Electronics written by Edwin Bradley and published by John Wiley & Sons. This book was released on 2007-10-26 with total page 472 pages. Available in PDF, EPUB and Kindle. Book excerpt: Based on the results of a more than two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing is the first practical, primary reference to cover Pb-free solder assembly as well as the analysis and reasoning behind the selection of Sn-Ag-Cu as the recommended Pb-free replacement for Sn-Pb. Reflecting the results of a two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing provides full coverage of the issues surrounding the implementation of Pb-free solder into electronic board assembly. This book is extremely timelyâ??most electronic manufacturers are going to change over to Pb free soldering by 2006 to meet new European laws. All manufacturers around the globe are going to be affected by this change. The text provides specific results from the thirty company NEMI project activities. It contains integrated and fully documented book chapters with references to existing published work in the area. These serve as tremendous resources for engineers and companies faced with making the switch to Pb-free solder assembly.
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Publisher :
ISBN 13 :
Total Pages : 232 pages
Book Rating : 4.:/5 (3 download)
Download or read book SIPRE Report written by and published by . This book was released on 1973 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Frank Suli
Publisher : Woodhead Publishing
ISBN 13 : 008102391X
Total Pages : 490 pages
Book Rating : 4.0/5 (81 download)
Download or read book Electronic Enclosures, Housings and Packages written by Frank Suli and published by Woodhead Publishing. This book was released on 2018-11-01 with total page 490 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions.
Author : David A. Dillard
Publisher : Elsevier
ISBN 13 : 1845698053
Total Pages : 654 pages
Book Rating : 4.8/5 (456 download)
Download or read book Advances in Structural Adhesive Bonding written by David A. Dillard and published by Elsevier. This book was released on 2010-03-31 with total page 654 pages. Available in PDF, EPUB and Kindle. Book excerpt: Adhesive bonding is often effective, efficient, and often necessary way to join mechanical structures. This important book reviews the most recent improvements in adhesive bonding and their wide-ranging potential in structural engineering.Part one reviews advances in the most commonly used groups of structural adhesives with chapters covering topics such as epoxy, polyurethane, silicone, cyanoacrylate, and acrylic adhesives. The second set of chapters covers the various types of adherends and pre-treatment methods for a range of structural materials such as metals, composites and plastics. Chapters in Part three analyse methods and techniques with topics on joint design, life prediction, fracture mechanics and testing. The final group of chapters gives useful and practical insights into the problems and solutions of adhesive bonding in a variety of hostile environments such as chemical, wet and extreme temperatures.With its distinguished editor and international team of contributors, Advances in structural adhesive bonding is a standard reference for structural and chemical engineers in industry and the academic sector. - Reviews advances in the most commonly used groups of structural adhesives including epoxy, silicone and acrylic adhesives - Examines key issues in adhesive selection featuring substrate compatibility and manufacturing demands - Documents advances in bonding metals, plastics and composites recognising problems and limitations
Author : C. P. Wong
Publisher : Elsevier
ISBN 13 : 1483289397
Total Pages : 676 pages
Book Rating : 4.4/5 (832 download)
Download or read book Polymers for Electronic & Photonic Application written by C. P. Wong and published by Elsevier. This book was released on 2013-10-22 with total page 676 pages. Available in PDF, EPUB and Kindle. Book excerpt: The most recent advances in the use of polymeric materials by the electronic industry can be found in Polymers for Electronic and Photonic Applications. This bookprovides in-depth coverage of photoresis for micro-lithography, microelectronic encapsulants and packaging, insulators, dielectrics for multichip packaging,electronic and photonic applications of polymeric materials, among many other topics. Intended for engineers and scientists who design, process, and manufacturemicroelectronic components, this book will also prove useful for hybrid and systems packaging managers who want to be informed of the very latest developments inthis field.* Presents most recent advances in the use of polymeric materials by the electronic industry* Contributions by foremost experts in the field
Author : John H. Lau
Publisher : Springer Science & Business Media
ISBN 13 : 9780442002602
Total Pages : 504 pages
Book Rating : 4.0/5 (26 download)
Download or read book Solder Joint Reliability written by John H. Lau and published by Springer Science & Business Media. This book was released on 1991-05-31 with total page 504 pages. Available in PDF, EPUB and Kindle. Book excerpt: Looks at how solder joint reliability is influenced by flux reactions, solder paste, reflow methods, wave soldering, and cleaning. Explores failure mechanisms and includes practical methods for testing, analysis, and life prediction of solder joints subjected to conditions of fatigue, creep, stress relaxation, shock, and vibration. For engineers and designers involved in electronics packaging. Annotation copyrighted by Book News, Inc., Portland, OR
Author : Tejinder Gandhi
Publisher : ASM International
ISBN 13 : 1627082468
Total Pages : 719 pages
Book Rating : 4.6/5 (27 download)
Download or read book Microelectronics Fialure Analysis Desk Reference, Seventh Edition written by Tejinder Gandhi and published by ASM International. This book was released on 2019-11-01 with total page 719 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
Author :
Publisher : ASM International
ISBN 13 : 9780871702852
Total Pages : 1234 pages
Book Rating : 4.7/5 (28 download)
Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author : Yan Li
Publisher : Springer Nature
ISBN 13 : 9811570906
Total Pages : 629 pages
Book Rating : 4.8/5 (115 download)
Download or read book 3D Microelectronic Packaging written by Yan Li and published by Springer Nature. This book was released on 2020-11-23 with total page 629 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
Author : R. Wayne Johnson
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 :
Total Pages : 618 pages
Book Rating : 4.:/5 (319 download)
Download or read book Multichip Modules written by R. Wayne Johnson and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1991 with total page 618 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume provides the information essential for making the right decisions required for new equipment design.
Author : Hari Singh Nalwa
Publisher : Gulf Professional Publishing
ISBN 13 : 0080542115
Total Pages : 995 pages
Book Rating : 4.0/5 (85 download)
Download or read book Supramolecular Photosensitive and Electroactive Materials written by Hari Singh Nalwa and published by Gulf Professional Publishing. This book was released on 2001-05-21 with total page 995 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the last decade, much progress has been made in these materials. This book presents a highly coherent coverage of supramolecular, photosensitive and electroactive materials, namely those that have been extensively investigated for applications in fields of electronic and photonic technologies. This extensive reference provides broad coverage of on different types of materials, their processing, spectroscopic characterization, physical properties and device applications.The implications reach from molecular recognition in synthetic and natural complexes to exciting new applications in chemical technologies, materials, nanostructures, functional materials, new generation catalysts, signal transducers, medical and biomedical applications and novel separation techniques. All these applications rely on supramolecular properties such as molecular recognition, molecular information, and tailored molecular assemblies.This book is aimed to present a highly coherent coverage of supramolecular, photosenstive and electroactive materials and their applications in electronic and photonic technologies. The research behind these materials constitute some of the most actively pursued fields of science.Key Features* Covers supramolecular photosensitive and electroactive materials* Provides recent developments on metallophthalocyanines and polydiacetylenes* Include various types of supramolecular materials, their processing, fabrication, physical properties and device applications* Role of polyimides in microelectronic and tribology* Describes Photosynthetic and respiratory proteins, Dendrimers* A very special topic presented in a timely manner and in a format
Author : Michael Pecht
Publisher : John Wiley & Sons
ISBN 13 : 9780471594468
Total Pages : 470 pages
Book Rating : 4.5/5 (944 download)
Download or read book Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines written by Michael Pecht and published by John Wiley & Sons. This book was released on 1994-03-31 with total page 470 pages. Available in PDF, EPUB and Kindle. Book excerpt: Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals. Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to: * Define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost * Define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data * Identify potential failure modes, sites, mechanisms, and architecture-stress interactions--PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures * Characterize materials and processes by the key controllable factors, such as types and levels of defects, variations in material properties and dimensions, and the manufacturing and assembly processes involved * Use experiment, step-stress, and accelerated methods to ensure optimum design before production begins Detailed design guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. Detailed guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. of related interest... PHYSICAL ARCHITECTURE OF VLSI SYSTEMS --Allan D. Kraus, Robert Hannemann and Michael Pecht For the professional engineer involved in the design and manufacture of products containing electronic components, here is a comprehensive handbook to the theory and methods surrounding the assembly of microelectronic and electronic components. The book focuses on computers and consumer electronic products with internal subsystems that reflect mechanical design constraints, cost limitations, and aesthetic and ergonomic concerns. Taking a total system approach to packaging, the book systematically examines: basic chip and computer architecture; design and layout; interassembly and interconnections; cooling scheme; materials selection, including ceramics, glasses, and metals; stress, vibration, and acoustics; and manufacturing and assembly technology. 1994 (0-471-53299-1) pp. SOLDERING PROCESSES AND EQUIPMENT --Michael G. Pecht This comprehensive, fundamentals first handbook outlines the soldering methods and techniques used in the manufacture of microelectronic chips and electronic circuit boards. In a clear, easy-to-access format, the book discusses: soldering processes and classification; the material dynamics of heat soldering when assembling differing materials; wave and reflow soldering; controlling contamination during manufacturing cleanings; techniques for assuring reliability and quality control during manufacturing; rework, repair, and manual assembly; the modern assembly / repair station; and more. The book also provides clear guidelines on assembly techniques as well as an appendix of various solder equipment manufacturers. 1993 (0-471-59167-X) 312 pp.
