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Preventing Thermal Cycling And Vibration Failures In Electronic Equipment
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Book Synopsis Preventing Thermal Cycling and Vibration Failures in Electronic Equipment by : Dave S. Steinberg
Download or read book Preventing Thermal Cycling and Vibration Failures in Electronic Equipment written by Dave S. Steinberg and published by Wiley-Interscience. This book was released on 2001-07-11 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book deals with the packaging of electronic equipment to prevent damage from vibration and exposure to large variations in temperature.
Book Synopsis Preventing Thermal Cycling and Vibration Failures in Electronic Equipment by : Steinberg
Download or read book Preventing Thermal Cycling and Vibration Failures in Electronic Equipment written by Steinberg and published by . This book was released on 2002-02-01 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Vibration Analysis for Electronic Equipment by : Dave S. Steinberg
Download or read book Vibration Analysis for Electronic Equipment written by Dave S. Steinberg and published by Wiley-Interscience. This book was released on 2000-07-11 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book deals with the analysis of various types of vibration environments that can lead to the failure of electronic systems or components.
Book Synopsis Structural Dynamics of Electronic and Photonic Systems by : Ephraim Suhir
Download or read book Structural Dynamics of Electronic and Photonic Systems written by Ephraim Suhir and published by John Wiley & Sons. This book was released on 2011-04-04 with total page 610 pages. Available in PDF, EPUB and Kindle. Book excerpt: The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components’ level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice.
Book Synopsis Cooling Techniques for Electronic Equipment by : Dave S. Steinberg
Download or read book Cooling Techniques for Electronic Equipment written by Dave S. Steinberg and published by Wiley-Interscience. This book was released on 1991-10-22 with total page 518 pages. Available in PDF, EPUB and Kindle. Book excerpt: Details infallible techniques for designing electronic hardware to withstand severe thermal environments. Using both SI and English units throughout, it presents methods for the development of various reliable electronic systems without the need of high-speed computers. It also offers mathematical modeling applications, using analog resistor networks, to provide the breakup of complex systems into numerous individual thermal resistors and nodes for those who prefer high-speed digital computer solutions to thermal problems.
Book Synopsis Solder Joint Reliability Prediction for Multiple Environments by : Andrew E. Perkins
Download or read book Solder Joint Reliability Prediction for Multiple Environments written by Andrew E. Perkins and published by Springer Science & Business Media. This book was released on 2008-12-16 with total page 202 pages. Available in PDF, EPUB and Kindle. Book excerpt: Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.
Book Synopsis Practical Guide to the Packaging of Electronics by : Ali Jamnia
Download or read book Practical Guide to the Packaging of Electronics written by Ali Jamnia and published by CRC Press. This book was released on 2016-12-01 with total page 335 pages. Available in PDF, EPUB and Kindle. Book excerpt: Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or quality engineer, the book addresses engineering issues involved in electronics packaging and provides the basics needed to design a new system or troubleshoot a current one. Updated to reflect recent developments in the field, this latest edition adds two new chapters on acoustic and reliability fundamentals, and contains more information on electrical failures and causes. It also includes tools for understanding heat transfer, shock, and vibration. Additionally, the author: Addresses various cross-discipline issues in the design of electromechanical products Provides a solid foundation for heat transfer, vibration, and life expectancy calculations Identifies reliability issues and concerns Develops the ability to conduct a more thorough analysis for the final design Includes design tips and guidelines for each aspect of electronics packaging Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition explains the mechanical and thermal/fluid aspects of electronic product design and offers a basic understanding of electronics packaging design issues. Defining the material in-depth, it also describes system design guidelines and identifies reliability concerns for practitioners in mechanical, – electrical or quality engineering.
Book Synopsis High Temperature Electronics by : F. Patrick McCluskey
Download or read book High Temperature Electronics written by F. Patrick McCluskey and published by CRC Press. This book was released on 1996-12-13 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Book Synopsis Electromagnetic Shielding and Corrosion Protection for Aerospace Vehicles by : Jan W. Gooch
Download or read book Electromagnetic Shielding and Corrosion Protection for Aerospace Vehicles written by Jan W. Gooch and published by Springer Science & Business Media. This book was released on 2010-04-28 with total page 133 pages. Available in PDF, EPUB and Kindle. Book excerpt: In this book, original and comprehensive studies discuss shielding effectiveness as related to conductivity, and the relationship of material chemistry to conductivity and corrosion are demonstrated. It is explained how to optimize shielding effectiveness for aircraft and other vehicles. Electrically conductive corrosion prevention materials capable of maintaining EMI/EMP protection of aircraft and weapon systems are identified.
Book Synopsis Mechanical Analysis of Electronic Packaging Systems by : Mckeown
Download or read book Mechanical Analysis of Electronic Packaging Systems written by Mckeown and published by CRC Press. This book was released on 1999-04-06 with total page 382 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."
Book Synopsis Practical Guide to the Packaging of Electronics, Second Edition by : Ali Jamnia
Download or read book Practical Guide to the Packaging of Electronics, Second Edition written by Ali Jamnia and published by CRC Press. This book was released on 2008-12-01 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt: As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively updated, includes more detail where needed, and provides additional segments for clarification. This volume supplies a solid foundation for heat transfer, vibration, and life expectancy calculations. Topics discussed include various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; shock management; mechanical, electrical, and chemically induced reliability; and more. Unlike many other available works, it neither assumes the reader’s familiarity with the subject nor is it so basic that the reader may lose interest. Dr. Ali Jamnia has published a large number of engineering papers and presentations and is the holder of a number of patents and patent applications. He has been involved in the issues of electronics packaging since the early ‘90s and since 1995 has worked toward the development of innovative electronics systems to aid individuals with physical or cognitive disabilities. By consulting this manual, engineers, program managers, and quality assurance managers involved in electronic systems gain a fundamental grasp of the issues involved in electronics packaging, learn how to define guidelines for a system’s design, develop the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design.
Book Synopsis Bodies at Risk by : Elizabeth E. Wheatley
Download or read book Bodies at Risk written by Elizabeth E. Wheatley and published by Ashgate Publishing, Ltd.. This book was released on 2006-01-01 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Bodies at Risk, Elizabeth Wheatley provides a fascinating ethnography of heart disease. As heart disease is one of the major causes of death in the western world, this book is both timely and important. It is inspired by, and contributes to, sociological writing on the body, risk, experiences of illness, and medicalization, and will appeal to academics and students in these areas as well as in cultural studies, health-related consumption, health promotion and qualitative health research.
Book Synopsis Electric Drives and Their Controls by : Richard M. Crowder
Download or read book Electric Drives and Their Controls written by Richard M. Crowder and published by Oxford University Press, USA. This book was released on 1995 with total page 264 pages. Available in PDF, EPUB and Kindle. Book excerpt: This work explains how to size, select and implement an industrial drive system. The author offers a practical but structured approach which places particular emphasis on smaller drive systems. Examples are given from the machine tool and robotics industries.
Book Synopsis AI Techniques for Reliability Prediction for Electronic Components by : Bhargava, Cherry
Download or read book AI Techniques for Reliability Prediction for Electronic Components written by Bhargava, Cherry and published by IGI Global. This book was released on 2019-12-06 with total page 330 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the industry of manufacturing and design, one major constraint has been enhancing operating performance using less time. As technology continues to advance, manufacturers are looking for better methods in predicting the condition and residual lifetime of electronic devices in order to save repair costs and their reputation. Intelligent systems are a solution for predicting the reliability of these components; however, there is a lack of research on the advancements of this smart technology within the manufacturing industry. AI Techniques for Reliability Prediction for Electronic Components provides emerging research exploring the theoretical and practical aspects of prediction methods using artificial intelligence and machine learning in the manufacturing field. Featuring coverage on a broad range of topics such as data collection, fault tolerance, and health prognostics, this book is ideally designed for reliability engineers, electronic engineers, researchers, scientists, students, and faculty members seeking current research on the advancement of reliability analysis using AI.
Book Synopsis Fundamentals of Lead-Free Solder Interconnect Technology by : Tae-Kyu Lee
Download or read book Fundamentals of Lead-Free Solder Interconnect Technology written by Tae-Kyu Lee and published by Springer. This book was released on 2014-11-05 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
Book Synopsis Multiphysics Simulation by : Ercan M. Dede
Download or read book Multiphysics Simulation written by Ercan M. Dede and published by Springer. This book was released on 2014-05-28 with total page 225 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book highlights a unique combination of numerical tools and strategies for handling the challenges of multiphysics simulation, with a specific focus on electromechanical systems as the target application. Features: introduces the concept of design via simulation, along with the role of multiphysics simulation in today’s engineering environment; discusses the importance of structural optimization techniques in the design and development of electromechanical systems; provides an overview of the physics commonly involved with electromechanical systems for applications such as electronics, magnetic components, RF components, actuators, and motors; reviews the governing equations for the simulation of related multiphysics problems; outlines relevant (topology and parametric size) optimization methods for electromechanical systems; describes in detail several multiphysics simulation and optimization example studies in both two and three dimensions, with sample numerical code.
Download or read book Failure Analysis written by Marius Bazu and published by John Wiley & Sons. This book was released on 2011-03-08 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt: Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
