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Modeling And Optimization For High Speed Links And 3d Ic
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Book Synopsis Machine Learning-based Design and Optimization of High-Speed Circuits by : Vazgen Melikyan
Download or read book Machine Learning-based Design and Optimization of High-Speed Circuits written by Vazgen Melikyan and published by Springer Nature. This book was released on 2024-01-31 with total page 351 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes machine learning-based new principles, methods of design and optimization of high-speed integrated circuits, included in one electronic system, which can exchange information between each other up to 128/256/512 Gbps speed. The efficiency of methods has been proven and is described on the examples of practical designs. This will enable readers to use them in similar electronic system designs. The author demonstrates newly developed principles and methods to accelerate communication between ICs, working in non-standard operating conditions, considering signal deviation compensation with linearity self-calibration. The observed circuit types also include but are not limited to mixed-signal, high performance heterogeneous integrated circuits as well as digital cores.
Book Synopsis 3D Interconnect Architectures for Heterogeneous Technologies by : Lennart Bamberg
Download or read book 3D Interconnect Architectures for Heterogeneous Technologies written by Lennart Bamberg and published by Springer Nature. This book was released on 2022-06-27 with total page 403 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.
Book Synopsis 3D Integration in VLSI Circuits by : Katsuyuki Sakuma
Download or read book 3D Integration in VLSI Circuits written by Katsuyuki Sakuma and published by CRC Press. This book was released on 2018-04-17 with total page 211 pages. Available in PDF, EPUB and Kindle. Book excerpt: Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.
Book Synopsis Physical Design for 3D Integrated Circuits by : Aida Todri-Sanial
Download or read book Physical Design for 3D Integrated Circuits written by Aida Todri-Sanial and published by CRC Press. This book was released on 2017-12-19 with total page 409 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Book Synopsis 3D Stacked Chips by : Ibrahim (Abe) M. Elfadel
Download or read book 3D Stacked Chips written by Ibrahim (Abe) M. Elfadel and published by Springer. This book was released on 2016-05-11 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.
Book Synopsis Material-Integrated Intelligent Systems by : Stefan Bosse
Download or read book Material-Integrated Intelligent Systems written by Stefan Bosse and published by John Wiley & Sons. This book was released on 2018-03-12 with total page 696 pages. Available in PDF, EPUB and Kindle. Book excerpt: Combining different perspectives from materials science, engineering, and computer science, this reference provides a unified view of the various aspects necessary for the successful realization of intelligent systems. The editors and authors are from academia and research institutions with close ties to industry, and are thus able to offer first-hand information here. They adopt a unique, three-tiered approach such that readers can gain basic, intermediate, and advanced topical knowledge. The technology section of the book is divided into chapters covering the basics of sensor integration in materials, the challenges associated with this approach, data processing, evaluation, and validation, as well as methods for achieving an autonomous energy supply. The applications part then goes on to showcase typical scenarios where material-integrated intelligent systems are already in use, such as for structural health monitoring and smart textiles.
Book Synopsis Design for High Performance, Low Power, and Reliable 3D Integrated Circuits by : Sung Kyu Lim
Download or read book Design for High Performance, Low Power, and Reliable 3D Integrated Circuits written by Sung Kyu Lim and published by Springer Science & Business Media. This book was released on 2012-11-27 with total page 573 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.
Book Synopsis Wireless Interface Technologies for 3D IC and Module Integration by : Tadahiro Kuroda
Download or read book Wireless Interface Technologies for 3D IC and Module Integration written by Tadahiro Kuroda and published by Cambridge University Press. This book was released on 2021-09-30 with total page 337 pages. Available in PDF, EPUB and Kindle. Book excerpt: Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.
Book Synopsis Co-simulations of Microwave Circuits and High-Frequency Electromagnetic Fields by : Mei Song Tong
Download or read book Co-simulations of Microwave Circuits and High-Frequency Electromagnetic Fields written by Mei Song Tong and published by Springer Nature. This book was released on with total page 461 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Wireless Radio-Frequency Standards and System Design: Advanced Techniques by : Cornetta, Gianluca
Download or read book Wireless Radio-Frequency Standards and System Design: Advanced Techniques written by Cornetta, Gianluca and published by IGI Global. This book was released on 2012-01-31 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt: Radio-frequency (RF) integrated circuits in CMOS technology are gaining increasing popularity in the commercial world, and CMOS technology has become the dominant technology for applications such as GPS receivers, GSM cellular transceivers, wireless LAN, and wireless short-range personal area networks based on IEEE 802.15.1 (Bluetooth) or IEEE 802.15.4 (ZigBee) standards. Furthermore, the increasing interest in wireless technologies and the widespread of wireless communications has prompted an ever increasing demand for radio frequency transceivers. Wireless Radio-Frequency Standards and System Design: Advanced Techniques provides perspectives on radio-frequency circuit and systems design, covering recent topics and developments in the RF area. Exploring topics such as LNA linearization, behavioral modeling and co-simulation of analog and mixed-signal complex blocks for RF applications, integrated passive devices for RF-ICs and baseband design techniques and wireless standards, this is a comprehensive reference for students as well as practicing professionals.
Book Synopsis Integrated Circuit and System Design. Power and Timing Modeling, Optimization and Simulation by : Jose L. Ayala
Download or read book Integrated Circuit and System Design. Power and Timing Modeling, Optimization and Simulation written by Jose L. Ayala and published by Springer Science & Business Media. This book was released on 2011-09-15 with total page 362 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 21st International Conference on Integrated Circuit and System Design, PATMOS 2011, held in Madrid, Spain, in September 2011. The 34 revised full papers presented were carefully reviewed and selected from numerous submissions. The paper feature emerging challenges in methodologies and tools for the design of upcoming generations of integrated circuits and systems and focus especially on timing, performance and power consumption as well as architectural aspects with particular emphasis on modeling, design, characterization, analysis and optimization.
Book Synopsis Arbitrary Modeling of TSVs for 3D Integrated Circuits by : Khaled Salah
Download or read book Arbitrary Modeling of TSVs for 3D Integrated Circuits written by Khaled Salah and published by Springer. This book was released on 2014-08-21 with total page 181 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
Book Synopsis Design Automation of Cyber-Physical Systems by : Mohammad Abdullah Al Faruque
Download or read book Design Automation of Cyber-Physical Systems written by Mohammad Abdullah Al Faruque and published by Springer. This book was released on 2019-05-09 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the state-of-the-art and breakthrough innovations in design automation for cyber-physical systems.The authors discuss various aspects of cyber-physical systems design, including modeling, co-design, optimization, tools, formal methods, validation, verification, and case studies. Coverage includes a survey of the various existing cyber-physical systems functional design methodologies and related tools will provide the reader unique insights into the conceptual design of cyber-physical systems.
Book Synopsis High Performance Computing for Big Data by : Chao Wang
Download or read book High Performance Computing for Big Data written by Chao Wang and published by CRC Press. This book was released on 2017-10-16 with total page 287 pages. Available in PDF, EPUB and Kindle. Book excerpt: High-Performance Computing for Big Data: Methodologies and Applications explores emerging high-performance architectures for data-intensive applications, novel efficient analytical strategies to boost data processing, and cutting-edge applications in diverse fields, such as machine learning, life science, neural networks, and neuromorphic engineering. The book is organized into two main sections. The first section covers Big Data architectures, including cloud computing systems, and heterogeneous accelerators. It also covers emerging 3D IC design principles for memory architectures and devices. The second section of the book illustrates emerging and practical applications of Big Data across several domains, including bioinformatics, deep learning, and neuromorphic engineering. Features Covers a wide range of Big Data architectures, including distributed systems like Hadoop/Spark Includes accelerator-based approaches for big data applications such as GPU-based acceleration techniques, and hardware acceleration such as FPGA/CGRA/ASICs Presents emerging memory architectures and devices such as NVM, STT- RAM, 3D IC design principles Describes advanced algorithms for different big data application domains Illustrates novel analytics techniques for Big Data applications, scheduling, mapping, and partitioning methodologies Featuring contributions from leading experts, this book presents state-of-the-art research on the methodologies and applications of high-performance computing for big data applications. About the Editor Dr. Chao Wang is an Associate Professor in the School of Computer Science at the University of Science and Technology of China. He is the Associate Editor of ACM Transactions on Design Automations for Electronics Systems (TODAES), Applied Soft Computing, Microprocessors and Microsystems, IET Computers & Digital Techniques, and International Journal of Electronics. Dr. Chao Wang was the recipient of Youth Innovation Promotion Association, CAS, ACM China Rising Star Honorable Mention (2016), and best IP nomination of DATE 2015. He is now on the CCF Technical Committee on Computer Architecture, CCF Task Force on Formal Methods. He is a Senior Member of IEEE, Senior Member of CCF, and a Senior Member of ACM.
Book Synopsis Computer Engineering and Technology by : Weixia Xu
Download or read book Computer Engineering and Technology written by Weixia Xu and published by Springer. This book was released on 2016-01-13 with total page 197 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 19th CCF Conference on Computer Engineering and Technology, NCCET 2015, held in Hefei, China, in October 2015. The 18 papers presented were carefully reviewed and selected from 158 submissions. They are organized in topical sections on processor architecture; application specific processors; computer application and software optimization; technology on the horizon.
Book Synopsis Space Microelectronics Volume 2: Integrated Circuit Design for Space Applications by : Anatoly Belous
Download or read book Space Microelectronics Volume 2: Integrated Circuit Design for Space Applications written by Anatoly Belous and published by Artech House. This book was released on 2017-07-31 with total page 629 pages. Available in PDF, EPUB and Kindle. Book excerpt: This invaluable second volume of a two-volume set is filled with details about the integrated circuit design for space applications. Various considerations for the selection and application of electronic components for designing spacecraft are discussed. The basic constructions of submicron transistors and schottky diodes during the technological process of production are explored. This book provides details on the energy consumption minimization methods for microelectronic devices. Specific topics include: Features and physical mechanisms of the effect of space radiation on all the main classes of microcircuits, including peculiarities of radiation impact on submicron integrated circuits;Special design, technology, and schematic methods of increasing the resistance to various types of space radiation;Recommendations for choosing research equipment and methods for irradiating various samples;Microcircuit designers on the composition of test elements for the study of the effect of radiation;Microprocessors, circuit boards, logic microcircuits, digital, analog, digital–analog microcircuits manufactured in various technologies (bipolar, CMOS, BiCMOS, SOI);Problems involved with designing high speed microelectronic devices and systems based on SOS-and SOI-structures;System-on-chip and system-in-package and methods for rejection of silicon microcircuits with hidden defects during mass production.
Book Synopsis Circuits at the Nanoscale by : Krzysztof Iniewski
Download or read book Circuits at the Nanoscale written by Krzysztof Iniewski and published by CRC Press. This book was released on 2018-10-08 with total page 669 pages. Available in PDF, EPUB and Kindle. Book excerpt: Circuits for Emerging Technologies Beyond CMOS New exciting opportunities are abounding in the field of body area networks, wireless communications, data networking, and optical imaging. In response to these developments, top-notch international experts in industry and academia present Circuits at the Nanoscale: Communications, Imaging, and Sensing. This volume, unique in both its scope and its focus, addresses the state-of-the-art in integrated circuit design in the context of emerging systems. A must for anyone serious about circuit design for future technologies, this book discusses emerging materials that can take system performance beyond standard CMOS. These include Silicon on Insulator (SOI), Silicon Germanium (SiGe), and Indium Phosphide (InP). Three-dimensional CMOS integration and co-integration with Microelectromechanical (MEMS) technology and radiation sensors are described as well. Topics in the book are divided into comprehensive sections on emerging design techniques, mixed-signal CMOS circuits, circuits for communications, and circuits for imaging and sensing. Dr. Krzysztof Iniewski is a director at CMOS Emerging Technologies, Inc., a consulting company in Vancouver, British Columbia. His current research interests are in VLSI ciruits for medical applications. He has published over 100 research papers in international journals and conferences, and he holds 18 international patents granted in the United States, Canada, France, Germany, and Japan. In this volume, he has assembled the contributions of over 60 world-reknown experts who are at the top of their field in the world of circuit design, advancing the bank of knowledge for all who work in this exciting and burgeoning area.
