Microelectronic Applications Of Chemical Mechanical Planarization

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Microelectronic Applications of Chemical Mechanical Planarization

Author : Yuzhuo Li
Publisher : John Wiley & Sons
ISBN 13 : 9780470180891
Total Pages : 760 pages
Book Rating : 4.1/5 (88 download)

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Book Synopsis Microelectronic Applications of Chemical Mechanical Planarization by : Yuzhuo Li

Download or read book Microelectronic Applications of Chemical Mechanical Planarization written by Yuzhuo Li and published by John Wiley & Sons. This book was released on 2007-12-04 with total page 760 pages. Available in PDF, EPUB and Kindle. Book excerpt: An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.

Chemical Mechanical Planarization of Microelectronic Materials

Author : Joseph M. Steigerwald
Publisher : John Wiley & Sons
ISBN 13 : 3527617752
Total Pages : 337 pages
Book Rating : 4.5/5 (276 download)

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Book Synopsis Chemical Mechanical Planarization of Microelectronic Materials by : Joseph M. Steigerwald

Download or read book Chemical Mechanical Planarization of Microelectronic Materials written by Joseph M. Steigerwald and published by John Wiley & Sons. This book was released on 2008-09-26 with total page 337 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.

Advances in Chemical Mechanical Planarization (CMP)

Author : Babu Suryadevara
Publisher : Woodhead Publishing
ISBN 13 : 0128218193
Total Pages : 650 pages
Book Rating : 4.1/5 (282 download)

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Book Synopsis Advances in Chemical Mechanical Planarization (CMP) by : Babu Suryadevara

Download or read book Advances in Chemical Mechanical Planarization (CMP) written by Babu Suryadevara and published by Woodhead Publishing. This book was released on 2021-09-10 with total page 650 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including post-CMP

Chemical Mechanical Planarization in IC Device Manufacturing III

Author : Robert Leon Opila
Publisher : The Electrochemical Society
ISBN 13 : 9781566772600
Total Pages : 664 pages
Book Rating : 4.7/5 (726 download)

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Book Synopsis Chemical Mechanical Planarization in IC Device Manufacturing III by : Robert Leon Opila

Download or read book Chemical Mechanical Planarization in IC Device Manufacturing III written by Robert Leon Opila and published by The Electrochemical Society. This book was released on 2000 with total page 664 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume contains the proceedings of the third international symposium on Chemical Mechanical Planarization integrated circuit device manufacturing held at the 196th Meeting of the Electrochemical Society in Honolulu, Hawaii. ( October 20 -22 1999).

Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication

Author : Jianfeng Luo
Publisher : Springer Science & Business Media
ISBN 13 : 3662079283
Total Pages : 327 pages
Book Rating : 4.6/5 (62 download)

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Book Synopsis Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication by : Jianfeng Luo

Download or read book Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication written by Jianfeng Luo and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 327 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process.

Chemical Mechanical Planarization for Microelectronics Applications

Author : Parshuram B. Zantye
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (177 download)

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Book Synopsis Chemical Mechanical Planarization for Microelectronics Applications by : Parshuram B. Zantye

Download or read book Chemical Mechanical Planarization for Microelectronics Applications written by Parshuram B. Zantye and published by . This book was released on 2004 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Chemical-Mechanical Planarization: Volume 767

Author : Duane S. Boning
Publisher :
ISBN 13 :
Total Pages : 376 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Chemical-Mechanical Planarization: Volume 767 by : Duane S. Boning

Download or read book Chemical-Mechanical Planarization: Volume 767 written by Duane S. Boning and published by . This book was released on 2003-08-27 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical-mechanical planarization (CMP) has emerged as a critical fabrication technology for advanced integrated circuits. Even as the applications of CMP have diversified and we have begun to understand aspects of the physics and chemistry of the process, a new generation of CMP innovations is unfolding. New slurries and consumables are under development. New applications to novel devices continue to appear. This book, the most recent in a successful series on CMP, offers a review of the advances to date and provides a comprehensive discussion of the future challenges that must be overcome. Presentations from academia, government labs and industry are featured. Topics include; CMP modeling; CMP science; CMP slurries and particles for planarization of copper, oxide, and other materials; planarization applications including shallow trench isolation (STI), copper damascene, and novel devices and CMP integration.

Chemical-Mechanical Planarization: Volume 867

Author : A. Kumar
Publisher :
ISBN 13 :
Total Pages : 330 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Chemical-Mechanical Planarization: Volume 867 by : A. Kumar

Download or read book Chemical-Mechanical Planarization: Volume 867 written by A. Kumar and published by . This book was released on 2005-07-19 with total page 330 pages. Available in PDF, EPUB and Kindle. Book excerpt: Technology requirements associated with the progressive scaling of devices for future technology nodes, coupled with the aggressive introduction of new materials, places tremendous demands on chemical-mechanical polishing. The goal of this 2005 book, which is part of a popular series from MRS, is to bring together experts from a broad spectrum of research and technology groups currently working on CMP, to review advances made, and to offer a comprehensive discussion of future challenges that must be overcome. The book shows trends in the development of consumables, process modules, tool designs, process integration, modeling, defect characterization, and metrology. Topics include: planarization processes and applications; consumables -CMP pads and slurries; CMP equipment and metrology; and CMP modeling and simulation.

Chemical-Mechanical Planarization of Semiconductor Materials

Author : M.R. Oliver
Publisher : Springer
ISBN 13 : 9783642077388
Total Pages : 428 pages
Book Rating : 4.0/5 (773 download)

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Book Synopsis Chemical-Mechanical Planarization of Semiconductor Materials by : M.R. Oliver

Download or read book Chemical-Mechanical Planarization of Semiconductor Materials written by M.R. Oliver and published by Springer. This book was released on 2010-12-01 with total page 428 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Chemical Mechanical Polishing in Silicon Processing

Author :
Publisher : Academic Press
ISBN 13 : 0080864619
Total Pages : 325 pages
Book Rating : 4.0/5 (88 download)

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Book Synopsis Chemical Mechanical Polishing in Silicon Processing by :

Download or read book Chemical Mechanical Polishing in Silicon Processing written by and published by Academic Press. This book was released on 1999-10-29 with total page 325 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since its inception in 1966, the series of numbered volumes known as Semiconductors and Semimetals has distinguished itself through the careful selection of well-known authors, editors, and contributors. The Willardson and Beer series, as it is widely known, has succeeded in producing numerous landmark volumes and chapters. Not only did many of these volumes make an impact at the time of their publication, but they continue to be well-cited years after their original release. Recently, Professor Eicke R. Weber of the University of California at Berkeley joined as a co-editor of the series. Professor Weber, a well-known expert in the field of semiconductor materials, will further contribute to continuing the series' tradition of publishing timely, highly relevant, and long-impacting volumes. Some of the recent volumes, such as Hydrogen in Semiconductors, Imperfections in III/V Materials, Epitaxial Microstructures, High-Speed Heterostructure Devices, Oxygen in Silicon, and others promise that this tradition will be maintained and even expanded. Reflecting the truly interdisciplinary nature of the field that the series covers, the volumes in Semiconductors and Semimetals have been and will continue to be of great interest to physicists, chemists, materials scientists, and device engineers in modern industry.

Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication

Author : Jianfeng Luo
Publisher : Springer
ISBN 13 : 9783662079294
Total Pages : 311 pages
Book Rating : 4.0/5 (792 download)

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Book Synopsis Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication by : Jianfeng Luo

Download or read book Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication written by Jianfeng Luo and published by Springer. This book was released on 2014-03-12 with total page 311 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process.

Chemical Mechanical Planarization Of Microelectronic Materials

Author : J.M. Steigerwald
Publisher :
ISBN 13 :
Total Pages : 0 pages
Book Rating : 4.:/5 (14 download)

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Book Synopsis Chemical Mechanical Planarization Of Microelectronic Materials by : J.M. Steigerwald

Download or read book Chemical Mechanical Planarization Of Microelectronic Materials written by J.M. Steigerwald and published by . This book was released on with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Introduction to Microfabrication

Author : Sami Franssila
Publisher : John Wiley & Sons
ISBN 13 : 0470020563
Total Pages : 424 pages
Book Rating : 4.4/5 (7 download)

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Book Synopsis Introduction to Microfabrication by : Sami Franssila

Download or read book Introduction to Microfabrication written by Sami Franssila and published by John Wiley & Sons. This book was released on 2005-01-28 with total page 424 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microfabrication is the key technology behind integrated circuits,microsensors, photonic crystals, ink jet printers, solar cells andflat panel displays. Microsystems can be complex, but the basicmicrostructures and processes of microfabrication are fairlysimple. Introduction to Microfabrication shows how the commonmicrofabrication concepts can be applied over and over again tocreate devices with a wide variety of structures andfunctions. Featuring: * A comprehensive presentation of basic fabrication processes * An emphasis on materials and microstructures, rather than devicephysics * In-depth discussion on process integration showing how processes,materials and devices interact * A wealth of examples of both conceptual and real devices Introduction to Microfabrication includes 250 homework problems forstudents to familiarise themselves with micro-scale materials,dimensions, measurements, costs and scaling trends. Both researchand manufacturing topics are covered, with an emphasis on silicon,which is the workhorse of microfabrication. This book will serve as an excellent first text for electricalengineers, chemists, physicists and materials scientists who wishto learn about microstructures and microfabrication techniques,whether in MEMS, microelectronics or emerging applications.

Tribology In Chemical-Mechanical Planarization

Author : Hong Liang
Publisher : CRC Press
ISBN 13 : 1420028391
Total Pages : 199 pages
Book Rating : 4.4/5 (2 download)

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Book Synopsis Tribology In Chemical-Mechanical Planarization by : Hong Liang

Download or read book Tribology In Chemical-Mechanical Planarization written by Hong Liang and published by CRC Press. This book was released on 2005-03-01 with total page 199 pages. Available in PDF, EPUB and Kindle. Book excerpt: Illustrating their intersecting role in manufacturing and technological development, this book examines tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects as well as friction, lubrication fundamentals, and the basics of wear. The book concludes its focus with mechanical aspects of CMP, pad materials, elastic modulus, and cell buckling. As the first source to integrate CMP and tribology, Tribology in Chemical-Mechanical Planarization provides applied scientists and engineers in the fields of semiconductors and microelectronics with clear foresight to the future of this technology.

High Dielectric Constant Materials

Author : Howard Huff
Publisher : Springer Science & Business Media
ISBN 13 : 9783540210818
Total Pages : 740 pages
Book Rating : 4.2/5 (18 download)

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Book Synopsis High Dielectric Constant Materials by : Howard Huff

Download or read book High Dielectric Constant Materials written by Howard Huff and published by Springer Science & Business Media. This book was released on 2005 with total page 740 pages. Available in PDF, EPUB and Kindle. Book excerpt: Issues relating to the high-K gate dielectric are among the greatest challenges for the evolving International Technology Roadmap for Semiconductors (ITRS). More than just an historical overview, this book will assess previous and present approaches related to scaling the gate dielectric and their impact, along with the creative directions and forthcoming challenges that will define the future of gate dielectric scaling technology. Topics include: an extensive review of Moore's Law, the classical regime for SiO2 gate dielectrics; the transition to silicon oxynitride gate dielectrics; the transition to high-K gate dielectrics (including the drive towards equivalent oxide thickness in the single-digit nanometer regime); and future directions and issues for ultimate technology generation scaling. The vision, wisdom, and experience of the team of authors will make this book a timely, relevant, and interesting, resource focusing on fundamentals of the 45 nm Technology Generation and beyond.

Chemical Mechanical Planarization of Microelectronic Materials

Author : Joseph M. Steigerwald
Publisher : John Wiley & Sons
ISBN 13 : 9780471138273
Total Pages : 354 pages
Book Rating : 4.1/5 (382 download)

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Book Synopsis Chemical Mechanical Planarization of Microelectronic Materials by : Joseph M. Steigerwald

Advances in CMP Polishing Technologies

Author : Toshiro Doi
Publisher : William Andrew
ISBN 13 : 1437778593
Total Pages : 330 pages
Book Rating : 4.4/5 (377 download)

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Book Synopsis Advances in CMP Polishing Technologies by : Toshiro Doi

Download or read book Advances in CMP Polishing Technologies written by Toshiro Doi and published by William Andrew. This book was released on 2011-12-06 with total page 330 pages. Available in PDF, EPUB and Kindle. Book excerpt: CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan