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Author :
Publisher :
ISBN 13 : 9780818627279
Total Pages : 181 pages
Book Rating : 4.6/5 (272 download)
Download or read book Proceedings, 1992 IEEE Multi-Chip Module Conference, MCMC-92 written by and published by . This book was released on 1992 with total page 181 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Sriram Dasu
Publisher : Springer Science & Business Media
ISBN 13 : 9401113904
Total Pages : 290 pages
Book Rating : 4.4/5 (11 download)
Download or read book Management of Design written by Sriram Dasu and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt: Product design significantly influences product cost and quality, as well as market share and profitability of a firm. Design projects often involve many people belonging to different functional areas and in many organizations several design projects may be under way at the same time. Due to this complexity, management of design has given rise to a rich set of research problems in management and engineering. In this volume, design is considered as the planning and specification activity prior to fabrication. Design determines what products will be produced, how they will be produced, and when they will be introduced into the market. The quality of the products and the speed with which they are developed are significantly affected by the design process. The design process by which a product is developed is determined by the managerial and engineering practices, tools and techniques. This book presents engineering and management perspectives on design. Topics covered include: Decomposition of product development projects; Tools and techniques for preliminary evaluation of designs; Interface between design and manufacturing, assembly and distribution; Design information flows, and Determination of the scope, timing and duration of projects, and the allocation of resources.
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Publisher : IEEE Computer Society
ISBN 13 : 9780818635427
Total Pages : 203 pages
Book Rating : 4.6/5 (354 download)
Download or read book 1993 IEEE Multi-Chip Module Conference, MCMC-93 written by and published by IEEE Computer Society. This book was released on 1993 with total page 203 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Ray T. Chen
Publisher : SPIE-International Society for Optical Engineering
ISBN 13 :
Total Pages : 476 pages
Book Rating : 4.F/5 ( download)
Download or read book Optoelectronic Interconnects and Packaging written by Ray T. Chen and published by SPIE-International Society for Optical Engineering. This book was released on 1996 with total page 476 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Author : IEEE
Publisher :
ISBN 13 :
Total Pages : 210 pages
Book Rating : 4.3/5 (91 download)
Download or read book Multi-Chip Module Conference written by IEEE and published by . This book was released on 1992 with total page 210 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : R.R. Tummala
Publisher : Springer Science & Business Media
ISBN 13 : 1461560373
Total Pages : 1060 pages
Book Rating : 4.4/5 (615 download)
Download or read book Microelectronics Packaging Handbook written by R.R. Tummala and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 1060 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Author : Society for Experimental Mechanics (U.S.)
Publisher :
ISBN 13 : 9780912053486
Total Pages : 974 pages
Book Rating : 4.0/5 (534 download)
Download or read book Proceedings of the 13th International Modal Analysis Conference written by Society for Experimental Mechanics (U.S.) and published by . This book was released on 1995 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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ISBN 13 :
Total Pages : 880 pages
Book Rating : 4.:/5 (31 download)
Download or read book WESCON ... Conference Record written by and published by . This book was released on 1992 with total page 880 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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Publisher :
ISBN 13 :
Total Pages : 256 pages
Book Rating : 4.3/5 (91 download)
Download or read book Proceedings written by and published by . This book was released on 1995 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher : IEEE Computer Society
ISBN 13 : 9780818669705
Total Pages : 233 pages
Book Rating : 4.6/5 (697 download)
Download or read book Proceedings, 1995 IEEE Multi-Chip Module Conference, January 31-February 2, 1995, Santa Cruz, California written by and published by IEEE Computer Society. This book was released on 1994 with total page 233 pages. Available in PDF, EPUB and Kindle. Book excerpt: The IEEE Multi-Chip Module Conference (MCMC) brings together elements of packaging technology and design, circuits and system design, computer-aided design, modeling, analysis, and education. The proceedings of MCMC'95 comprise papers and posters on manufacturing issues, applications, field programm
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Publisher :
ISBN 13 :
Total Pages : 2264 pages
Book Rating : 4.3/5 (91 download)
Download or read book Cumulative Book Index written by and published by . This book was released on 1995 with total page 2264 pages. Available in PDF, EPUB and Kindle. Book excerpt: A world list of books in the English language.
Author : John H. Lau
Publisher : McGraw-Hill Professional Publishing
ISBN 13 :
Total Pages : 600 pages
Book Rating : 4.3/5 (91 download)
Download or read book Flip Chip Technologies written by John H. Lau and published by McGraw-Hill Professional Publishing. This book was released on 1996 with total page 600 pages. Available in PDF, EPUB and Kindle. Book excerpt: A guide to flip chip technologies, for professionals in flip chip and MCM research and development, and for engineers and technical managers choosing design and manufacturing processes for electronic packaging and interconnect systems. Discusses economic, design, material, quality, and reliability issues of flip chip technologies, and details aspects of classical solder-bumped flip chip interconnect technologies; the next generations of flip chip technologies; and known-good-die testing for multiple module applications. Annotation copyright by Book News, Inc., Portland, OR
Author : Edmond J. Murphy
Publisher : CRC Press
ISBN 13 : 1000146804
Total Pages : 482 pages
Book Rating : 4.0/5 (1 download)
Download or read book Integrated Optical Circuits and Components written by Edmond J. Murphy and published by CRC Press. This book was released on 2020-08-27 with total page 482 pages. Available in PDF, EPUB and Kindle. Book excerpt: Updates the advancements made in the level of achievable integration of optical circuits and components in the last ten years--highlighting the commercial success of particular devices as well as introducing multiple facets of integrated optics.
Author :
Publisher :
ISBN 13 :
Total Pages : 426 pages
Book Rating : 4.3/5 (91 download)
Download or read book IEEE/CHMT International Electronic Manufacturing Technology Symposium written by and published by . This book was released on 1993 with total page 426 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : British Library. Document Supply Centre
Publisher :
ISBN 13 :
Total Pages : 938 pages
Book Rating : 4.3/5 (91 download)
Download or read book Index of Conference Proceedings written by British Library. Document Supply Centre and published by . This book was released on 1997 with total page 938 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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Publisher : Conference
ISBN 13 :
Total Pages : 1032 pages
Book Rating : 4.:/5 (318 download)
Download or read book Proceedings, International Test Conference 1995 written by and published by Conference. This book was released on 1995 with total page 1032 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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ISBN 13 :
Total Pages : 1832 pages
Book Rating : 4.3/5 (91 download)
Download or read book American Book Publishing Record written by and published by . This book was released on 1992 with total page 1832 pages. Available in PDF, EPUB and Kindle. Book excerpt:
